Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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FS32R274VBK2MMM
NXP Semiconductors
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
e2
3
260
TIN SILVER
40
MICROCONTROLLER, RISC
FS32R274VBK2VMM
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
FS32R274VCK2MMM
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Terminal Finish: TIN SILVER;
FS32R274VCK2VMM
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; JESD-609 Code: e2;
LPC54605J512ET180E
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 180; Package Code: TFBGA; Package Shape: SQUARE;
YES
21
32
CORTEX-M4
25 MHz
NO
16
S-PBGA-B180
12 mm
145
180
8
105 Cel
-40 Cel
PLASTIC/EPOXY
TFBGA
SQUARE
GRID ARRAY, THIN PROFILE, FINE PITCH
204800
524288
FLASH
1.2 mm
180 rpm
3.6 V
1.71 V
1.8 V
CMOS
INDUSTRIAL
BALL
.8 mm
BOTTOM
16K
I2C, I2S, SPI, USART, USB
BOD, DMA(30), MMC, POR, RTC, SD, TEMPERATURE SENSOR, TIMER(10), WDT
12-Ch 12-Bit
LPC802M001JDH16
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
0
R-PDSO-G16
5 mm
1
13
TSSOP
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
2048
16384
1.1 mm
15 rpm
GULL WING
.65 mm
DUAL
4.4 mm
I2C, SPI, UART(2)
BOD, COMPARATOR, POR, TIMER(5), WDT
8-Ch 12-Bit
MVF30NN152CKU26
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; ADC Channels: YES;
24 MHz
e3
24 mm
176
LQFP
FLATPACK
500 rpm
3 V
3.3 V
TIN
.5 mm
QUAD
LPC1112FHN33/102,5
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: HVQCCN; Package Shape: SQUARE;
CORTEX-M0
S-PQCC-N33
e4
7 mm
28
33
85 Cel
HVQCCN
LCC32,.27SQ,25
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
3.3
Not Qualified
1 mm
50 rpm
Microcontrollers
NICKEL PALLADIUM GOLD
NO LEAD
30
I2C, SPI, UART
BOD, POR, TIMER(5), WDT
8-Ch 10-Bit
LPC4078FBD208,551
NXP Semiconductors' LPC4078FBD208,551 is a 32-bit microcontroller with Cortex-M4 CPU family. It features 26-bit address bus width, 3.3V power supplies, and 165 I/O lines. Ideal for industrial applications requiring CAN, Ethernet, USB connectivity and peripherals like BOD, RTC, and WDT.
2 GENERAL PURPOSE PWMS WITH SIX OUTPUTS, ONE MOTOR CONTROL PWM
26
S-PQFP-G208
28 mm
2
165
208
LFQFP
QFP208,1.2SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
98304
1.6 mm
120 rpm
2.4 V
4032
CAN(2), ETHERNET, I2C(3), I2S, MMC, SD, UART(5), USB
BOD, COMPARATOR(2), DMA(8), POR, QEI, RTC, TIMER(5), WDT
1-Ch 10-Bit
SPC5748GBK0ACKU6
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE;
EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORTS CAN FD
E200Z4
40 MHz
S-PQFP-G176
96
115
HLFQFP
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
786432
6291456
ISO 26262
160 rpm
1.32 V
1.08 V
1.2 V
I2C(4), I2S(3), SPI(10), USB(2)
COMPARATOR(3), DMA(32), POR, RTC, TIMER(115), WDT(4)
80-Ch 10-Bit, 64-Ch 12-Bit
SPC5748GGK1VMJ6
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORT CAN FD, 2ND ETHERNET
S-PBGA-B256
17 mm
256
LBGA
GRID ARRAY, LOW PROFILE
1.7 mm
SPC5748GSK0AMKU6
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE;
EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE
125 Cel
AUTOMOTIVE
SPC5748GSK1MKU6R
SPC5748GSK1MKU6
SPC5748GSK1MMJ6R
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
SPC5748GSK1MMJ6
NXP Semiconductors' SPC5748GSK1MMJ6 microcontroller features a 32-bit CPU, 786432 bytes of RAM, and 6291456 ROM words. Ideal for automotive applications with ISO 26262 screening level, it offers 80-Ch 10-Bit ADC channels and connectivity options like I2C(4), SPI(10), USB(2).
SPC5748GSK1MMN6
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE;
S-PBGA-B324
19 mm
324
SPC5748GTK0AMKU6
EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORTS 2ND ETHERNET
SPC5748GTK0AMMJ6
SPC5748GTK0AVKU6
SPC5748GTK1MMJ6R
SPC5748GTK1MMJ6
SPC5748GK0AVKU6
MWCT1014SFVLLR
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
CORTEX-M4F
FLOATING POINT
S-PQFP-G100
14 mm
89
100
6
QFP100,.63SQ,20
65536
112 rpm
30 mA
5.5 V
2.7 V
4K
I2C, LIN(3), LPUART(3), SPI(3)
DMA(16), RTC, TIMER(6), WDT
16-Ch 12-Bit
1-Ch 8-Bit
MWCT1015SFVLLR
131072
1048576
64K
DMA(16), RTC, TIMER(8), WDT
24-Ch 12-Bit
SPC5777CAK3MME3R
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
S-PBGA-B416
27 mm
416
BGA
GRID ARRAY
8388608
2.02 mm
264 rpm
CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)
DMA(128), PWM, TEMPERATURE SENSOR
SPC5777CAK3MME3
The NXP Semiconductors SPC5777CAK3MME3 microcontroller features a 32-bit architecture, 416 terminals, and 8388608 ROM words. Ideal for automotive applications, it offers peripherals like DMA(128), PWM, and temperature sensor support. With a max clock frequency of 40 MHz and connectivity options including CAN(4) and ETHERNET, this CMOS technology-based microcontroller is designed for high-performance automotive systems.
SPC5777CDK3MME3R
CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)
SPC5777CDK3MME3
The NXP Semiconductors SPC5777CDK3MME3 microcontroller features a 32-bit architecture with 8388608 ROM words and 524288 RAM bytes. It offers peripherals like DMA(128), PWM, and temperature sensor, suitable for automotive applications. With CAN(6), DSPI(5), EBI, Ethernet, and SCI(5) connectivity options, it operates at a max clock frequency of 40 MHz in an automotive-grade package.
SPC5777CDK3MMO3R
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
S-PBGA-B516
516
SPC5777CLK3MME3R
SPC5777CLK3MME3
SPC5777CLK3MMO3R
NXP SPC5777CLK3MMO3R is a 32-bit microcontroller with 516 terminals, operating at up to 40 MHz. It features ADC and DMA channels, along with peripherals like PWM and temperature sensor. Ideal for automotive applications due to its flash ROM programmability, CAN, DSPI, Ethernet connectivity, and wide temperature range from -40°C to 125°C.
SPC5777CLK3MMO3
NXP Semiconductors' SPC5777CLK3MMO3 is a 32-bit microcontroller with 8388608 ROM words and 524288 RAM bytes. It features CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) connectivity and peripherals like DMA(128) and PWM. Ideal for automotive applications with an operating temperature range of -40 to 125 °C and a max clock frequency of 40 MHz.
SPC5777CRK3MME3
SPC5777CRK3MMO3
SPC5777CSK3MME3R
SPC5777CSK3MME3
SPC5777CSK3MMO3R
SPC5777CSK3MMO3
MK27FN2M0AVMI15
NXP Semiconductors' MK27FN2M0AVMI15 microcontroller features a 32-bit Cortex-M4 CPU, 1048576 bytes of RAM, and 2097152 ROM words. With integrated DAC and ADC channels, it's ideal for applications requiring low power consumption and high-speed connectivity via I2C, I2S, SPI, UART, and USB interfaces. The microcontroller operates b/w -40 to 105°C with a max clock frequency of 32 MHz.
32 MHz
FLOATING-POINT
S-PBGA-B169
9 mm
120
169
LFBGA
BGA169,13X13,25
GRID ARRAY, LOW PROFILE, FINE PITCH
2097152
1.28 mm
150 rpm
300 mA
I2C(4), I2S(2), SPI(4), UART(5), USB(2)
DMA(32), RTC, TIMER(26), WDT
1-Ch 16-Bit
1-Ch 12-Bit; 2-Ch 6-Bit
LPC1114FBD48/323J
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Maximum Clock Frequency: 25 MHz;
42
48
8192
49152
I2C, SPI(2), UART
BOD, POR, TIMER(4), WDT
LPC1114FHN33/303Y
MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Supply Voltage: 1.8 V;
32768
LPC1115FET48/303Y
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: SQUARE; Length: 4.5 mm;
4.5 mm
LPC11E37HFBD64/4QL
NXP Semiconductors' LPC11E37HFBD64/4QL is a 32-bit microcontroller with 3.6V max supply voltage, 25MHz clock frequency, and 54 I/O lines. Ideal for applications requiring ADC and DMA channels, it features a low-profile flatpack package with quad terminal position.
10 mm
54
64
LPC11U22FBD48/30QL
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Bit Size: 32;
6144
1024
I2C, SSP(2), USB
LPC18S57JET256E
LPC18S57JET256E by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 25 MHz. It has 164 I/O lines and supports ADC and DMA channels, making it suitable for applications requiring precise analog-to-digital conversion and efficient data transfer.
164
LPC43S30FBD144E
NXP Semiconductors' LPC43S30FBD144E microcontroller features a 32-bit CORTEX-M4 CPU with 3.6V max supply voltage and 16-bit address bus width. Ideal for applications requiring CAN, I2C, I2S, SSP, UART connectivity and peripherals like BOD, DMA, POR, PWM, RTC, TIMER, WDT. Operating temp range -40 to 85 °C.
20 mm
83
144
2700336
n/s
204 rpm
2.2 V
CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)
BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT
8-Ch 10-Bit (2)
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