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LPC1769FBD100

NXP Semiconductors

LPC1769FBD100 by NXP Semiconductors

NXP Semiconductors LPC1769FBD100 is a 32-bit microcontroller with Cortex-M3 CPU, 524288 ROM words, and 65536 RAM bytes. It features 8-Ch 12-Bit ADC channels, CAN(2), ETHERNET connectivity, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed data processing and multiple I/O lines.

Median Price

$8.426

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Bristol Electronics

USA . 54,270 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Whistler Technology

UK . 2,420 parts In-Stock

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Vyrian

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Digiode

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Partservice

France . 180 parts In-Stock

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$7.328

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Micros sp.j. W. Kędra i J. Lic

Poland . 180 parts In-Stock

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$7.849

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$7.849

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Anansix

USA . 145 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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Micros

Poland . 20 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 20 parts In-Stock

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LWI Electronics Inc

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Prism Electronics

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ComSIT Distribution GmbH

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Distributors (Availability)

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One Stop Electronics

USA . 667 parts In-Stock

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$9.000

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Semicontronic

India . 698 parts In-Stock

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$12.000

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$11.700

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$11.640

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Aztec Data Supply Inc.

USA . 4,823 parts In-Stock

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AZTECH Wire

Italy . 206 parts In-Stock

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$19.030

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Ampacity Inc.

Singapore . 385 parts In-Stock

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$23.000

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Corohmni

South Africa . 80 parts In-Stock

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iBuyXS LLC

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Lixinc

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Argo Parts USA

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UNI Independent Distributors

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Perfect Parts

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A-Z Elektronik GmbH

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Corphita

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Kepictronics

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Robosynatics

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Lucentia Tech

USA . 500 parts In-Stock

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S.R.D Solutions

India . 300 parts In-Stock

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Infinite Electronics LLP (Excess)

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Modulus Dynamics

Lithuania . 71 parts In-Stock

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Computer Components Inc. - USA

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Bastille Electronics

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Overview

Unlock limitless possibilities with the LPC1769FBD100 by NXP Semiconductors, a powerhouse in the world of microcontrollers. With cutting-edge technology and unparalleled performance, this device is perfect for a wide range of applications. From industrial automation to consumer electronics, the LPC1769FBD100 offers unmatched value, benefits, and advantages to customers looking to elevate their projects to the next level. Trust NXP Semiconductors to deliver quality and reliability that exceeds expectations. Step into the future with the LPC1769FBD100 and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for small and portable electronic devices.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Bit Size: 32

Higher bit size allows for more complex data processing capabilities.

ADC Channels: YES

Analog to Digital Convertor channels allow for interfacing with analog sensors and signals.

ROM Words: 524288

Large ROM size enables storing a substantial amount of program data.

Digital To Analog Convertors: 1-Ch 10-Bit

Ability to convert digital signals to analog for interfacing with analog components.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where robustness and reliability are crucial.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing of instructions, suitable for embedded systems.

RAM Bytes: 65536

Sufficient RAM size for temporary data storage and manipulation.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high bit resolution for accurate analog signal conversion.

Connectivity: CAN(2), ETHERNET, I2C(3), UART(4), USB

Versatile connectivity options for interfacing with a variety of external devices and networks.

Technical Specifications

Microcontrollers LPC1769FBD100 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(3), UART(4), USB

Peripherals:

BOD, DMA, POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC1769FBD100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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