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ST10F166AQ7

STMicroelectronics

ST10F166AQ7 by STMicroelectronics

STMicroelectronics ST10F166AQ7 is a 16-bit microcontroller with 8192 ROM words and 1024 RAM bytes. It operates at temperatures ranging from -40 to 105 °C, suitable for industrial applications. Featuring 10-Ch 10-Bit ADCs, USART(2) connectivity, and TIMER(5) peripherals, it is ideal for embedded systems requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,472 parts In-Stock

1+ parts

-

100+ parts

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2,472

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Vyrian

USA . 2,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,087

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Digiode

USA . 315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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315

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$24.425

100+ parts

-

1k+ parts

$21.983

10k+ parts

-

616

$24.425

-

$21.983

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MKK Technologies

India . 1,209 parts In-Stock

1+ parts

$45.930

100+ parts

-

1k+ parts

-

10k+ parts

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1,209

$45.930

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DigiPath Technology Company

USA . 1,209 parts In-Stock

1+ parts

$45.930

100+ parts

-

1k+ parts

-

10k+ parts

-

1,209

$45.930

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Corphita

USA . 2,483 parts In-Stock

1+ parts

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2,483

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Parana Technologies

USA . 135 parts In-Stock

1+ parts

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100+ parts

$29.204

1k+ parts

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135

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$29.204

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Overview

Discover the ST10F166AQ7 by STMicroelectronics, a high-quality microcontroller that offers unmatched value and performance. With its advanced technology and industrial-grade temperature range, this device is perfect for a wide range of applications. Whether you're working on robotics, automotive systems, or industrial control, this microcontroller's 16-bit capabilities, extensive peripherals, and flash ROM programmability will help you achieve your goals efficiently and effectively. Trust STMicroelectronics to deliver reliable, cutting-edge solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good mechanical strength and insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and improving overall manufacturing process.

Bit Size: 16

With a 16-bit architecture, this microcontroller can process data with higher precision and efficiency, making it suitable for a wide range of applications.

Power Supplies (V): 5

Operating at 5V nominal supply voltage ensures compatibility with standard power sources and simplifies integration into existing systems.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options and interfaces, enabling the microcontroller to interface with various external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor, saving space and allowing for denser PCB designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the microcontroller can withstand harsh environmental conditions and maintain performance under stress.

CPU Family: 80166

Belonging to the 80166 CPU family indicates compatibility with a well-established and widely used architecture, ensuring support and resources are readily available.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the microcontroller to function reliably in cold environments without performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and ensures robust connections, facilitating ease of assembly and reliability.

ROM Words: 8192

With 8192 ROM words, the microcontroller can store a significant amount of program instructions, enabling complex functionality and versatility in applications.

Peripherals: TIMER(5), WDT

The inclusion of 5 timers and a watchdog timer (WDT) enhances the microcontroller's capabilities for precise timing functions and system monitoring, improving overall performance and safety.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the microcontroller meets stringent temperature and reliability requirements, making it suitable for demanding environments.

RAM Bytes: 1024

With 1024 RAM bytes, the microcontroller can efficiently handle data storage and processing tasks, enabling quick access to information and smooth operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and stable operation of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable electrical contact and robust mechanical strength.

Analog To Digital Convertors: 10-Ch 10-Bit

Featuring 10-channel 10-bit ADCs, the microcontroller can efficiently convert analog signals into digital data, enabling precise measurement and control in various applications.

Maximum Supply Current: 240 mA

Operating at a maximum supply current of 240mA allows the microcontroller to maintain stability and performance under loading conditions, ensuring reliable operation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V simplifies power management and compatibility with standard voltage levels, making integration into existing systems straightforward.

Connectivity: USART(2)

Featuring 2 USART interfaces, the microcontroller offers versatile connectivity options for serial communication, enabling seamless integration with other devices and systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware and software, enabling quick iteration and customization of functionalities without requiring additional hardware.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635mm, the microcontroller offers fine-pitch connections for precise and compact PCB layouts, optimizing space usage and enabling high-density designs.

Speed: 20 rpm

Operating at a speed of 20rpm, the microcontroller can process instructions and data efficiently, enabling fast execution of tasks and responsive performance.

On Chip Program ROM Width: 32

With a program ROM width of 32, the microcontroller can accommodate a wide range of instructions and data, providing flexibility and scalability for diverse applications.

Technical Specifications

Microcontrollers ST10F166AQ7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

16

CPU Family:

80166

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e0

No. of Terminals:

100

On Chip Program ROM Width:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

240 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Data EEPROM Size:

0

Connectivity:

USART(2)

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST10F166AQ7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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