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ST10F167-Q6

STMicroelectronics

ST10F167-Q6 by STMicroelectronics

ST10F167-Q6 by STMicroelectronics is a 16-bit microcontroller with 24-bit address bus, operating at max 25 MHz. Ideal for industrial applications, it features 4096 bytes of RAM, flash ROM programmability, and ADC channels for efficient data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,282 parts In-Stock

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2,282

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Digiode

USA . 2,213 parts In-Stock

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2,213

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Vyrian

USA . 1,559 parts In-Stock

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1,559

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ABC Electronics Ltd.

UK . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,949 parts In-Stock

1+ parts

$75.675

100+ parts

-

1k+ parts

$68.107

10k+ parts

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1,949

$75.675

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$68.107

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MKK Technologies

India . 1,537 parts In-Stock

1+ parts

$142.301

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1,537

$142.301

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DigiPath Technology Company

USA . 1,537 parts In-Stock

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$142.301

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1,537

$142.301

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Corphita

USA . 4,603 parts In-Stock

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4,603

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Parana Technologies

USA . 1,312 parts In-Stock

1+ parts

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100+ parts

$90.480

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1,312

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$90.480

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Assy Fe

Spain . 1 parts In-Stock

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1

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Overview

Experience the power of innovation with the ST10F167-Q6 microcontroller by STMicroelectronics. Crafted with precision and cutting-edge technology, this device offers unrivaled performance and reliability for a wide range of applications. From industrial automation to automotive systems, this microcontroller delivers seamless operation and optimal functionality. With its advanced features and top-notch quality, the ST10F167-Q6 ensures that your projects run smoothly and efficiently. Stay ahead of the curve and unlock endless possibilities with this exceptional product from a trusted industry leader. Elevate your designs with the ST10F167-Q6 and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and reliability for the product, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving space and cost.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for versatility in power supply options, accommodating a wider range of applications.

Address Bus Width: 24

A wider address bus width allows for larger memory addressing capabilities, enabling more complex applications to be implemented.

Package Shape: SQUARE

The square package shape helps in easier handling and placement of the product on the PCB, optimizing space utilization.

Bit Size: 16

With a 16-bit size, this microcontroller can process data in larger chunks, improving efficiency and performance.

Power Supplies (V): 5

A stable power supply of 5V ensures consistent and reliable operation of the microcontroller, reducing the risk of errors or malfunctions.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and interfaces, enhancing the versatility of the product.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and compact design, ideal for space-constrained applications.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures that the microcontroller can operate within a wide range of power supply conditions, increasing its robustness.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance makes this microcontroller suitable for industrial applications where temperature variations are common.

CPU Family: ST10

The ST10 CPU family is known for its performance and reliability, making this microcontroller a trustworthy choice for various projects.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function in harsh and cold environments without compromising its performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the product.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

The quad terminal position provides easy and secure soldering connections, enhancing the overall reliability of the product.

ROM Words: 65536

With a ROM size of 65536 words, this microcontroller can store and execute a wide range of program instructions, enabling versatile functionality.

Maximum Seated Height: 4.07 mm

The low seated height allows for a compact and slim profile, making the product suitable for applications with space constraints.

Width: 28 mm

The moderate width of 28mm strikes a balance between compactness and ease of handling during assembly and integration.

External Data Bus Width: 16

A wider external data bus width of 16 bits enables faster data transfer and processing, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz allows for fast execution of instructions and operations, improving overall performance.

Length: 28 mm

The length of 28mm provides a balanced form factor for the microcontroller, optimizing space utilization on the PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller can withstand challenging environmental conditions and operate reliably in demanding settings.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and interfaces, offering a comprehensive solution for embedded system design.

RAM Bytes: 4096

With a RAM size of 4096 bytes, this microcontroller can efficiently handle data processing and storage requirements for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making this microcontroller energy-efficient and robust.

Terminal Form: GULL WING

The gull wing terminal form allows for reliable solder connections and easy PCB mounting, enhancing the overall durability of the product.

Maximum Supply Current: 220 mA

The moderate maximum supply current of 220 mA ensures efficient power usage and prevents overheating, enhancing the longevity of the microcontroller.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a standard and widely supported power level, ensuring compatibility with various systems and components.

PWM Channels: YES

The presence of PWM channels enables precise control of digital signals, making this microcontroller suitable for applications requiring signal modulation and control.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible firmware updates, enhancing the versatility and adaptability of the microcontroller.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting and compact PCB design, making this microcontroller suitable for space-constrained applications.

Speed: 25 rpm

With a speed of 25 rpm, this microcontroller can efficiently process instructions and data, ensuring smooth operation in various applications.

No. of I/O Lines: 111

Having 111 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility and functionality of the product.

Technical Specifications

Microcontrollers ST10F167-Q6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

220 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10F167-Q6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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