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STM32H7B0VBT6TR

STMicroelectronics

STM32H7B0VBT6TR by STMicroelectronics

STM32H7B0VBT6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU family, offering 18 timers and 16 ADC channels. It operates at up to 50 MHz, with low power mode and integrated cache for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

$5.302

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.080

10k+ parts

-

4,000

-

-

$6.080

-

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.935

10k+ parts

-

2,000

-

-

$4.935

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.895

10k+ parts

$4.890

2,000

-

-

$4.895

$4.890

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.670

10k+ parts

-

2,000

-

-

$5.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.490

100+ parts

-

1k+ parts

-

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10

$7.490

-

-

-

IBS Electronics

USA . 11,520 parts In-Stock

1+ parts

-

100+ parts

$7.125

1k+ parts

$6.452

10k+ parts

-

11,520

-

$7.125

$6.452

-

Digiode

USA . 3,271 parts In-Stock

1+ parts

-

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3,271

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Vyrian

USA . 3,088 parts In-Stock

1+ parts

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3,088

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-

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Anansix

USA . 1,143 parts In-Stock

1+ parts

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1,143

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,161 parts In-Stock

1+ parts

$4.820

100+ parts

-

1k+ parts

-

10k+ parts

-

2,161

$4.820

-

-

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Vigor

Singapore . 8,000 parts In-Stock

1+ parts

$5.870

100+ parts

-

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10k+ parts

-

8,000

$5.870

-

-

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Continental Prestige Electronics

USA . 3,786 parts In-Stock

1+ parts

$7.040

100+ parts

-

1k+ parts

-

10k+ parts

$6.899

3,786

$7.040

-

-

$6.899

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$7.340

100+ parts

-

1k+ parts

$7.047

10k+ parts

-

1,000

$7.340

-

$7.047

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Modulus Dynamics

Lithuania . 300 parts In-Stock

1+ parts

$8.314

100+ parts

$8.231

1k+ parts

$7.981

10k+ parts

-

300

$8.314

$8.231

$7.981

-

Semicontronic

India . 2,347 parts In-Stock

1+ parts

$10.490

100+ parts

$10.228

1k+ parts

$10.175

10k+ parts

-

2,347

$10.490

$10.228

$10.175

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AZTECH Wire

Italy . 379 parts In-Stock

1+ parts

$11.490

100+ parts

-

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10k+ parts

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379

$11.490

-

-

-

Microchip USA

USA . 3,413 parts In-Stock

1+ parts

$19.690

100+ parts

$19.410

1k+ parts

$19.260

10k+ parts

$19.120

3,413

$19.690

$19.410

$19.260

$19.120

IDEA Electronic Components Group

UK . 2,261 parts In-Stock

1+ parts

$35.131

100+ parts

-

1k+ parts

$31.618

10k+ parts

-

2,261

$35.131

-

$31.618

-

Corohmni

South Africa . 782 parts In-Stock

1+ parts

$58.728

100+ parts

-

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-

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782

$58.728

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$61.520

100+ parts

$58.444

1k+ parts

$58.444

10k+ parts

-

2,500

$61.520

$58.444

$58.444

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MKK Technologies

India . 2,328 parts In-Stock

1+ parts

$66.062

100+ parts

-

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2,328

$66.062

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DigiPath Technology Company

USA . 2,328 parts In-Stock

1+ parts

$66.062

100+ parts

-

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-

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2,328

$66.062

-

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Aztec Data Supply Inc.

USA . 111 parts In-Stock

1+ parts

$71.330

100+ parts

-

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111

$71.330

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Lixinc

USA . 14,518 parts In-Stock

1+ parts

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14,518

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Robosynatics

Brazil . 5,000 parts In-Stock

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5,000

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Lucentia Tech

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$13.602

1k+ parts

$13.602

10k+ parts

$13.602

5,000

-

$13.602

$13.602

$13.602

Corphita

USA . 1,959 parts In-Stock

1+ parts

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1,959

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Argo Parts USA

USA . 1,205 parts In-Stock

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1,205

-

-

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Parana Technologies

USA . 697 parts In-Stock

1+ parts

-

100+ parts

$42.005

1k+ parts

-

10k+ parts

-

697

-

$42.005

-

-

Overview

Unlock the next level of performance with the STM32H7B0VBT6TR microcontroller by STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this microcontroller features integrated cache, advanced peripheral options, and low power mode capabilities. Experience seamless connectivity and high-speed processing with this innovative product, providing unmatched value and efficiency for all your projects. Elevate your designs with the STM32H7B0VBT6TR and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-term use.

Integrated Cache: YES

Improves data access speed and overall performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power source options and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

Efficient data processing and storage capabilities for optimized performance.

Address Bus Width: 9

Supports larger memory addressing for complex computing tasks and data handling.

Bit Size: 32

High processing capability for handling complex algorithms and calculations efficiently.

DAC Channels: YES

Allows for analog signal generation, useful for various applications requiring analog output.

No. of Terminals: 100

Sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and space-saving design suitable for applications with limited physical space.

Minimum Supply Voltage: 1.62 V

Operates efficiently even at lower voltages, increasing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 85 °C

Wide temperature range support for reliable operation in various environmental conditions.

CPU Family: CORTEX-M7

High-performance Cortex-M7 architecture for fast and efficient processing.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold environments without compromising performance.

ADC Channels: YES

Enables accurate analog-to-digital conversion for precise sensor readings and data acquisition.

DMA Channels: YES

Direct Memory Access support for efficient data transfer and processing without CPU intervention.

Terminal Position: QUAD

Quad-terminal configuration for easy and secure connection with other components.

ROM Words: 131072

Sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for compact and space-efficient device integration.

Digital To Analog Convertors: 3-Ch 12-Bit

High-resolution DAC channels for accurate analog output generation.

RAM Words: 1413120

Large onboard RAM for efficient data processing and multitasking capabilities.

Width: 14 mm

Compact form factor suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability for debugging and testing during the development phase.

Peripherals: BOR, COMPARATOR(2), DMA(5), POR, TIMER(18), RTC, WDT(2)

Wide range of integrated peripherals for enhanced functionality and connectivity options.

Maximum Clock Frequency: 50 MHz

High clock frequency for fast data processing and task execution.

Length: 14 mm

Compact and square shape for easy mounting and integration.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for high-speed and power-efficient operation.

No. of Timers: 18

Multiple timers for time-sensitive operations and precision timing requirements.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal configuration for secure and reliable connections on the PCB.

Analog To Digital Convertors: 16-Ch 16-Bit

Multiple high-resolution ADC channels for accurate analog signal acquisition.

Maximum Supply Current: 4 mA

Low current consumption for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 3.3 V

Stable and standard supply voltage for consistent performance and compatibility.

PWM Channels: YES

Pulse Width Modulation channels for precise control of digital signals and motor speed.

Connectivity: CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(5), SWPMI, UART(5), USART(5), USB

Versatile connectivity options for interfacing with a wide range of external devices and peripherals.

ROM Programmability: FLASH

Flash ROM for easy and flexible programming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing for compact and space-saving PCB design.

Format: FLOATING POINT

Supports floating-point arithmetic for precise calculations and data processing.

Speed: 280 rpm

High-speed performance for rapid data processing and real-time applications.

Low Power Mode: YES

Low power consumption mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Ample program ROM width for storing firmware and software for the microcontroller's operation.

No. of I/O Lines: 80

Sufficient input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers STM32H7B0VBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

9

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Words:

1413120

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

280 rpm

Maximum Supply Current:

4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(5), SWPMI, UART(5), USART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(5), POR, TIMER(18), RTC, WDT(2)

Analog To Digital Convertors:

16-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

STM32H7B0VBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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