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ST10F271Z1T3

STMicroelectronics

ST10F271Z1T3 by STMicroelectronics

STMicroelectronics ST10F271Z1T3 is a 16-bit microcontroller with 24-bit address bus, operating at up to 40 MHz. Ideal for automotive applications, it features 12288 bytes of RAM, 131072 ROM words, and ADC channels for precise data acquisition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,651 parts In-Stock

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7,651

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Anansix

USA . 521 parts In-Stock

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521

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Digiode

USA . 466 parts In-Stock

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466

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 593 parts In-Stock

1+ parts

$14.120

100+ parts

-

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593

$14.120

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Ampacity Inc.

Singapore . 809 parts In-Stock

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$19.000

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-

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809

$19.000

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Corohmni

South Africa . 134 parts In-Stock

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$50.736

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134

$50.736

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IDEA Electronic Components Group

UK . 1,068 parts In-Stock

1+ parts

$52.138

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$46.924

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1,068

$52.138

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$46.924

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Microchip USA

USA . 262 parts In-Stock

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$54.750

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262

$54.750

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MKK Technologies

India . 1,986 parts In-Stock

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$98.043

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1,986

$98.043

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DigiPath Technology Company

USA . 1,986 parts In-Stock

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$98.043

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1,986

$98.043

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QUARKTWIN TECHNOLOGY LTD

USA . 13,320 parts In-Stock

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13,320

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Continental Prestige Electronics

USA . 3,969 parts In-Stock

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3,969

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Corphita

USA . 2,949 parts In-Stock

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Argo Parts USA

USA . 2,215 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 911 parts In-Stock

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$62.339

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911

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$62.339

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Overview

Unleash the power of innovation with the ST10F271Z1T3 microcontroller from STMicroelectronics. Boasting top-notch quality and cutting-edge technology, this microcontroller opens up a world of possibilities in various applications. With its high performance and reliability, customers can trust in the value and benefits that this product brings to their projects. Whether you're designing automotive systems, industrial control equipment, or consumer electronics, the ST10F271Z1T3 delivers unmatched advantages that set it apart from the competition. Elevate your designs to the next level with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the microcontroller suitable for various applications without adding much weight.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Can handle a relatively high maximum supply voltage, offering flexibility in power supply options.

Address Bus Width: 24

Wide address bus width enables the microcontroller to access a larger memory space, facilitating complex operations and data handling.

Package Shape: SQUARE

Square package shape is efficient for space utilization on the PCB, maximizing component density.

Bit Size: 16

16-bit architecture allows for efficient data processing and operations, suitable for a wide range of applications.

No. of Terminals: 144

Ample terminals provide numerous connectivity options for peripherals and external components, enhancing the versatility of the microcontroller.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures compatibility with a variety of power sources, enabling reliable operation in different environments.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range makes the microcontroller suitable for automotive and industrial applications where extreme temperatures may be encountered.

CPU Family: ST10

Part of the ST10 CPU family known for performance and reliability, ensuring efficient processing and operation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the microcontroller to function reliably in harsh environments with extreme cold temperatures.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, expanding the microcontroller's capabilities in monitoring and processing analog signals.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, reducing the chances of signal interference or disconnection.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data and instructions, supporting complex applications and functionality.

Maximum Seated Height: 1.6 mm

Low seated height is beneficial for compact designs and space-constrained applications, offering flexibility in PCB layout.

Width: 20 mm

Standard width size enables easy integration into existing PCB designs and layouts, simplifying the overall system design.

External Data Bus Width: 16

16-bit external data bus width facilitates efficient data transfer between the microcontroller and external peripherals, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for fast processing speeds and responsive system performance, suitable for real-time applications.

Length: 20 mm

Compact length size saves space on the PCB, accommodating smaller form factor designs without compromising functionality.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive environments with temperature fluctuations, making it suitable for automotive applications.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, offering integrated peripherals and functions tailored for control and processing tasks, simplifying system design and integration.

RAM Bytes: 12288

Large RAM capacity provides ample memory space for data storage and processing, facilitating multitasking and complex computations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall reliability and efficiency of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form ensures secure solder connections during PCB assembly, reducing the risk of solder joint failures and ensuring long-term reliability.

Nominal Supply Voltage: 5 V

Stable nominal voltage ensures consistent and reliable operation of the microcontroller, supporting uninterrupted performance in various applications.

PWM Channels: YES

Built-in PWM channels enable precise control of analog signals, facilitating tasks such as motor control, dimming, and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for quick and easy updates to the program code, enabling flexibility and adaptability in application development and maintenance.

Terminal Pitch: 0.5 mm

Fine terminal pitch offers high-density mounting options, allowing for compact PCB layouts and efficient use of space.

Speed: 40 rpm

High processing speed of 40 rpm enables rapid data processing and task execution, enhancing system performance and responsiveness.

No. of I/O Lines: 111

Abundant I/O lines provide extensive connectivity options for interfacing with external devices and components, expanding the microcontroller's functionality and versatility.

Technical Specifications

Microcontrollers ST10F271Z1T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

ST10F271Z1T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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