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ST10F276Z5Q3

STMicroelectronics

ST10F276Z5Q3 by STMicroelectronics

ST10F276Z5Q3 by STMicroelectronics is a 16-bit microcontroller with 24-bit address bus width, operating at max 8 MHz. Ideal for automotive applications, it features 24-Ch 10-Bit ADC channels, PWM(8), RTC, TIMER(5), WDT peripherals and connectivity options like ASC(2), CAN(2), I2C, SSC(2).

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,739 parts In-Stock

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8,739

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Digiode

USA . 4,392 parts In-Stock

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4,392

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Anansix

USA . 1,649 parts In-Stock

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1,649

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Chip Stock

USA . 625 parts In-Stock

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625

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Global Solutions Electronics Company

USA . 131 parts In-Stock

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-

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131

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Nova Conductors

Japan . 91 parts In-Stock

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-

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 809 parts In-Stock

1+ parts

$6.255

100+ parts

-

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809

$6.255

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Semicontronic

India . 1,309 parts In-Stock

1+ parts

$23.000

100+ parts

$22.425

1k+ parts

$22.310

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-

1,309

$23.000

$22.425

$22.310

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Ampacity Inc.

Singapore . 688 parts In-Stock

1+ parts

$31.000

100+ parts

-

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688

$31.000

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IDEA Electronic Components Group

UK . 408 parts In-Stock

1+ parts

$35.734

100+ parts

-

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$32.160

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-

408

$35.734

-

$32.160

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Corohmni

South Africa . 156 parts In-Stock

1+ parts

$63.441

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-

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156

$63.441

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MKK Technologies

India . 850 parts In-Stock

1+ parts

$67.195

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850

$67.195

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DigiPath Technology Company

USA . 850 parts In-Stock

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$67.195

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850

$67.195

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Aztec Data Supply Inc.

USA . 305 parts In-Stock

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$72.060

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305

$72.060

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Microchip USA

USA . 369 parts In-Stock

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$612.766

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369

$612.766

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Continental Prestige Electronics

USA . 3,505 parts In-Stock

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Argo Parts USA

USA . 3,355 parts In-Stock

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Lixinc

USA . 2,755 parts In-Stock

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2,755

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Corphita

USA . 2,260 parts In-Stock

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2,260

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A-Z Elektronik GmbH

Germany . 2,132 parts In-Stock

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2,132

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Parana Technologies

USA . 350 parts In-Stock

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$42.725

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350

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$42.725

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Futuretech Components

Singapore . 120 parts In-Stock

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120

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience unparalleled performance and reliability with the ST10F276Z5Q3 microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, offering customers a value-packed solution with enhanced features and functionality. Trust STMicroelectronics for top-quality products that will elevate your projects to new heights. Choose innovation, choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and quick installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, increasing flexibility in power supply options.

Address Bus Width: 24

Supports larger memory addressing capabilities, enabling the handling of more data efficiently.

Package Shape: SQUARE

Allows for compact design and efficient use of space on the PCB.

Bit Size: 16

Offers a good balance between performance and complexity, suitable for a wide range of applications.

Power Supplies (V): 5

Standard voltage level, widely compatible with various power sources.

No. of Terminals: 144

Provides ample connection points for interfacing with external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables space-saving and efficient layout design on the PCB.

Minimum Supply Voltage: 4.5 V

Allows for operation with a lower voltage source, increasing flexibility in power management.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

CPU Family: ST10

Comes from a reputable brand known for quality and performance in microcontroller technology.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold environments, making it suitable for diverse applications.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

Terminal Position: QUAD

Facilitates easy and organized connection layout on the PCB.

ROM Words: 212992

Offers ample storage for program memory, enabling complex algorithms to be executed efficiently.

Maximum Seated Height: 1.6 mm

Low-profile design for slim and compact product form factor.

Width: 20 mm

Compact size for fitting into tight spaces and constrained designs.

External Data Bus Width: 16

Supports efficient data transfer and processing capabilities.

Peripherals: PWM(8), RTC, TIMER(5), WDT

Includes a variety of peripherals for enhanced functionality and connectivity options.

Maximum Clock Frequency: 8 MHz

Provides fast processing speeds for real-time applications and high-performance tasks.

Peak Reflow Temperature °C: 245

Can withstand high temperatures during manufacturing processes, ensuring reliability.

RAM Bytes: 2048

Sufficient random access memory for storing data and variables during program execution.

Technology: CMOS

Employs CMOS technology for low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: GULL WING

Facilitates easy soldering and secure PCB mounting.

Analog To Digital Convertors: 24-Ch 10-Bit

Multiple ADC channels with high resolution for accurate analog signal processing.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power sources, ensuring easy integration into existing systems.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of connected devices.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Offers various communication interfaces for connecting with a wide range of peripheral devices.

ROM Programmability: FLASH

Flash memory allows for easy and fast reprogramming of the ROM without removing the chip.

Terminal Pitch: 0.5 mm

Fine pitch for high-density PCB layouts and space-saving design.

Speed: 64 rpm

Capable of high-speed operation for time-sensitive applications.

On Chip Program ROM Width: 32

Wide ROM width for storing program instructions and data efficiently.

No. of I/O Lines: 111

Ample I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers ST10F276Z5Q3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

212992

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F276Z5Q3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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