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ST10C167-Q6/XX

STMicroelectronics

ST10C167-Q6/XX by STMicroelectronics

STMicroelectronics' ST10C167-Q6/XX microcontroller features 16-bit CPU, 24-bit address bus, and 16-bit external data bus. With a max clock frequency of 50 MHz, it is ideal for industrial applications requiring high-speed processing and control capabilities. The device operates in a temperature range from -40 °C to 85°C and offers 4096 bytes of RAM for efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,870 parts In-Stock

1+ parts

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2,870

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Digiode

USA . 2,564 parts In-Stock

1+ parts

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1k+ parts

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2,564

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Vyrian

USA . 172 parts In-Stock

1+ parts

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172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,205 parts In-Stock

1+ parts

$52.880

100+ parts

-

1k+ parts

$47.592

10k+ parts

-

1,205

$52.880

-

$47.592

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MKK Technologies

India . 1,775 parts In-Stock

1+ parts

$99.437

100+ parts

-

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10k+ parts

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1,775

$99.437

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DigiPath Technology Company

USA . 1,775 parts In-Stock

1+ parts

$99.437

100+ parts

-

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-

1,775

$99.437

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Corphita

USA . 643 parts In-Stock

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643

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Parana Technologies

USA . 242 parts In-Stock

1+ parts

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100+ parts

$63.226

1k+ parts

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242

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$63.226

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Overview

Revolutionize your electronics projects with the ST10C167-Q6/XX microcontroller by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics is a trusted name in the industry. This powerful microcontroller is perfect for a wide range of applications, offering high performance and efficiency. Say goodbye to limitations and unlock endless possibilities with this versatile product. Experience the exceptional value, benefits, and advantages that the ST10C167-Q6/XX brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY packages are lightweight, durable, and cost-effective, making them suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and enabling higher component density.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in usage scenarios.

Address Bus Width: 24

A wider address bus allows for accessing a larger memory space, enabling more complex and feature-rich applications.

Bit Size: 16

The 16-bit architecture provides a good balance between processing power and energy efficiency, suitable for a variety of tasks.

Power Supplies (V): 5

Operating at a standard 5V supply voltage makes integration with existing systems easier and simplifies power management.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options and potential for interfacing with various devices and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and efficient heat dissipation, making it suitable for compact and thermally constrained applications.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, the microcontroller can operate efficiently in low-power modes while maintaining stability.

Maximum Operating Temperature: 85 °C

Being rated for a high operating temperature range ensures reliability and performance in demanding environmental conditions.

CPU Family: ST10

Belonging to the ST10 CPU family signifies compatibility with a proven and reliable architecture, providing a solid foundation for software development.

Minimum Operating Temperature: -40 °C

The microcontroller can operate at extremely low temperatures, making it suitable for use in harsh environments or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish offers excellent corrosion resistance and ensures reliable electrical connections over an extended period.

ADC Channels: YES

Having ADC channels enables analog input capabilities, allowing the microcontroller to interface with sensors and analog devices.

Terminal Position: QUAD

The quad-terminal position enhances mechanical stability and simplifies PCB layout, improving overall reliability.

ROM Words: 16384

With a larger ROM capacity, the microcontroller can store more program code and data, enabling complex algorithms and applications.

Maximum Seated Height: 4.07 mm

The low seated height profile makes the microcontroller suitable for slim and compact designs, saving space in the overall system.

Width: 28 mm

The compact width dimension allows for efficient PCB layout and integration into space-constrained applications.

External Data Bus Width: 16

The 16-bit external data bus width enables high-speed data transfer and efficient communication with external memory and peripherals.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency provides processing speed for demanding tasks, ensuring optimal performance in real-time applications.

Length: 28 mm

The compact length dimension complements the width, allowing for space-efficient placement on a PCB and in the overall system design.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliability and performance in rugged environments typically found in industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates various peripherals and features on a single chip, offering a cost-effective and space-efficient solution for embedded systems.

RAM Bytes: 4096

Having a reasonable amount of RAM allows for efficient data storage and manipulation, supporting multitasking and complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller suitable for battery-operated and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and easy solderability, ensuring reliable connections during manufacturing and operation.

Maximum Supply Current: 195 mA

The moderate supply current requirement allows for efficient power management and extends battery life in portable or energy-conscious applications.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage simplifies power supply design and compatibility with existing systems and components.

PWM Channels: YES

Having PWM channels enables precise control of analog signals, facilitating tasks such as motor control, LED dimming, and audio modulation.

ROM Programmability: MROM

MROM (Mask ROM) provides fixed program code storage, ensuring data integrity and security, making it ideal for applications requiring read-only memory.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for high-density mounting, enabling compact PCB designs and reducing overall system footprint.

Speed: 25 rpm

The specified speed parameter is likely related to a specific operation or peripheral feature of the microcontroller, indicating its capability to meet certain performance requirements.

No. of I/O Lines: 111

Having a high number of I/O lines provides versatile connectivity options and interfaces for external devices, enabling extensive system integration.

Technical Specifications

Microcontrollers ST10C167-Q6/XX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

4.07 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10C167-Q6/XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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