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LPC11C24FBD48/301

NXP Semiconductors

LPC11C24FBD48/301 by NXP Semiconductors

NXP Semiconductors' LPC11C24FBD48/301 microcontroller features a 32-bit Cortex-M0 CPU, 8KB RAM, and 32768 ROM words. With a max clock frequency of 25MHz, it supports various peripherals like BOD, POR, TIMER(5), WDT. Ideal for industrial applications requiring low power mode and connectivity via C_CAN, I2C, SPI(2), UART interfaces.

Median Price

$5.760

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 131 parts In-Stock

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$5.760

100+ parts

$3.750

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$3.750

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Flip Electronics (Authorized)

USA . 24 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$5.205

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$5.205

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Cyclops Electronics Ltd

UK . 20,842 parts In-Stock

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Vyrian

USA . 7,309 parts In-Stock

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Digiode

USA . 4,680 parts In-Stock

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Anansix

USA . 1,728 parts In-Stock

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USA . 24 parts In-Stock

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Continental Prestige Electronics

USA . 299 parts In-Stock

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$5.205

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$5.101

299

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$5.101

AZTECH Wire

Italy . 778 parts In-Stock

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$9.501

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Vigor

Singapore . 500 parts In-Stock

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$18.000

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Ampacity Inc.

Singapore . 24 parts In-Stock

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$26.000

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Semicontronic

India . 48 parts In-Stock

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$34.000

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$33.150

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$32.980

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Microchip USA

USA . 1,299 parts In-Stock

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$38.725

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Corohmni

South Africa . 442 parts In-Stock

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$40.887

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Kepictronics

USA . 16,364 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,582 parts In-Stock

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UNI Independent Distributors

Spain . 5,101 parts In-Stock

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Argo Parts USA

USA . 4,260 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,721 parts In-Stock

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Corphita

USA . 3,565 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 1,201 parts In-Stock

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Perfect Parts

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Computer Components Inc. - USA

USA . 3 parts In-Stock

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Overview

Unleash the power of innovation with the LPC11C24FBD48/301 by NXP Semiconductors, a cutting-edge microcontroller designed to elevate your projects to new heights. Crafted with precision and expertise, this device offers unparalleled performance and reliability, making it ideal for a wide range of applications. From IoT devices to industrial automation, the LPC11C24FBD48/301 delivers exceptional value, efficiency, and versatility. Experience seamless connectivity, low power consumption, and high-speed processing capabilities that will revolutionize your designs. Elevate your creations with the LPC11C24FBD48/301 and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the microcontroller.

Surface Mount: YES

Enables easy and efficient soldering onto circuit boards, saving time during assembly.

Maximum Supply Voltage: 3.6 V

Allows for operation with a range of power sources, increasing versatility.

On Chip Data RAM Width: 8

Provides sufficient memory for data storage and processing tasks.

Package Shape: SQUARE

Facilitates space-efficient placement on PCBs and simplifies circuit design.

Bit Size: 32

Offers high computational capabilities for complex tasks and algorithms.

Power Supplies (V): 3.3

Optimal voltage for efficient performance and power consumption.

No. of Terminals: 48

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact and low-profile designs, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Allows operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a wide range of environmental conditions.

CPU Family: CORTEX-M0

Utilizes the efficient and power-saving ARM Cortex-M0 architecture for high-performance computing.

No. of External Interrupts: 13

Facilitates responsive handling of external events and interrupts for real-time applications.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold environments without performance degradation.

Terminal Finish: TIN

Provides corrosion resistance and reliable electrical connections for long-term use.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and real-world signals.

Terminal Position: QUAD

Allows for efficient routing and organization of signal connections in the circuit layout.

ROM Words: 32768

Offers ample program memory for storing firmware and application code.

Maximum Seated Height: 1.6 mm

Facilitates compact and low-profile device designs for space-constrained applications.

Width: 7 mm

Compact form factor suitable for small electronic devices and PCB layouts.

Peripherals: BOD, POR, TIMER(5), WDT

Includes essential peripherals like Brown-Out Detection, Power-On Reset, Timers, and Watchdog Timer for enhanced system functionality.

Maximum Clock Frequency: 25 MHz

Provides high-speed processing capabilities for demanding applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable solder connections during manufacturing processes.

Peak Reflow Temperature °C: 260

Suitable for the reflow soldering process, ensuring secure and durable solder joints.

Length: 7 mm

Compact form factor for space-efficient designs and layout optimization on PCBs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture microcontroller for efficient and optimized performance.

No. of Timers: 5

Provides multiple timer resources for precise timing and event management in applications.

RAM Bytes: 8192

Offers sufficient random access memory for data storage and processing tasks.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity in digital circuits.

Terminal Form: GULL WING

Facilitates easy soldering and strong mechanical connection to the PCB during assembly.

Analog To Digital Convertors: 8-Ch 10-Bit

Allows for precision analog signal conversion for various sensor interfacing requirements.

Maximum Supply Current: 100 mA

Optimized power consumption for efficient operation and extended battery life.

Nominal Supply Voltage: 3.3 V

Stable voltage supply for consistent and reliable performance across operating conditions.

Connectivity: C_CAN, I2C, SPI(2), UART

Supports multiple communication interfaces for flexible connectivity options with external devices.

ROM Programmability: FLASH

Allows for easy reprogramming of firmware and software updates for the microcontroller.

Terminal Pitch: 0.5 mm

Enables high-density mounting and compact circuit designs on PCBs.

Format: FIXED POINT

Suitable for fixed-point arithmetic operations and precision computation tasks.

Speed: 50 rpm

Specifies the maximum speed capability for processing tasks and data handling operations.

Low Power Mode: YES

Supports low-power operation modes for energy-efficient performance and extended battery life.

On Chip Program ROM Width: 8

Efficient program memory width for storing firmware and application code.

No. of I/O Lines: 36

Provides ample input/output connections for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LPC11C24FBD48/301 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

13

No. of I/O Lines:

36

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

C_CAN, I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11C24FBD48/301 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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