Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SPC5607BK0MLQ6
NXP Semiconductors
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Length: 20 mm;
YES
0
32
16 MHz
e3
20 mm
3
121
144
LQFP
SQUARE
FLATPACK, FINE PITCH
260
64 rpm
5.5 V
4.5 V
5 V
TIN
GULL WING
.5 mm
QUAD
40
MICROCONTROLLER, RISC
SPC5607BK0VLL6R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Bit Size: 32;
14 mm
77
100
LFQFP
FLATPACK, LOW PROFILE, FINE PITCH
SPC5607BK0VLL6
NXP Semiconductors' SPC5607BK0VLL6 microcontroller features 32-bit architecture, 100 terminals, and a max clock frequency of 16 MHz. Ideal for applications requiring ADC and DMA channels, with a low profile square package style suitable for various electronic devices.
SPC5607BK0VLQ6R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
SPC5607BK0VLU6R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; Bit Size: 32;
24 mm
149
176
SPC5607BK0VLU6
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; DMA Channels: YES;
SPC5633MF1MLQ80R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Maximum Clock Frequency: 80 MHz;
80 MHz
80
FLATPACK, LOW PROFILE
80 rpm
1.32 V
1.14 V
1.2 V
SPC5634MF1MLQ60
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LQFP; Package Shape: SQUARE; Speed: 60 rpm;
60 rpm
SPC5634MF1MLU60
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
SPC5643LFK0MLQ1R
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
SPC5643LFK0MLQ1
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
SPC5643LFK0MMM1R
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2;
e2
TIN SILVER
SPC5643LFK0MMM1
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Peak Reflow Temperature (C): 260;
SPC5643LK0MLQ1R
MICROCONTROLLER, RISC; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
SPC5643LK0MLQ1
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
SPC5644BF0MLU8R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; On Chip Program ROM Width: 8;
E200Z4D
40 MHz
NO
FLOATING POINT
S-PQFP-G176
147
9
8
125 Cel
-40 Cel
PLASTIC/EPOXY
QFP176,1.0SQ,20
131072
1572864
FLASH
1.6 mm
300 mA
3.6 V
3 V
3.3 V
CMOS
65536
I2C, CAN(6), SCI(10), SPI(8)
DMA(32), RTC, RTI, PWM, TIMER(9), WDT
5-Ch 12-Bit, 27-Ch 10-Bit
SPC5644CCF0MMJ1R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; External Data Bus Width: 0;
S-PBGA-B256
17 mm
199
256
LBGA
BGA256,16X16,40
GRID ARRAY, LOW PROFILE
196608
120 rpm
BALL
1 mm
BOTTOM
I2C, CAN(6), ETHERNET, SCI(10), SPI(8)
10-Ch 12-Bit, 33-Ch 10-Bit
SPC5644CCF0MMJ1
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
SPC5644CF0MMJ1R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Length: 17 mm;
SPC5644CF0MMJ1
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Connectivity: I2C, CAN(6), ETHERNET, SCI(10), SPI(8);
SPC5645BCF0VLU1R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; ROM Words: 2097152;
105 Cel
163840
2097152
SPC5645BCF0VLU1
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
SPC5645BF0VLT1
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; Speed: 120 rpm;
S-PQFP-G208
28 mm
177
208
QFP208,1.2SQ,20
SPC5645SF1CVU
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver (Sn/Ag);
27 mm
416
BGA
GRID ARRAY
125 rpm
1.08 V
Tin/Silver (Sn/Ag)
SPC5646CF0VLT1
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
262144
3145728
Tin (Sn)
SPC5741PK1AMLQ5
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
64
79
QFP
FLATPACK
200 rpm
3.15 V
SPC5742PFK1AKLQ5
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Maximum Clock Frequency: 40 MHz;
SPC5742PK1AMLQ5
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Maximum Supply Voltage: 3.6 V;
SPC5742PK1AMLQ8
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Surface Mount: YES;
SPC5743PFK1AMLQ9
NXP Semiconductors' SPC5743PFK1AMLQ9 microcontroller features 32-bit address and external data bus width, with a max clock frequency of 40 MHz. Ideal for applications requiring high-speed processing, it offers ADC and DMA channels, along with 79 I/O lines for versatile connectivity.
SPC5743PK1AMLQ5R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Speed: 200 rpm;
SPC5743PK1AMLQ5
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; JESD-609 Code: e3;
SPC5743RK1MLU5
Microcontrollers; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LQFP; Package Shape: SQUARE; Maximum Clock Frequency: 40 MHz;
1.25 V
SPC5744PFK1AKLQ8
NXP Semiconductors' SPC5744PFK1AKLQ8 microcontroller features 32-bit address bus width, 64-bit external data bus width, and a max clock frequency of 40 MHz. Ideal for applications requiring high-speed processing and advanced control functionalities such as automotive engine management systems.
SPC5744PFK1AMLQ9
NXP Semiconductors' SPC5744PFK1AMLQ9 microcontroller features 32-bit architecture, 144 terminals, and 16-Ch 12-Bit ADCs. Ideal for automotive applications requiring ISO 26262 compliance, with CAN, LIN, SPI connectivity options. Operating at up to 40 MHz clock frequency with low power mode support.
SPC5744P
FLOATING-POINT
S-PQFP-G144
99
5
10
QFP144,.86SQ,20
393216
2621440
ISO 26262
610 mA
1.19 V
CAN(3), LIN(2), SPI(4), SENT(2)
DMA(32), POR, PWM(12), TIMER(10), WDT
16-Ch 12-Bit(4)
SPC5744PK1AMLQ5R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Address Bus Width: 32;
PN7360AUHN/C300Y
MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
27.12 MHz
e4
9 mm
21
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
20 rpm
1.95 V
1.65 V
1.8 V
NICKEL PALLADIUM GOLD
NO LEAD
30
MC68HC11E1VFNE3R
MC68HC11E1VFNE3R by NXP Semiconductors is an 8-bit microcontroller with 16-bit address bus, 5V nominal voltage, and 12MHz max clock frequency. Widely used in applications requiring ADC channels, it features a square chip carrier package style and J bend terminal form.
16
12 MHz
19.125 mm
38
52
QCCJ
CHIP CARRIER
3 rpm
J BEND
1.27 mm
MICROCONTROLLER
MC908AS60ACFUER
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; DMA Channels: YES;
50
8 rpm
.8 mm
MC908GZ60CFUER
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
32 MHz
53
MC908JK1ECDWER
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
12.8 mm
14
20
SOP
RECTANGULAR
SMALL OUTLINE
DUAL
7.5 mm
MC908LJ24CFUER
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; Length: 14 mm;
MC908QY8CDWER
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN;
MC9RS08KB2CSCR
MC9RS08KB2CSCR by NXP is an 8-bit microcontroller with a clock frequency of 16 MHz, ideal for applications requiring up to 14 I/O lines. With a supply voltage range of 1.8V to 5.5V, this surface-mount device in a small outline package is suitable for compact designs in various electronic systems.
9.9 mm
3.9 mm
MC9S08AC60CPUER
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; JESD-609 Code: e3;
10 mm
54
40 rpm
2.7 V
MC9S08DV32AMLFR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LQFP; Package Shape: SQUARE; Address Bus Width: 0;
7 mm
48
MC9S08FL8CLCR
MC9S08FL8CLCR by NXP Semiconductors is an 8-bit microcontroller with a max clock frequency of 16 MHz and 30 I/O lines. It features PWM and ADC channels, suitable for applications requiring precise control and data acquisition. The compact square package with low profile makes it ideal for space-constrained designs in various electronic devices.
MC9S08LL64CLKR
MC9S08LL64CLKR by NXP Semiconductors is an 8-bit microcontroller with a max clock frequency of 20 MHz. It features 80 terminals, ADC and PWM channels, suitable for applications requiring low profile, fine pitch packages. Operating voltage ranges from 1.8V to 3.6V make it ideal for various electronic designs.
20 MHz
39
.65 mm
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