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STM32H723VEH6

STMicroelectronics

STM32H723VEH6 by STMicroelectronics

STM32H723VEH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 24 timers, 16 DMA channels, and 26-Ch 16-Bit ADC. Ideal for applications requiring high-speed processing, such as industrial automation and IoT devices. Operating temperature ranges from -40 to 85°C with low power mode available.

Median Price

$10.960

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,409 parts In-Stock

1+ parts

$10.960

100+ parts

$7.309

1k+ parts

$6.806

10k+ parts

-

1,409

$10.960

$7.309

$6.806

-

Mouser Electronics

USA . 1,311 parts In-Stock

1+ parts

$10.960

100+ parts

$7.310

1k+ parts

$6.690

10k+ parts

-

1,311

$10.960

$7.310

$6.690

-

EBV Elektronik

Germany . 348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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348

-

-

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-

Distributors (In-Stock)

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Digiode

USA . 2,083 parts In-Stock

1+ parts

$7.372

100+ parts

-

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-

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2,083

$7.372

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$11.350

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-

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100

$11.350

-

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Vyrian

USA . 2,182 parts In-Stock

1+ parts

-

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2,182

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Anansix

USA . 1,751 parts In-Stock

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-

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1,751

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Chip Stock

USA . 425 parts In-Stock

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425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,298 parts In-Stock

1+ parts

$6.600

100+ parts

-

1k+ parts

-

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-

2,298

$6.600

-

-

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Corphita

USA . 331 parts In-Stock

1+ parts

$6.984

100+ parts

-

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331

$6.984

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Continental Prestige Electronics

USA . 3,577 parts In-Stock

1+ parts

$11.350

100+ parts

-

1k+ parts

-

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$11.123

3,577

$11.350

-

-

$11.123

Semicontronic

India . 2,199 parts In-Stock

1+ parts

$14.360

100+ parts

$14.001

1k+ parts

$13.929

10k+ parts

-

2,199

$14.360

$14.001

$13.929

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Microchip USA

USA . 4,095 parts In-Stock

1+ parts

$24.535

100+ parts

-

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-

10k+ parts

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4,095

$24.535

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Advanced Electronics

New Zealand . 64 parts In-Stock

1+ parts

$38.092

100+ parts

$36.188

1k+ parts

$36.188

10k+ parts

-

64

$38.092

$36.188

$36.188

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Aztec Data Supply Inc.

USA . 1,235 parts In-Stock

1+ parts

$46.170

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-

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1,235

$46.170

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

1+ parts

$52.351

100+ parts

-

1k+ parts

$47.116

10k+ parts

-

1,804

$52.351

-

$47.116

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Corohmni

South Africa . 131 parts In-Stock

1+ parts

$63.348

100+ parts

-

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131

$63.348

-

-

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MKK Technologies

India . 1,649 parts In-Stock

1+ parts

$98.442

100+ parts

-

1k+ parts

-

10k+ parts

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1,649

$98.442

-

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DigiPath Technology Company

USA . 1,649 parts In-Stock

1+ parts

$98.442

100+ parts

-

1k+ parts

-

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1,649

$98.442

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Argo Parts USA

USA . 4,267 parts In-Stock

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4,267

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$11.123

1k+ parts

$10.783

10k+ parts

$10.556

500

-

$11.123

$10.783

$10.556

Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

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350

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Parana Technologies

USA . 270 parts In-Stock

1+ parts

-

100+ parts

$62.593

1k+ parts

-

10k+ parts

-

270

-

$62.593

-

-

Overview

Unlock the power of innovation with the STM32H723VEH6 microcontroller by STMicroelectronics. Known for their top-notch quality and cutting-edge technology, STMicroelectronics delivers a versatile solution that is perfect for a wide range of applications. From IoT devices to industrial automation, this microcontroller offers unparalleled performance, efficiency, and reliability. With integrated cache, advanced peripherals, and low power modes, the STM32H723VEH6 provides value and benefits that will exceed your expectations. Stay ahead of the curve and elevate your projects with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides a lightweight and durable package for easy handling and protection of the microcontroller.

Integrated Cache

YES - The integrated cache improves performance by storing frequently accessed data for faster retrieval.

Surface Mount

YES - This feature allows for easy assembly onto circuit boards, making it ideal for mass production.

Maximum Supply Voltage

3.6 V - The high maximum supply voltage makes the microcontroller versatile for various power supply applications.

On Chip Data RAM Width

8 - The wide data RAM width allows for efficient data processing and storage capabilities.

Package Shape

SQUARE - The square package shape provides a compact footprint for space-saving designs.

Bit Size

32 - The 32-bit architecture offers high computing power and performance for demanding applications.

DAC Channels

YES - The presence of DAC channels enables the microcontroller to generate accurate analog signals for diverse uses.

No. of Terminals

100 - The ample number of terminals allows for versatile connectivity options with other devices.

Package Style (Meter)

GRID ARRAY, THIN PROFILE, FINE PITCH - This package style offers high-density mounting and increased reliability for robust performance.

Minimum Supply Voltage

1.62 V - The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature

85 °C - The high maximum operating temperature range makes the microcontroller suitable for industrial and harsh environment applications.

CPU Family

CORTEX-M7 - The Cortex-M7 CPU family provides advanced processing capabilities for handling complex tasks efficiently.

Minimum Operating Temperature

40 °C - The low minimum operating temperature ensures reliable performance even in extreme cold environments.

ADC Channels

YES - The presence of ADC channels enables the microcontroller to convert analog signals into digital data accurately.

DMA Channels

YES - The availability of DMA channels allows for efficient data transfer and processing without CPU intervention.

Terminal Position

BOTTOM - The bottom terminal position simplifies the assembly process and ensures secure connections on the circuit board.

ROM Words

524288 - The large ROM capacity provides ample storage for program code and data, enabling versatile application support.

Maximum Seated Height

1.1 mm - The low maximum seated height allows for compact and slim device designs.

Digital To Analog Converters

2-Ch 12-Bit - The dual DACs with 12-bit resolution offer precise analog signal generation capabilities.

Width

8 mm - The compact width of the microcontroller enables space-efficient PCB layouts.

Boundary Scan

YES - The boundary scan feature facilitates testing and debugging of the microcontroller during production and maintenance.

Peripherals

ANALOG COMPARATOR(2), BOR, CRC, DMA(16), LCD, PVD, PWM, RNG, RTC, TIMER(24), WDT(2) - The array of peripherals offers enhanced functionality and flexibility for diverse application requirements.

Maximum Clock Frequency

50 MHz - The high maximum clock frequency allows for rapid data processing and responsiveness in real-time applications.

Length

8 mm - The short length of the microcontroller enhances space-saving designs and compact form factors.

Peripheral IC Type

MICROCONTROLLER, RISC - The microcontroller with RISC architecture offers optimized performance and energy efficiency for embedded applications.

No. of Timers

24 - The numerous timers provide precise timing control and scheduling capabilities for various tasks.

RAM Bytes

577536 - The generous RAM capacity allows for efficient data storage and processing, supporting complex algorithms and multitasking.

Technology

CMOS - The CMOS technology used in the microcontroller ensures low power consumption and high noise immunity for reliable operation.

Terminal Form

BALL - The ball terminal form simplifies the soldering process and ensures reliable connections on the PCB.

Analog To Digital Converters

26-Ch 16-Bit, 17-Ch 12-Bit - The multiple ADCs with varying resolutions offer flexibility in converting analog signals with high precision.

Maximum Supply Current

360 mA - The high maximum supply current capability supports the operation of power-hungry peripherals and components.

No. of DMA Channels

16 - The multiple DMA channels enable efficient data transfer and processing, reducing the load on the CPU.

No. of Serial I/Os

11 - The available serial I/Os provide versatile communication interfaces for connecting to external devices.

PWM Channels

YES - The presence of PWM channels allows for precise control of analog outputs, essential for motor control and LED dimming applications.

Connectivity

ETHERNET, FDCAN, I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(5), SWPMI, UART(5), USART(5), USB - The extensive connectivity options enable seamless integration with various communication protocols and peripherals.

ROM Programmability

FLASH - The flash ROM programmability allows for easy firmware updates and customization, enhancing product functionality and adaptability.

Terminal Pitch

0.8 mm - The fine terminal pitch enables high-density mounting and compact PCB designs.

Format

FLOATING-POINT - The floating-point format allows for precise mathematical calculations and computations, essential for scientific and engineering applications.

Speed

550 rpm - The high operating speed supports rapid data processing and response times for real-time applications.

Low Power Mode

YES - The low power mode enhances energy efficiency and prolongs battery life in power-sensitive applications.

On Chip Program ROM Width

8 - The wide on-chip program ROM width accommodates large program code, enabling extensive application support.

No. of I/O Lines

80 - The ample number of I/O lines provides versatile connectivity options and peripheral interfaces for comprehensive system integration.

Technical Specifications

Microcontrollers STM32H723VEH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

80

No. of Serial I/Os:

11

No. of Terminals:

100

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, FDCAN, I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(5), SWPMI, UART(5), USART(5), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, CRC, DMA(16), LCD, PVD, PWM, RNG, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

26-Ch 16-Bit, 17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H723VEH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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