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MK70FN1M0VMJ15R

NXP Semiconductors

MK70FN1M0VMJ15R by NXP Semiconductors

NXP Semiconductors' MK70FN1M0VMJ15R is a 32-bit microcontroller with 256 terminals, operating at up to 60 MHz. It features 2 DAC and 4 ADC channels, suitable for applications requiring high-speed data processing and precision analog-to-digital conversion. With a wide range of peripherals including CAN, Ethernet, and UART, it is ideal for industrial automation and communication systems.

Median Price

$22.217

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,894 parts In-Stock

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$27.990

100+ parts

$19.480

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$17.800

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$27.990

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Verical

USA . 1,000 parts In-Stock

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$16.444

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$16.444

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Nova Conductors

Japan . 10 parts In-Stock

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$20.386

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$20.386

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Digiode

USA . 3,487 parts In-Stock

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$25.802

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Vyrian

USA . 2,886 parts In-Stock

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Anansix

USA . 1,518 parts In-Stock

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Semtec, LLC

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Chip Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,862 parts In-Stock

1+ parts

$20.114

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$20.114

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$20.114

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Corohmni

South Africa . 675 parts In-Stock

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$20.114

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Continental Prestige Electronics

USA . 5,930 parts In-Stock

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$20.386

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$19.978

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$19.978

Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$20.717

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$19.682

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$19.682

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Ampacity Inc.

Singapore . 916 parts In-Stock

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$23.090

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One Stop Electronics

USA . 906 parts In-Stock

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Corphita

USA . 3,463 parts In-Stock

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Aztec Data Supply Inc.

USA . 338 parts In-Stock

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Semicontronic

India . 622 parts In-Stock

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$50.250

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$48.994

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$48.742

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Microchip USA

USA . 2,925 parts In-Stock

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Lixinc

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UNI Independent Distributors

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Argo Parts USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Netroflash

USA . 1,000 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

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Overview

Unleash the power of innovation with the MK70FN1M0VMJ15R microcontroller by NXP Semiconductors. This cutting-edge device offers unparalleled quality and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications, the MK70FN1M0VMJ15R provides customers with exceptional value and benefits. Experience seamless connectivity, advanced features, and superior performance with this top-of-the-line product. Upgrade your projects and stay ahead of the curve with the MK70FN1M0VMJ15R microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Easy to integrate into surface mount PCB designs.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options.

Package Shape: SQUARE

Efficient use of board space for compact designs.

Bit Size: 32

Suitable for handling complex computing tasks.

DAC Channels: YES

Allows for high-quality analog output capabilities.

No. of Terminals: 256

Sufficient connectivity for a wide range of peripherals.

Package Style: GRID ARRAY, LOW PROFILE

Enables a low-profile design for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Supports low-power operation for energy-efficient designs.

CPU Family: CORTEX-M4

Offers high performance and efficiency for various applications.

Minimum Operating Temperature: -40 °C

Suitable for harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

Ensures reliable terminal connections for robust performance.

ADC Channels: YES

Enables accurate analog-to-digital conversion for sensor interfacing.

DMA Channels: YES

Facilitates efficient data transfer and processing capabilities.

Terminal Position: BOTTOM

Simplifies PCB layout and routing for easier assembly.

ROM Words: 1048576

Sufficient memory capacity for storing program instructions and data.

Digital To Analog Convertors: 2-Ch 12-Bit

Provides precise control over analog output signals.

Width: 17 mm

Compact form factor for space-saving designs.

Peripherals: COMPARATOR(4), DMA(32), POR, RTC, TIMER(23)

Offers a wide range of integrated peripherals for added functionality.

Maximum Clock Frequency: 60 MHz

High-speed processing capability for demanding applications.

Maximum Time At Peak Reflow Temperature: 40s

Suitable for efficient and reliable soldering processes.

Peak Reflow Temperature: 260C

Ensures proper soldering without component damage.

Length: 17 mm

Compact size for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing.

RAM Bytes: 131072

Provides ample memory for data storage and processing.

Technology: CMOS

Offers low power consumption and high noise immunity.

Terminal Form: BALL

Ensures reliable connections with the PCB.

Analog To Digital Convertors: 4-Ch 16-Bit

Enables high-resolution analog input functionality.

Nominal Supply Voltage: 2.5 V

Standard supply voltage for compatibility with common power sources.

PWM Channels: YES

Supports flexible pulse-width modulation for precise control.

Connectivity: CAN(2), ETHERNET, I2C(2), I2S(2), SPI(3), UART(6)

Enables versatile communication options for interfacing with other devices.

ROM Programmability: FLASH

Allows for easy and quick updates of program code.

Terminal Pitch: 1 mm

Standard pitch for easy PCB layout and assembly.

Moisture Sensitivity Level (MSL): 3

Suitable for a wide range of environmental conditions.

Speed: 150 rpm

Provides high-speed processing capabilities for real-time applications.

On Chip Program ROM Width: 8

Efficient use of on-chip memory for program storage.

No. of I/O Lines: 128

Offers ample input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers MK70FN1M0VMJ15R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

128

No. of Terminals:

256

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(2), I2S(2), SPI(3), UART(6)

Peripherals:

COMPARATOR(4), DMA(32), POR, RTC, TIMER(23)

Analog To Digital Convertors:

4-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MK70FN1M0VMJ15R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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