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ST10F166CQ6

STMicroelectronics

ST10F166CQ6 by STMicroelectronics

STMicroelectronics ST10F166CQ6 is a 16-bit microcontroller with 8192 ROM words and 1024 RAM bytes. It operates at temperatures ranging from -40 to 85 °C, suitable for industrial applications. Featuring USART connectivity, it offers 10-Ch 10-Bit ADCs and TIMER(5) peripherals for versatile usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,652

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-

-

-

Anansix

USA . 2,819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,819

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-

-

-

Vyrian

USA . 1,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,412

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,755 parts In-Stock

1+ parts

$74.092

100+ parts

-

1k+ parts

$66.683

10k+ parts

-

1,755

$74.092

-

$66.683

-

MKK Technologies

India . 542 parts In-Stock

1+ parts

$139.326

100+ parts

-

1k+ parts

-

10k+ parts

-

542

$139.326

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-

-

DigiPath Technology Company

USA . 542 parts In-Stock

1+ parts

$139.326

100+ parts

-

1k+ parts

-

10k+ parts

-

542

$139.326

-

-

-

Corphita

USA . 3,053 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,053

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-

-

-

Parana Technologies

USA . 1,921 parts In-Stock

1+ parts

-

100+ parts

$88.588

1k+ parts

-

10k+ parts

-

1,921

-

$88.588

-

-

Overview

Unlock endless possibilities with the ST10F166CQ6 microcontroller by STMicroelectronics. Boasting top-notch quality and reliability from a trusted manufacturer, this device is perfect for a wide range of applications in industries like automotive, industrial control, and consumer electronics. With its advanced features, including 16-bit processing power, multiple peripherals, and flash ROM programmability, this microcontroller offers unparalleled value, performance, and efficiency to customers looking to take their projects to the next level. Upgrade your designs with the ST10F166CQ6 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, making it suitable for a variety of operating conditions.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle complex calculations and data processing efficiently.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this microcontroller is easy to integrate into existing systems and power supplies.

No. of Terminals: 100

Having 100 terminals allows for a wide range of connectivity options and peripherals to be connected to the microcontroller.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can withstand high-temperature environments.

ROM Words: 8192

With a ROM capacity of 8192 words, this microcontroller can store a significant amount of program data and instructions.

RAM Bytes: 1024

Having 1024 bytes of RAM enables the microcontroller to efficiently handle data storage and manipulation during operation.

Analog To Digital Convertors: 10-Ch 10-Bit

The presence of 10-channel 10-bit ADCs allows for accurate analog signal conversion, making this microcontroller suitable for sensor interfacing.

Connectivity: USART(2)

With USART connectivity options, this microcontroller can communicate effectively with other devices and peripherals in a serial communication setup.

Speed: 12 rpm

Operating at a speed of 12 rpm, this microcontroller can process instructions and data quickly, enabling fast response times in control applications.

Technical Specifications

Microcontrollers ST10F166CQ6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

16

CPU Family:

80166

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e0

No. of Terminals:

100

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Data EEPROM Size:

0

Connectivity:

USART(2)

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST10F166CQ6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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