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LPC1758FBD80Y

NXP Semiconductors

LPC1758FBD80Y by NXP Semiconductors

NXP Semiconductors LPC1758FBD80Y is a 32-bit microcontroller with 80 terminals, operating at a max frequency of 25 MHz. It features 6 ADC channels, 1 DAC channel, and 52 I/O lines suitable for industrial applications requiring high-speed processing and connectivity via I2C, SPI, SSP, and UART interfaces.

Median Price

$11.422

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 216 parts In-Stock

1+ parts

$6.900

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$6.900

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$6.900

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216

$6.900

$6.900

$6.900

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Chip1Stop

Japan . 1,000 parts In-Stock

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$10.200

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$7.770

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1,000

$10.200

$7.770

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Arrow

USA . 779 parts In-Stock

1+ parts

$10.313

100+ parts

$8.600

1k+ parts

$8.472

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779

$10.313

$8.600

$8.472

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Farnell

UK . 689 parts In-Stock

1+ parts

$12.530

100+ parts

$7.050

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689

$12.530

$7.050

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Mouser Electronics

USA . 1,990 parts In-Stock

1+ parts

$14.190

100+ parts

$9.620

1k+ parts

$8.610

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1,990

$14.190

$9.620

$8.610

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DigiKey

USA . 402 parts In-Stock

1+ parts

$14.190

100+ parts

$9.612

1k+ parts

$9.501

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402

$14.190

$9.612

$9.501

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EBV Elektronik

Germany . 21,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 3,694 parts In-Stock

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3,694

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Verical

USA . 2,880 parts In-Stock

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$9.576

2,880

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$9.576

Element14

Singapore . 532 parts In-Stock

1+ parts

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$13.860

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$13.570

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532

-

$13.860

$13.570

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Distributors (In-Stock)

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Digiode

USA . 1,469 parts In-Stock

1+ parts

$10.450

100+ parts

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1,469

$10.450

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Nova Conductors

Japan . 50 parts In-Stock

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$10.921

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50

$10.921

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Famous Connections Ltd

Bulgaria . 5,000 parts In-Stock

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Vyrian

USA . 3,893 parts In-Stock

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3,893

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Flip Electronics

USA . 3,694 parts In-Stock

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3,694

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Chip Stock

USA . 2,849 parts In-Stock

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2,849

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Anansix

USA . 2,411 parts In-Stock

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2,411

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

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$13.430

10k+ parts

$12.400

2,000

-

-

$13.430

$12.400

IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

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$10.897

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1,000

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$10.897

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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14

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ComSIT USA

USA . 14 parts In-Stock

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14

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 949 parts In-Stock

1+ parts

$6.210

100+ parts

-

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949

$6.210

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Semicontronic

India . 1,039 parts In-Stock

1+ parts

$8.760

100+ parts

$8.541

1k+ parts

$8.497

10k+ parts

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1,039

$8.760

$8.541

$8.497

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Component Stockers USA

USA . 27,652 parts In-Stock

1+ parts

$9.880

100+ parts

$9.290

1k+ parts

$7.410

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27,652

$9.880

$9.290

$7.410

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Corphita

USA . 3,721 parts In-Stock

1+ parts

$9.900

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3,721

$9.900

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Modulus Dynamics

Lithuania . 2,331 parts In-Stock

1+ parts

$10.923

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$10.923

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$10.923

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2,331

$10.923

$10.923

$10.923

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Corohmni

South Africa . 267 parts In-Stock

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$10.923

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267

$10.923

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$11.251

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$10.688

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$10.688

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500

$11.251

$10.688

$10.688

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Vigor

Singapore . 2,454 parts In-Stock

1+ parts

$14.050

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2,454

$14.050

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Continental Prestige Electronics

USA . 1,550 parts In-Stock

1+ parts

$15.170

100+ parts

$9.490

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$15.170

$9.490

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Aztec Data Supply Inc.

USA . 4,211 parts In-Stock

1+ parts

$77.227

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4,211

$77.227

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QUARKTWIN TECHNOLOGY LTD

USA . 19,349 parts In-Stock

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UNI Independent Distributors

Spain . 7,240 parts In-Stock

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Lixinc

USA . 6,837 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Component Connect

USA . 2,849 parts In-Stock

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Argo Parts USA

USA . 2,829 parts In-Stock

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Microchip USA

USA . 2,317 parts In-Stock

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2,317

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Netroflash

USA . 50 parts In-Stock

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$10.703

1k+ parts

$10.375

10k+ parts

$10.157

50

-

$10.703

$10.375

$10.157

Overview

Unleash the power of innovation with the LPC1758FBD80Y by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability. From industrial automation to IoT applications, this versatile device is designed to exceed expectations. Seamlessly integrating advanced features like DAC channels, ADC channels, and PWM channels, this product delivers exceptional value and efficiency. Elevate your projects to new heights with the LPC1758FBD80Y - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power requirements and compatibility with a wide range of applications.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient processor for high-performance applications.

ROM Words: 524288

Offers a large amount of memory for storing program data, allowing for complex algorithms to be implemented.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

Connectivity: I2C(2), SPI, SSP(2), UART(4)

Provides versatile communication options for connecting to external devices and peripherals.

RAM Bytes: 65536

Offers ample memory for storing and manipulating data during program execution.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing architecture for efficient and optimized performance.

Technical Specifications

Microcontrollers LPC1758FBD80Y attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

52

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI, SSP(2), UART(4)

Peripherals:

BOD, DMA(8), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC1758FBD80Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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