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SPC5644CCF0MMJ1R

NXP Semiconductors

SPC5644CCF0MMJ1R by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; External Data Bus Width: 0;

Median Price

$40.814

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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$40.814

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Distributors (In-Stock)

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Vyrian

USA . 3,859 parts In-Stock

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3,859

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Digiode

USA . 1,612 parts In-Stock

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Anansix

USA . 1,379 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 456 parts In-Stock

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$14.000

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456

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AZTECH Wire

Italy . 169 parts In-Stock

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$21.030

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Vigor

Singapore . 3,572 parts In-Stock

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$61.380

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Component Stockers USA

USA . 278 parts In-Stock

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$533.530

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QUARKTWIN TECHNOLOGY LTD

USA . 13,375 parts In-Stock

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Microchip USA

USA . 3,706 parts In-Stock

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Corphita

USA . 2,119 parts In-Stock

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UNI Independent Distributors

Spain . 1,131 parts In-Stock

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Technical Specifications

Microcontrollers SPC5644CCF0MMJ1R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4D

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e2

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

32

No. of I/O Lines:

199

No. of Terminals:

256

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

196608

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

I2C, CAN(6), ETHERNET, SCI(10), SPI(8)

Peripherals:

DMA(32), RTC, RTI, PWM, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 12-Bit, 33-Ch 10-Bit

Trade Compliance

SPC5644CCF0MMJ1R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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