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ST10C167-Q3/XX

STMicroelectronics

ST10C167-Q3/XX by STMicroelectronics

STMicroelectronics ST10C167-Q3/XX is a 16-bit microcontroller with 24-bit address bus width, operating at up to 50 MHz. Ideal for automotive applications, it features 4096 bytes of RAM, 16384 ROM words, and ADC channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,514 parts In-Stock

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4,514

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Digiode

USA . 2,207 parts In-Stock

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2,207

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Anansix

USA . 1,934 parts In-Stock

1+ parts

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1,934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 965 parts In-Stock

1+ parts

$56.428

100+ parts

-

1k+ parts

$50.785

10k+ parts

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965

$56.428

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$50.785

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MKK Technologies

India . 1,504 parts In-Stock

1+ parts

$106.110

100+ parts

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1,504

$106.110

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DigiPath Technology Company

USA . 1,504 parts In-Stock

1+ parts

$106.110

100+ parts

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1,504

$106.110

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Corphita

USA . 3,521 parts In-Stock

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3,521

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Parana Technologies

USA . 1,485 parts In-Stock

1+ parts

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100+ parts

$67.468

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1,485

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$67.468

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Overview

Elevate your automotive electronics with the ST10C167-Q3/XX microcontroller by STMicroelectronics. Designed with precision and expertise, this high-quality product offers unparalleled performance and reliability for a wide range of applications. With advanced features like ADC channels, PWM capabilities, and a fast maximum clock frequency of 50 MHz, this microcontroller is the perfect choice for demanding automotive environments. Trust in STMicroelectronics to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Surface Mount: YES

Easier and more efficient installation process, saving time and effort.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs for versatility in different applications.

Address Bus Width: 24

Allows for larger memory addressability, enabling complex programming and data handling.

Package Shape: SQUARE

Compact and space-saving design for efficient PCB layout and integration.

Bit Size: 16

Offers a good balance between processing power and energy efficiency for various tasks.

Power Supplies (V): 5

Common voltage range for compatibility with standard power sources.

No. of Terminals: 144

Sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Low profile design for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Tolerates lower voltage levels to prevent damage during power fluctuations.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ideal for industrial and automotive environments.

CPU Family: ST10

Part of a reliable and established processor family for consistent performance and compatibility.

Minimum Operating Temperature: -40 °C

Operates in extreme cold conditions without performance degradation or damage.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable electrical connections and prevents corrosion for long-term usage.

ADC Channels: YES

Built-in Analog-to-Digital Converters for measuring real-world signals accurately.

Terminal Position: QUAD

Optimal terminal configuration for efficient signal routing and PCB layout.

ROM Words: 16384

Large Read-Only Memory capacity for storing program instructions and data.

Maximum Seated Height: 4.07 mm

Slim profile for compact device design and assembly.

Width: 28 mm

Moderate width size for balancing board space utilization and component density.

External Data Bus Width: 16

Efficient data transfer between external devices and the microcontroller.

Maximum Clock Frequency: 50 MHz

High-speed processing capability for quick response times in demanding applications.

Length: 28 mm

Compact length dimension for flexible placement and integration into various systems.

Temperature Grade: AUTOMOTIVE

Certified for automotive use, ensuring reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for controlling external devices and systems efficiently.

RAM Bytes: 4096

Adequate Random Access Memory for temporary data storage and processing requirements.

Technology: CMOS

Low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

Robust terminal design for secure soldering and mechanical stability.

Maximum Supply Current: 195 mA

Efficient power usage with lower current draw for energy savings.

Nominal Supply Voltage: 5 V

Stable voltage supply for consistent performance and reliable operation.

PWM Channels: YES

Supports Pulse-Width Modulation for controlling analog circuits and devices.

ROM Programmability: MROM

Mask-Programmable Read-Only Memory for secure and permanent storage of critical data.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact layout and high-density PCB designs.

Speed: 25 rpm

Fast processing speed for real-time control and data handling applications.

No. of I/O Lines: 111

Sufficient Input/Output lines for connecting to external devices and sensors.

Technical Specifications

Microcontrollers ST10C167-Q3/XX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

4.07 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10C167-Q3/XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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