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ST10F166AQ6

STMicroelectronics

ST10F166AQ6 by STMicroelectronics

STMicroelectronics ST10F166AQ6 is a 16-bit microcontroller with 8192 ROM words and 1024 RAM bytes. It operates at temperatures ranging from -40 to 85 °C, suitable for industrial applications. Featuring 10-Ch 10-Bit ADCs, USART(2) connectivity, and TIMER(5) peripherals, it is ideal for embedded systems requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,542 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,542

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-

-

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Digiode

USA . 846 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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846

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Anansix

USA . 388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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388

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,688 parts In-Stock

1+ parts

$66.034

100+ parts

-

1k+ parts

$59.431

10k+ parts

-

1,688

$66.034

-

$59.431

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MKK Technologies

India . 2,146 parts In-Stock

1+ parts

$124.172

100+ parts

-

1k+ parts

-

10k+ parts

-

2,146

$124.172

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DigiPath Technology Company

USA . 2,146 parts In-Stock

1+ parts

$124.172

100+ parts

-

1k+ parts

-

10k+ parts

-

2,146

$124.172

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-

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Corphita

USA . 2,991 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,991

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-

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Parana Technologies

USA . 204 parts In-Stock

1+ parts

-

100+ parts

$78.954

1k+ parts

-

10k+ parts

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204

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$78.954

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-

Overview

Elevate your projects with the ST10F166AQ6 microcontroller from STMicroelectronics. Designed with precision and reliability in mind, this top-of-the-line product offers a wide range of applications in various industries. With its advanced technology and high-quality components, customers can trust in the performance and efficiency of this microcontroller. Experience seamless connectivity and unmatched functionality with the ST10F166AQ6, setting new standards for innovation and success in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time during production and reducing overall costs.

Bit Size: 16

Offers decent processing power for handling complex algorithms and calculations efficiently.

Power Supplies (V): 5

Operates on a common and easily accessible voltage, making it compatible with a wide range of power sources.

No. of Terminals: 100

Provides ample connectivity options for interfacing with various external devices and peripherals.

Package Style (Meter): FLATPACK

Ensures easy installation and space-saving design, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Allows the microcontroller to function in harsh environments without the risk of overheating or performance degradation.

CPU Family: 80166

Belongs to a well-established and reliable family of processors, ensuring compatibility and stable performance.

RAM Bytes: 1024

Sufficient memory for storing data and variables, enhancing the microcontroller's capability to process tasks efficiently.

Technology: CMOS

Offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Analog To Digital Convertors: 10-Ch 10-Bit

Facilitates accurate conversion of analog signals to digital data, essential for sensing and control applications.

Nominal Supply Voltage: 5 V

Operates on a stable and standard voltage, ensuring compatibility with a wide range of electronic components and systems.

ROM Programmability: FLASH

Enables easy and fast reprogramming of the microcontroller's memory, allowing for flexible and adaptable firmware updates.

Technical Specifications

Microcontrollers ST10F166AQ6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

16

CPU Family:

80166

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e0

No. of Terminals:

100

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

240 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Data EEPROM Size:

0

Connectivity:

USART(2)

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST10F166AQ6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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