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ST10F269Z2Q6

STMicroelectronics

ST10F269Z2Q6 by STMicroelectronics

STMicroelectronics ST10F269Z2Q6 microcontroller features 16-bit CPU with 24-bit address bus, 262144 ROM words, and 12288 RAM bytes. Operating at up to 80 MHz with PWM channels, it is ideal for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,671 parts In-Stock

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4,671

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Digiode

USA . 1,774 parts In-Stock

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1,774

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Anansix

USA . 1,390 parts In-Stock

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1,390

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Chip Stock

USA . 525 parts In-Stock

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525

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ComSIT Distribution GmbH

Germany . 96 parts In-Stock

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96

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 981 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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-

981

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$6.377

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223

$6.377

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Ampacity Inc.

Singapore . 194 parts In-Stock

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$25.000

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194

$25.000

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IDEA Electronic Components Group

UK . 1,414 parts In-Stock

1+ parts

$43.920

100+ parts

-

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$39.528

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1,414

$43.920

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$39.528

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Corohmni

South Africa . 286 parts In-Stock

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$78.937

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286

$78.937

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MKK Technologies

India . 1,191 parts In-Stock

1+ parts

$82.588

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1,191

$82.588

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DigiPath Technology Company

USA . 1,191 parts In-Stock

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$82.588

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$82.588

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Aztec Data Supply Inc.

USA . 168 parts In-Stock

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$84.730

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168

$84.730

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Microchip USA

USA . 323 parts In-Stock

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$159.710

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323

$159.710

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S.R.D Solutions

India . 18,040 parts In-Stock

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Lixinc

USA . 17,281 parts In-Stock

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Corphita

USA . 4,637 parts In-Stock

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Argo Parts USA

USA . 3,932 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,145 parts In-Stock

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Parana Technologies

USA . 1,761 parts In-Stock

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$52.513

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Kepictronics

USA . 1,721 parts In-Stock

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Perfect Parts

USA . 885 parts In-Stock

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Futuretech Components

Singapore . 100 parts In-Stock

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Bastille Electronics

Australia . 66 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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iodParts Technologies Inc.

India . 15 parts In-Stock

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Continental Prestige Electronics

USA . 4 parts In-Stock

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Overview

Unlock the power of innovation with the ST10F269Z2Q6 microcontroller by STMicroelectronics. Crafted with precision and expertise, this versatile device is designed to revolutionize your applications with its cutting-edge technology and reliable performance. Whether you're creating smart home devices, automotive systems, or industrial automation solutions, this microcontroller offers unparalleled value, efficiency, and flexibility to bring your ideas to life. Trust STMicroelectronics to deliver excellence in every aspect, and let the ST10F269Z2Q6 elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of industrial applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards, providing efficient PCB design.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of input voltage, offering flexibility in power supply options.

Address Bus Width: 24

A wider address bus allows for larger memory addressing capabilities, suitable for complex programs and data storage.

Bit Size: 16

A 16-bit architecture offers enhanced processing capabilities and efficiency for various applications.

Power Supplies (V): 5

Operates efficiently on a standard 5V supply, making it compatible with common power sources.

No. of Terminals: 144

With a high number of terminals, this microcontroller can support numerous input and output connections for versatile functionality.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments with varying temperature conditions.

CPU Family: ST10

Being part of the ST10 family ensures compatibility, reliability, and performance that are characteristic of this processor lineup.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to interface with analog sensors and signals, expanding its application capabilities.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program instructions and data for complex applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, providing dedicated processing power and features tailored for embedded systems.

RAM Bytes: 12288

A generous amount of RAM enables efficient data storage and manipulation, supporting smooth operation of applications.

Technical Specifications

Microcontrollers ST10F269Z2Q6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10F269Z2Q6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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