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ST10F276Z5T3

STMicroelectronics

ST10F276Z5T3 by STMicroelectronics

STMicroelectronics' ST10F276Z5T3 is a 16-bit microcontroller with a max clock frequency of 8 MHz. It features 24 address bus width, 2048 bytes of RAM, and flash ROM programmability. This automotive-grade microcontroller offers connectivity options like ASC, CAN, I2C, and SSC for various applications.

Median Price

$42.360

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$42.360

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-

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60

$42.360

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Vyrian

USA . 7,339 parts In-Stock

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-

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7,339

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Chip Stock

USA . 3,295 parts In-Stock

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3,295

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Bristol Electronics

USA . 3,237 parts In-Stock

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3,237

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-

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Anansix

USA . 2,138 parts In-Stock

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2,138

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Digiode

USA . 1,670 parts In-Stock

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1,670

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$7.960

100+ parts

-

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346

$7.960

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Semicontronic

India . 724 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

1k+ parts

$9.700

10k+ parts

-

724

$10.000

$9.750

$9.700

-

Ampacity Inc.

Singapore . 915 parts In-Stock

1+ parts

$29.000

100+ parts

-

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915

$29.000

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Aztec Data Supply Inc.

USA . 239 parts In-Stock

1+ parts

$29.440

100+ parts

-

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239

$29.440

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Modulus Dynamics

Lithuania . 2,456 parts In-Stock

1+ parts

$42.360

100+ parts

$42.360

1k+ parts

$42.360

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-

2,456

$42.360

$42.360

$42.360

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Corohmni

South Africa . 219 parts In-Stock

1+ parts

$42.360

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219

$42.360

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Continental Prestige Electronics

USA . 1,402 parts In-Stock

1+ parts

$42.360

100+ parts

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10k+ parts

$41.513

1,402

$42.360

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-

$41.513

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$43.631

100+ parts

$41.449

1k+ parts

$41.449

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5,000

$43.631

$41.449

$41.449

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$66.281

100+ parts

-

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$59.653

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1,185

$66.281

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$59.653

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MKK Technologies

India . 1,949 parts In-Stock

1+ parts

$124.638

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1,949

$124.638

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DigiPath Technology Company

USA . 1,949 parts In-Stock

1+ parts

$124.638

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1,949

$124.638

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Microchip USA

USA . 304 parts In-Stock

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$205.368

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304

$205.368

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Lixinc

USA . 17,119 parts In-Stock

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17,119

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Kepictronics

USA . 9,000 parts In-Stock

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9,000

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Corphita

USA . 4,746 parts In-Stock

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4,746

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Argo Parts USA

USA . 4,137 parts In-Stock

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4,137

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Emar International I/E

Canada . 3,600 parts In-Stock

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3,600

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Robosynatics

Brazil . 2,059 parts In-Stock

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2,059

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Lucentia Tech

USA . 2,059 parts In-Stock

1+ parts

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100+ parts

$41.513

1k+ parts

$40.666

10k+ parts

$40.666

2,059

-

$41.513

$40.666

$40.666

Parana Technologies

USA . 401 parts In-Stock

1+ parts

-

100+ parts

$79.250

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401

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$79.250

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Overview

Discover the ST10F276Z5T3 by STMicroelectronics, a high-quality microcontroller that offers unparalleled advantages in its category. With STMicroelectronics' reputation for excellence and innovation, you can trust that this product is built to exceed your expectations. Ideal for automotive applications, this microcontroller provides exceptional performance and reliability. Unlocking a world of possibilities, it features advanced peripherals such as PWM, RTC, TIMER, and WDT, ensuring seamless connectivity and functionality. With its compact design and impressive specifications, the ST10F276Z5T3 is the ultimate solution for your microcontroller needs. Experience the value and benefits it brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding too much weight.

Maximum Supply Voltage: 5.5 V

Can withstand higher voltage inputs, providing flexibility and robustness in different operating conditions.

Package Shape: SQUARE

Square shape allows for easy mounting on PCBs, saving space and making it easier to integrate into smaller devices.

Bit Size: 16

16-bit processing offers improved performance and precision compared to lower bit sizes, suitable for complex tasks and calculations.

ROM Words: 212992

Large ROM capacity allows for storing a significant amount of program data, enabling the microcontroller to handle more complex programs and functions.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh automotive environments, ensuring reliable performance in temperature variations and rugged conditions.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to convert analog signals to digital data, expanding its capabilities in sensor-based applications.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple communication interfaces allow for easy integration into various systems and networks, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers ST10F276Z5T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

212992

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F276Z5T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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