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MK70FN1M0VMJ12R

NXP Semiconductors

MK70FN1M0VMJ12R by NXP Semiconductors

NXP Semiconductors' MK70FN1M0VMJ12R microcontroller features 32-bit architecture, 256 terminals, and a max clock frequency of 32 MHz. Ideal for industrial applications requiring high-speed processing with DAC, ADC, and PWM channels for precise control.

Median Price

$20.204

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$20.204

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Flip Electronics

USA . 3,000 parts In-Stock

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Digiode

USA . 2,489 parts In-Stock

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2,489

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Vyrian

USA . 742 parts In-Stock

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742

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Anansix

USA . 258 parts In-Stock

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258

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Distributors (Availability)

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One Stop Electronics

USA . 2,393 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 742 parts In-Stock

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$13.558

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742

$13.558

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Semicontronic

India . 1,474 parts In-Stock

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$16.000

100+ parts

$15.600

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$15.520

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1,474

$16.000

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$15.520

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Continental Prestige Electronics

USA . 3,246 parts In-Stock

1+ parts

$19.326

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$18.939

3,246

$19.326

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$18.939

Corohmni

South Africa . 608 parts In-Stock

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$19.502

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608

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$20.087

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$19.083

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$19.083

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Netroflash

USA . 50 parts In-Stock

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$20.204

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Modulus Dynamics

Lithuania . 200 parts In-Stock

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$21.647

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$21.431

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$20.782

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200

$21.647

$21.431

$20.782

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Aztec Data Supply Inc.

USA . 309 parts In-Stock

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$28.733

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$28.733

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Ampacity Inc.

Singapore . 910 parts In-Stock

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$35.000

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$35.000

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Microchip USA

USA . 613 parts In-Stock

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$53.730

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$52.790

1k+ parts

$52.330

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$51.860

613

$53.730

$52.790

$52.330

$51.860

UNI Independent Distributors

Spain . 7,723 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Robosynatics

Brazil . 3,000 parts In-Stock

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$17.290

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$17.290

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$17.290

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$17.290

Lucentia Tech

USA . 3,000 parts In-Stock

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$17.290

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$17.290

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$17.290

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Corphita

USA . 2,516 parts In-Stock

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Argo Parts USA

USA . 2,395 parts In-Stock

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Overview

Unleash the power of innovation with the cutting-edge MK70FN1M0VMJ12R microcontroller from NXP Semiconductors. Crafted with precision and expertise, this device offers unparalleled performance and reliability in a wide range of applications. Whether you're designing consumer electronics or industrial automation systems, this microcontroller is your go-to solution for seamless integration and high-speed processing. Elevate your projects with the advanced features and robust design of the MK70FN1M0VMJ12R, and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for versatile power supply options, accommodating a wide range of input voltages.

Package Shape: SQUARE

Square package shape helps optimize space utilization on the circuit board.

Bit Size: 32

32-bit processing offers high computing power and performance for complex operations.

DAC Channels: YES

Digital-to-analog converter channels enable accurate conversion of digital signals to analog outputs.

No. of Terminals: 256

Large number of terminals provide ample connectivity options for additional components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Low-profile grid array package style offers efficient heat dissipation and compact design.

Minimum Supply Voltage: 1.71 V

Allows for operation at low voltages, conserving power and extending battery life.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments without affecting functionality.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish ensures reliable connectivity and long-term durability.

ADC Channels: YES

Analog-to-digital converter channels facilitate precise conversion of analog signals to digital data.

DMA Channels: YES

Direct memory access channels enhance data transfer speed and efficiency for improved performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies board layout and allows for easier integration into the system.

Maximum Seated Height: 1.7 mm

Low seated height minimizes the overall profile of the product, making it suitable for compact device designs.

Width: 17 mm

Compact width dimension enables space-efficient placement on the circuit board.

Maximum Clock Frequency: 32 MHz

High clock frequency supports fast data processing and execution speed for efficient operation.

Maximum Time At Peak Reflow Temperature (s): 40

Long reflow time at peak temperature ensures uniform soldering and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature complies with industry standards for reliable soldering and assembly.

Length: 17 mm

Compact length dimension contributes to space-saving design and efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable performance in demanding operational environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient processing capabilities for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and enhances solder joint reliability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliable operation.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog outputs for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of features.

Terminal Pitch: 1 mm

Fine terminal pitch facilitates high-density mounting and compact layout on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during assembly.

Speed: 120 rpm

High speed capability supports quick data processing and efficient system performance.

No. of I/O Lines: 128

Ample I/O lines provide flexibility for connecting external devices and peripherals for enhanced functionality.

Technical Specifications

Microcontrollers MK70FN1M0VMJ12R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

128

No. of Terminals:

256

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MK70FN1M0VMJ12R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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