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STM32H743VGH6

STMicroelectronics

STM32H743VGH6 by STMicroelectronics

STM32H743VGH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 1.71-3.6 V supply voltage range, and 48 MHz clock frequency. Ideal for industrial applications, it features 16-Ch ADC, 2-Ch DAC, and extensive connectivity options including CAN, I2C, UART, USB.

Median Price

$13.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$13.530

100+ parts

-

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-

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10

$13.530

-

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Vyrian

USA . 1,989 parts In-Stock

1+ parts

-

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-

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-

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1,989

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-

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Digiode

USA . 1,207 parts In-Stock

1+ parts

-

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1,207

-

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-

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Anansix

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

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180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,997 parts In-Stock

1+ parts

$9.740

100+ parts

-

1k+ parts

-

10k+ parts

-

4,997

$9.740

-

-

-

AZTECH Wire

Italy . 625 parts In-Stock

1+ parts

$11.585

100+ parts

-

1k+ parts

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625

$11.585

-

-

-

Continental Prestige Electronics

USA . 6,006 parts In-Stock

1+ parts

$12.420

100+ parts

-

1k+ parts

-

10k+ parts

$12.172

6,006

$12.420

-

-

$12.172

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$13.530

100+ parts

$12.854

1k+ parts

-

10k+ parts

$12.042

100

$13.530

$12.854

-

$12.042

Ampacity Inc.

Singapore . 1,201 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$14.000

-

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Modulus Dynamics

Lithuania . 74 parts In-Stock

1+ parts

$15.018

100+ parts

$14.868

1k+ parts

$14.418

10k+ parts

-

74

$15.018

$14.868

$14.418

-

Semicontronic

India . 561 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

-

561

$19.000

$18.525

$18.430

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$24.393

100+ parts

$23.174

1k+ parts

$23.174

10k+ parts

-

3,000

$24.393

$23.174

$23.174

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Microchip USA

USA . 3,486 parts In-Stock

1+ parts

$32.658

100+ parts

-

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10k+ parts

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3,486

$32.658

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IDEA Electronic Components Group

UK . 2,136 parts In-Stock

1+ parts

$35.817

100+ parts

-

1k+ parts

$32.236

10k+ parts

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2,136

$35.817

-

$32.236

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Corohmni

South Africa . 1,148 parts In-Stock

1+ parts

$36.919

100+ parts

-

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1,148

$36.919

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Aztec Data Supply Inc.

USA . 4,882 parts In-Stock

1+ parts

$51.230

100+ parts

-

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4,882

$51.230

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MKK Technologies

India . 754 parts In-Stock

1+ parts

$67.352

100+ parts

-

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754

$67.352

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DigiPath Technology Company

USA . 754 parts In-Stock

1+ parts

$67.352

100+ parts

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10k+ parts

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754

$67.352

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-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Corphita

USA . 2,605 parts In-Stock

1+ parts

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2,605

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Argo Parts USA

USA . 1,066 parts In-Stock

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1,066

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.151

1k+ parts

$2.151

10k+ parts

$2.151

500

-

$2.151

$2.151

$2.151

Parana Technologies

USA . 347 parts In-Stock

1+ parts

-

100+ parts

$42.825

1k+ parts

-

10k+ parts

-

347

-

$42.825

-

-

Overview

Elevate your projects with the STM32H743VGH6 microcontroller from STMicroelectronics. With cutting-edge technology and superior quality, this device offers unmatched performance and reliability in a compact package. Ideal for a wide range of applications, this microcontroller provides seamless connectivity and advanced features to enhance your designs. Discover the value and benefits of choosing STMicroelectronics for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and helps in reducing the overall weight of the microcontroller, making it suitable for portable or lightweight applications.

Integrated Cache: YES

Having an integrated cache helps in improving the performance of the microcontroller by reducing the access time to frequently used instructions or data.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input range, making it compatible with a wide range of power sources and applications.

CPU Family: CORTEX-M7

Being part of the Cortex-M7 family ensures high performance and efficiency in processing tasks, making it a reliable choice for demanding applications.

ADC Channels: YES

The presence of Analog-to-Digital Converters allows for accurate conversion of analog signals to digital data, enabling sensor interfacing and measurement applications.

Connectivity: CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), UART(4), USART(4), USB(2)

The diverse connectivity options make it versatile for communication with various external devices and systems, enhancing its compatibility and flexibility.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(21), WDT(2)

A wide range of peripherals available on the microcontroller offers additional features for precise control and functionality in different applications.

Speed: 480 rpm

The high processing speed of 480 RPM enables quick execution of tasks, making it suitable for real-time applications and data processing.

Low Power Mode: YES

The availability of a low power mode helps in reducing power consumption during idle or low activity periods, contributing to energy efficiency and longer battery life.

Technical Specifications

Microcontrollers STM32H743VGH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

82

No. of Serial I/Os:

11

No. of Terminals:

100

No. of Timers:

21

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1085440

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

480 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), UART(4), USART(4), USB(2)

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

16-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H743VGH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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