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LPC1768FBD100

NXP Semiconductors

LPC1768FBD100 by NXP Semiconductors

NXP Semiconductors' LPC1768FBD100 is a 32-bit ARM7 microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at up to 25 MHz, has DAC and ADC channels, and supports PWM. Ideal for industrial applications requiring a powerful yet compact microcontroller with low power consumption.

Median Price

$8.105

Lifecycle Status

Suppliers In-Stock

18

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Freelance Electronics

USA . 37 parts In-Stock

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$3.663

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$3.847

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Nova Conductors

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Partservice

France . 110 parts In-Stock

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HZD GmbH

Germany . 100 parts In-Stock

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Netherlands . 95 parts In-Stock

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Bristol Electronics

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Micros sp.j. W. Kędra i J. Lic

Poland . 90 parts In-Stock

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Micros

Poland . 85 parts In-Stock

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Infinite Electronics LLP

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AZTECH Wire

Italy . 777 parts In-Stock

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Semicontronic

India . 528 parts In-Stock

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Ampacity Inc.

Singapore . 553 parts In-Stock

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One Stop Electronics

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Microchip USA

USA . 1,859 parts In-Stock

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Aztec Data Supply Inc.

USA . 185 parts In-Stock

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Corohmni

South Africa . 514 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Epart123

USA . 2,250 parts In-Stock

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Computer Components Inc. - USA

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Modulus Dynamics

Lithuania . 650 parts In-Stock

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Authorized Procurement Solutions

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ChipstoGo Electronic ltd

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Corphita

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Kepictronics

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Bastille Electronics

Australia . 120 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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Lucentia Tech

USA . 30 parts In-Stock

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Overview

Experience the exceptional quality and reliability of the LPC1768FBD100 microcontroller from NXP Semiconductors, a trusted name in the industry. This innovative product offers a wide range of applications in various industries, providing unparalleled value to customers seeking high-performance solutions. With cutting-edge technology and advanced features such as DAC and ADC channels, DMA support, and PWM capabilities, this microcontroller delivers unmatched benefits and advantages, making it the ideal choice for your next project. Choose NXP Semiconductors and elevate your designs to new heights with the LPC1768FBD100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and provides good protection for the microcontroller.

Surface Mount: YES

Surface mount technology allows for smaller, more compact designs and is easier to automate during the manufacturing process.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with different applications.

Package Shape: SQUARE

Square shape provides uniformity in placement and easy integration into circuit boards.

Bit Size: 32

32-bit architecture allows for faster processing and better performance compared to lower bit sizes.

DAC Channels: YES

Digital-to-analog converter channels allow for accurate analog signal generation.

Power Supplies (V): 2.5/3.3

Support for different power supply voltages ensures compatibility with various systems.

No. of Terminals: 100

Having a high number of terminals allows for multiple connections and functionalities to be supported.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is space-efficient, low in height, and suitable for high-density mounting applications.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage ensures the microcontroller can operate in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the microcontroller suitable for industrial environments with potentially high temperatures.

CPU Family: ARM7

The ARM7 CPU family is known for its efficient and reliable performance, making it a popular choice for microcontrollers.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function in cold environments without issues.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and reliability of connections.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to read analog signals accurately.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce the load on the CPU.

Terminal Position: QUAD

Quad terminal position allows for easy handling during assembly and provides a stable connection.

ROM Words: 131072

Large ROM capacity of 131072 words provides ample space for program storage.

Maximum Seated Height: 1.6 mm

Low seated height makes the microcontroller suitable for slim and compact designs.

Width: 14 mm

Standard width of 14mm ensures compatibility with common board layouts.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz allows for fast data processing and execution speed.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures proper soldering without damaging the microcontroller.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder reflow during manufacturing.

Length: 14 mm

Standard length of 14mm ensures compatibility with common board layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the microcontroller suitable for harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller provides efficient processing and reduced instruction cycles.

RAM Bytes: 65536

Large RAM capacity of 65536 bytes allows for storing and accessing data quickly during operation.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability in solder joints.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog output signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and flexibility in programming.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and efficient use of space on the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the microcontroller can withstand exposure to some moisture without damage.

Speed: 100 rpm

With a speed of 100 rpm, the microcontroller can deliver fast data processing and response times.

No. of I/O Lines: 70

Having 70 I/O lines allows for versatile connectivity and communication with external devices.

Technical Specifications

Microcontrollers LPC1768FBD100 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC1768FBD100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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