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LPC54606J512BD208E

NXP Semiconductors

LPC54606J512BD208E by NXP Semiconductors

NXP Semiconductors' LPC54606J512BD208E microcontroller features a 32-bit CORTEX-M4 CPU, 12-Ch 12-Bit ADC, and 171 I/O lines. With a max clock frequency of 25 MHz, it is suitable for applications requiring high-speed data processing and connectivity via I2C, I2S, SPI, USART, and USB interfaces. The microcontroller operates within a temperature range of -40 to 85°C and offers extensive peripheral support including BOD, DMA(30), RTC, TIMER(8), and WDT functionalities.

Median Price

$7.661

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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DigiKey

USA . 161 parts In-Stock

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$6.740

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Flip Electronics (Authorized)

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Verical

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Nova Conductors

Japan . 500 parts In-Stock

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$5.627

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Chip Stock

USA . 15,600 parts In-Stock

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Vyrian

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Digiode

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Anansix

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Corohmni

South Africa . 714 parts In-Stock

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$5.620

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Continental Prestige Electronics

USA . 2,435 parts In-Stock

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$5.514

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Bastille Electronics

Australia . 800 parts In-Stock

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$5.627

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$5.346

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$5.078

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$5.008

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$5.627

$5.346

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$5.008

Ampacity Inc.

Singapore . 161 parts In-Stock

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$5.730

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Semicontronic

India . 161 parts In-Stock

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$5.730

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$5.558

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$5.739

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AZTECH Wire

Italy . 789 parts In-Stock

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Microchip USA

USA . 2,241 parts In-Stock

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Aztec Data Supply Inc.

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UNI Independent Distributors

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Lixinc

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Corphita

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Vigor

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Argo Parts USA

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Perfect Parts

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Authorized Procurement Solutions

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Overview

Experience seamless performance and cutting-edge innovation with the LPC54606J512BD208E by NXP Semiconductors. As a leader in the industry, NXP Semiconductors delivers top-quality microcontrollers that are perfect for a wide range of applications. From smart home devices to industrial automation, this microcontroller offers unparalleled value, benefits, and advantages to customers. Trust NXP Semiconductors to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, making the product suitable for compact and modern electronic designs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, providing flexibility in power supply options for various applications.

Address Bus Width: 14

Allows for efficient memory addressing and data access, contributing to overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape simplifies PCB layout and mounting, making it easier to fit into tight spaces within electronic devices.

Bit Size: 32

32-bit architecture enables high-speed processing and complex calculations, making the microcontroller suitable for demanding tasks.

No. of Terminals: 208

Large number of terminals provide extensive connectivity options and interfaces for peripheral devices, enhancing overall functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack and low profile design with fine pitch terminals enable space-saving and high-density PCB layout, ideal for compact electronic designs.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance under challenging environmental conditions, suitable for industrial applications.

CPU Family: CORTEX-M4

Utilizing Cortex-M4 architecture provides high performance, low power consumption, and advanced features for embedded applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the microcontroller to function in harsh environments, making it suitable for outdoor or industrial use.

ADC Channels: YES

Built-in analog-to-digital converters allow for precise measurement and conversion of analog signals, essential for sensor interfacing and data acquisition.

DMA Channels: YES

Integrated DMA channels facilitate efficient data transfer between peripherals and memory, improving system performance and reducing CPU workload.

Terminal Position: QUAD

Quad terminal configuration offers increased connectivity options and ease of connection, enhancing the versatility of the microcontroller in various applications.

ROM Words: 524288

Large on-chip ROM storage capacity allows for storing firmware, programs, and data, offering extensive memory for application development.

Width: 28 mm

Compact width dimension enables the microcontroller to be integrated into space-constrained designs, suitable for portable and electronic devices.

External Data Bus Width: 16

16-bit external data bus supports efficient data transfer between external devices and the microcontroller, enhancing overall system performance.

Peripherals: BOD, DMA(30), RTC, TIMER(8), WDT

Wide range of built-in peripherals including Brown-Out Detector, DMA channels, Real-Time Clock, Timers, and Watchdog Timer enhance system functionality and flexibility.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency allows for fast operation and real-time processing, making the microcontroller suitable for high-speed applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering and manufacturing processes, improving the durability and quality of the final product.

Length: 28 mm

Compact length dimension enables space-efficient placement on PCBs, contributing to overall miniaturization of electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture in a microcontroller design offers high performance, low power consumption, and efficient instruction execution for embedded systems.

RAM Bytes: 163840

Generous on-chip RAM capacity provides ample storage for data and variables, essential for multitasking and data processing in embedded applications.

Terminal Form: GULL WING

Gull wing terminal form factor ensures secure and reliable connection to the PCB, improving the robustness and durability of the overall electronic system.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple 12-bit analog-to-digital converters enable simultaneous and precise conversion of analog signals from various sensors, expanding the microcontroller's input capabilities.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation, supporting the overall performance and longevity of the microcontroller.

PWM Channels: YES

Built-in Pulse Width Modulation channels offer control over voltage levels and signal frequencies, essential for motor control, power regulation, and dimming applications.

Connectivity: I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Multiple connectivity options including I2C, I2S, SPI, USART, and USB interfaces provide versatile communication capabilities for interfacing with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updating and customization, essential for adapting the microcontroller to specific application requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and precise soldering, contributing to the reliability and durability of the microcontroller in operation.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability in various environmental conditions.

Speed: 180 rpm

Operates at a speed of 180 revolutions per minute, suitable for controlling motors and generating precise timing signals in motion control and automation applications.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM enables efficient storage and execution of program instructions, contributing to the microcontroller's processing capabilities.

No. of I/O Lines: 171

Large number of input/output lines provide extensive interfacing options for connecting external devices and peripherals, enhancing the microcontroller's versatility in system integration.

Technical Specifications

Microcontrollers LPC54606J512BD208E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

171

No. of Terminals:

208

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

163840

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Peripherals:

BOD, DMA(30), RTC, TIMER(8), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54606J512BD208E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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