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ST10F168-Q2

STMicroelectronics

ST10F168-Q2 by STMicroelectronics

ST10F168-Q2 by STMicroelectronics is a 16-bit microcontroller with 24-bit address bus width, operating at up to 50 MHz. Ideal for automotive applications, it features 8192 bytes of RAM, flash ROM programmability, and 111 I/O lines for versatile connectivity.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 988 parts In-Stock

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988

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Vyrian

USA . 809 parts In-Stock

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809

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Anansix

USA . 113 parts In-Stock

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113

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IDEA Electronic Components Group

UK . 2,129 parts In-Stock

1+ parts

$34.034

100+ parts

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1k+ parts

$30.630

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2,129

$34.034

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$30.630

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MKK Technologies

India . 656 parts In-Stock

1+ parts

$63.998

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656

$63.998

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DigiPath Technology Company

USA . 656 parts In-Stock

1+ parts

$63.998

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656

$63.998

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Corphita

USA . 516 parts In-Stock

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516

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Parana Technologies

USA . 436 parts In-Stock

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$40.692

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436

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$40.692

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Overview

Unleash the power of innovation with the ST10F168-Q2 microcontroller from industry leader STMicroelectronics. This cutting-edge device offers unmatched quality and reliability, making it ideal for a wide range of applications in automotive technology, consumer electronics, and industrial automation. With advanced features and high performance, this microcontroller provides exceptional value and benefits to customers, ensuring seamless integration and superior functionality. Elevate your projects to new heights with the ST10F168-Q2 and experience the difference that top-tier technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows flexibility in power supply options and compatibility with a wide range of applications.

Address Bus Width: 24

A wide address bus width allows for increased memory addressing capabilities, essential for handling complex algorithms and data processing tasks.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB and facilitates a neat and organized layout for the overall system design.

Bit Size: 16

A 16-bit architecture offers enhanced processing capabilities and higher precision in calculations, making the microcontroller suitable for demanding tasks.

Power Supplies (V): 5

A standard power supply voltage of 5V simplifies power management and ensures compatibility with common power sources.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options, enabling the microcontroller to interface with a variety of external devices and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, making it ideal for space-constrained applications while providing good thermal dissipation characteristics.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures reliable operation even in situations where the power supply may fluctuate or drop momentarily.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand elevated temperatures without performance degradation, suitable for automotive and industrial environments.

CPU Family: ST10

Being part of the ST10 CPU family, this microcontroller offers a proven and reliable architecture with a well-established ecosystem for development and support.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making the microcontroller suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and ensures a reliable electrical connection, contributing to the overall robustness of the microcontroller.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, enabling the implementation of precise analog-to-digital conversion in the system.

Terminal Position: QUAD

Quad terminal position provides a stable and secure mounting arrangement, ensuring mechanical integrity and facilitating reliable connections in the system.

Maximum Seated Height: 4.07 mm

The low maximum seated height of the microcontroller allows for a compact overall system design, particularly important in space-constrained applications.

Width: 28 mm

The moderate width of the microcontroller facilitates easy integration into PCB layouts and enclosure designs, ensuring compatibility with standard form factors.

External Data Bus Width: 16

A wide external data bus width of 16 bits enables efficient data transfer between the microcontroller and external memory devices or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast processing speeds and real-time operation, essential for applications requiring rapid data processing and response times.

Length: 28 mm

The moderate length of the microcontroller contributes to a balanced form factor, making it suitable for various PCB layouts and enclosure configurations.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade signifies that the microcontroller meets stringent reliability and quality standards required for automotive applications, ensuring robust performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates various peripherals and interfaces on a single chip, simplifying system design and reducing component count for cost-effective solutions.

RAM Bytes: 8192

With a sizeable RAM capacity of 8192 bytes, the microcontroller can efficiently store and manipulate data, enabling smooth and efficient operation of complex algorithms and programs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for battery-powered or noise-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and facilitates automated assembly processes, ensuring reliable electrical connections and efficient manufacturing.

Maximum Supply Current: 170 mA

The relatively low maximum supply current requirement of 170 mA helps in conserving power and minimizing heat dissipation, contributing to overall system efficiency and reliability.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies power supply management in the system design.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise analog output signals, essential for controlling motors, actuators, and other devices requiring variable power levels.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and flexible memory storage options, ensuring scalability and adaptability of the microcontroller for future enhancements and revisions.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm provides high-density mounting capabilities, enabling compact PCB layouts and efficient use of space in miniaturized electronic devices.

Speed: 25 rpm

With a speed rating of 25 rpm, the microcontroller can handle fast data processing tasks and real-time control applications, ensuring responsive performance in dynamic environments.

No. of I/O Lines: 111

Having a high number of I/O lines allows for versatile connectivity and interfacing with external devices, sensors, and actuators, making the microcontroller versatile and adaptable to different applications.

Technical Specifications

Microcontrollers ST10F168-Q2 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e0

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10F168-Q2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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