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STM32H750XBH6TR

STMicroelectronics

STM32H750XBH6TR by STMicroelectronics

STM32H750XBH6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It features AES, CRC, DMA(16), USB connectivity, and operates at speeds up to 48 MHz. Ideal for applications requiring high-performance computing in compact designs.

Median Price

$6.932

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 26,600 parts In-Stock

1+ parts

-

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-

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$7.889

26,600

-

-

-

$7.889

Arrow

USA . 14,000 parts In-Stock

1+ parts

-

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-

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-

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$6.932

14,000

-

-

-

$6.932

Verical

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.932

14,000

-

-

-

$6.932

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$11.770

100+ parts

-

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35

$11.770

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-

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Bristol Electronics

USA . 7,000 parts In-Stock

1+ parts

-

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7,000

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Vyrian

USA . 2,340 parts In-Stock

1+ parts

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2,340

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Digiode

USA . 1,481 parts In-Stock

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1,481

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Anansix

USA . 218 parts In-Stock

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218

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 28,380 parts In-Stock

1+ parts

$6.440

100+ parts

$6.279

1k+ parts

$6.247

10k+ parts

-

28,380

$6.440

$6.279

$6.247

-

Ampacity Inc.

Singapore . 26,348 parts In-Stock

1+ parts

$6.660

100+ parts

-

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26,348

$6.660

-

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Modulus Dynamics

Lithuania . 33 parts In-Stock

1+ parts

$11.711

100+ parts

$11.593

1k+ parts

$11.242

10k+ parts

-

33

$11.711

$11.593

$11.242

-

Continental Prestige Electronics

USA . 3,878 parts In-Stock

1+ parts

$11.770

100+ parts

-

1k+ parts

-

10k+ parts

$11.535

3,878

$11.770

-

-

$11.535

AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$19.480

100+ parts

-

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-

537

$19.480

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Microchip USA

USA . 2,376 parts In-Stock

1+ parts

$25.450

100+ parts

$25.090

1k+ parts

$24.910

10k+ parts

$24.730

2,376

$25.450

$25.090

$24.910

$24.730

IDEA Electronic Components Group

UK . 1,879 parts In-Stock

1+ parts

$28.554

100+ parts

-

1k+ parts

$25.699

10k+ parts

-

1,879

$28.554

-

$25.699

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Aztec Data Supply Inc.

USA . 1,350 parts In-Stock

1+ parts

$41.170

100+ parts

-

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-

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1,350

$41.170

-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$47.971

100+ parts

$45.573

1k+ parts

$45.573

10k+ parts

-

2,000

$47.971

$45.573

$45.573

-

MKK Technologies

India . 2,375 parts In-Stock

1+ parts

$53.694

100+ parts

-

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2,375

$53.694

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DigiPath Technology Company

USA . 2,375 parts In-Stock

1+ parts

$53.694

100+ parts

-

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-

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2,375

$53.694

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Corohmni

South Africa . 337 parts In-Stock

1+ parts

$71.902

100+ parts

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337

$71.902

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Component Stockers USA

USA . 614 parts In-Stock

1+ parts

$124.010

100+ parts

$124.010

1k+ parts

$124.010

10k+ parts

$124.010

614

$124.010

$124.010

$124.010

$124.010

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 2,154 parts In-Stock

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2,154

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$11.535

1k+ parts

$11.182

10k+ parts

$10.946

2,000

-

$11.535

$11.182

$10.946

Corphita

USA . 1,803 parts In-Stock

1+ parts

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1,803

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Robosynatics

Brazil . 439 parts In-Stock

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439

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Lucentia Tech

USA . 439 parts In-Stock

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439

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Parana Technologies

USA . 7 parts In-Stock

1+ parts

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100+ parts

$34.141

1k+ parts

-

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7

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$34.141

-

-

Overview

Experience unparalleled performance and reliability with the STM32H750XBH6TR microcontroller by STMicroelectronics. This cutting-edge device offers an array of advanced features, including integrated cache, multiple ADC channels, and a wide range of peripherals for seamless connectivity. Ideal for applications in automotive, industrial control, and IoT devices, this microcontroller delivers exceptional speed and efficiency while maintaining low power consumption. Trust in STMicroelectronics' reputation for quality and innovation, and unlock the full potential of your designs with the STM32H750XBH6TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

Helps in improving the speed and efficiency of the microcontroller by storing frequently accessed data for quick access.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and enabling mass production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply voltages, making the microcontroller versatile for various applications.

On Chip Data RAM Width: 8

Provides a sufficient width for storing and accessing data quickly, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

Enables easy handling and placement on the PCB, ensuring a uniform and compact design for the overall system.

Bit Size: 32

Offers high computational efficiency and processing power, allowing for complex tasks to be executed quickly.

DAC Channels: YES

Enables analog signal generation, essential for various applications such as audio processing and sensor interfacing.

No. of Terminals: 265

Provides ample connectivity options for interfacing with external devices and peripherals, enhancing the flexibility of the microcontroller.

Minimum Supply Voltage: 1.62 V

Allows the microcontroller to operate efficiently at lower power supply voltages, ideal for battery-powered applications.

CPU Family: CORTEX-M7

Utilizes a powerful and efficient CPU architecture, enabling fast and reliable operation for a wide range of applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Provides high-quality analog output signals with fine resolution, essential for precise control and signal generation.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture, known for its simplicity and efficiency in processing instructions.

Maximum Clock Frequency: 48 MHz

Offers high-speed processing capabilities, allowing for quick execution of instructions and tasks.

Analog To Digital Convertors: 36-Ch 16-Bit

Enables accurate and high-resolution analog-to-digital conversion, essential for precise sensor data acquisition.

Connectivity: FDCAN, ETHERNET, I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), SPI(6), SPDIFRX, UART(4), USART(4), USB

Offers a wide range of connectivity options for interfacing with various communication protocols and peripherals, making the microcontroller highly versatile.

ROM Programmability: FLASH

Allows for flexible and easy reprogramming of the microcontroller's firmware, essential for updates and customization.

Low Power Mode: YES

Enables power-efficient operation, prolonging battery life and reducing energy consumption in portable devices.

Technical Specifications

Microcontrollers STM32H750XBH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B265

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

168

No. of Serial I/Os:

9

No. of Terminals:

265

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA265,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

1085440

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

400 rpm

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

FDCAN, ETHERNET, I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), SPI(6), SPDIFRX, UART(4), USART(4), USB

Peripherals:

AES, BOR, COMPARATOR(2), CRC, DMA(16), LCD, POR, PVD, PWM, RNG, TIMER(20), WDT(2)

Analog To Digital Convertors:

36-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H750XBH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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