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STM32F410CBU6

STMicroelectronics

STM32F410CBU6 by STMicroelectronics

STM32F410CBU6 by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 26 MHz. It features 10-Ch 12-Bit ADC channels, 1-Ch 12-Bit DAC channels, and has a square package. This microcontroller is commonly used in industrial applications requiring high-speed processing and analog-to-digital conversion capabilities.

Median Price

$3.785

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12 parts In-Stock

1+ parts

$2.496

100+ parts

$2.027

1k+ parts

$1.943

10k+ parts

-

12

$2.496

$2.027

$1.943

-

Mouser Electronics

USA . 2,139 parts In-Stock

1+ parts

$3.710

100+ parts

$2.550

1k+ parts

$2.250

10k+ parts

$2.210

2,139

$3.710

$2.550

$2.250

$2.210

DigiKey

USA . 1,697 parts In-Stock

1+ parts

$3.860

100+ parts

$2.416

1k+ parts

$2.214

10k+ parts

$2.089

1,697

$3.860

$2.416

$2.214

$2.089

Chip1Stop

Japan . 265 parts In-Stock

1+ parts

$4.813

100+ parts

$2.617

1k+ parts

$2.435

10k+ parts

-

265

$4.813

$2.617

$2.435

-

Avnet

USA . 1,560 parts In-Stock

1+ parts

-

100+ parts

-

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1,560

-

-

-

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EBV Elektronik

Germany . 260 parts In-Stock

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-

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260

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Verical

USA . 12 parts In-Stock

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-

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-

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12

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$3.540

-

-

-

Maritex

Poland . 1,443 parts In-Stock

1+ parts

$3.897

100+ parts

$2.351

1k+ parts

$1.987

10k+ parts

-

1,443

$3.897

$2.351

$1.987

-

Digiode

USA . 2,541 parts In-Stock

1+ parts

$4.572

100+ parts

-

1k+ parts

-

10k+ parts

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2,541

$4.572

-

-

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RLX Solution Inc.

Canada . 6,240 parts In-Stock

1+ parts

-

100+ parts

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-

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6,240

-

-

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Chip Stock

USA . 6,173 parts In-Stock

1+ parts

-

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6,173

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Vyrian

USA . 1,725 parts In-Stock

1+ parts

-

100+ parts

-

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1,725

-

-

-

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Anansix

USA . 710 parts In-Stock

1+ parts

-

100+ parts

-

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710

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-

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Sensible Micro Corp

USA . 527 parts In-Stock

1+ parts

-

100+ parts

-

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527

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,568 parts In-Stock

1+ parts

$2.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,568

$2.380

-

-

-

Semicontronic

India . 1,285 parts In-Stock

1+ parts

$2.380

100+ parts

$2.320

1k+ parts

$2.309

10k+ parts

-

1,285

$2.380

$2.320

$2.309

-

Continental Prestige Electronics

USA . 3,995 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

$3.469

3,995

$3.540

-

-

$3.469

Argo Parts USA

USA . 2,369 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

$3.540

-

-

-

Modulus Dynamics

Lithuania . 48 parts In-Stock

1+ parts

$3.898

100+ parts

$3.859

1k+ parts

$3.742

10k+ parts

-

48

$3.898

$3.859

$3.742

-

Component Stockers USA

USA . 14,852 parts In-Stock

1+ parts

$4.110

100+ parts

$3.250

1k+ parts

$2.490

10k+ parts

$2.470

14,852

$4.110

$3.250

$2.490

$2.470

Corphita

USA . 4,674 parts In-Stock

1+ parts

$4.332

100+ parts

-

1k+ parts

-

10k+ parts

-

4,674

$4.332

-

-

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Vigor

Singapore . 1,280 parts In-Stock

1+ parts

$4.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,280

$4.710

-

-

-

Microchip USA

USA . 945 parts In-Stock

1+ parts

$16.320

100+ parts

$16.090

1k+ parts

$15.970

10k+ parts

$15.860

945

$16.320

$16.090

$15.970

$15.860

IDEA Electronic Components Group

UK . 704 parts In-Stock

1+ parts

$25.265

100+ parts

-

1k+ parts

$22.739

10k+ parts

-

704

$25.265

-

$22.739

-

Corohmni

South Africa . 750 parts In-Stock

1+ parts

$30.939

100+ parts

-

1k+ parts

-

10k+ parts

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750

$30.939

-

-

-

Aztec Data Supply Inc.

USA . 276 parts In-Stock

1+ parts

$44.400

100+ parts

-

1k+ parts

-

10k+ parts

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276

$44.400

-

-

-

MKK Technologies

India . 1,496 parts In-Stock

1+ parts

$47.509

100+ parts

-

1k+ parts

-

10k+ parts

-

1,496

$47.509

-

-

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DigiPath Technology Company

USA . 1,496 parts In-Stock

1+ parts

$47.509

100+ parts

-

1k+ parts

-

10k+ parts

-

1,496

$47.509

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$74.289

100+ parts

$70.574

1k+ parts

$70.574

10k+ parts

-

2,500

$74.289

$70.574

$70.574

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Perfect Parts

USA . 271,980 parts In-Stock

1+ parts

-

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271,980

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RC Electronics

USA . 6,823 parts In-Stock

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6,823

-

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Lixinc

USA . 4,361 parts In-Stock

1+ parts

-

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4,361

-

-

-

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Epart123

USA . 3,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.800

10k+ parts

$8.800

3,120

-

-

$8.800

$8.800

Parana Technologies

USA . 2,202 parts In-Stock

1+ parts

-

100+ parts

$30.208

1k+ parts

-

10k+ parts

-

2,202

-

$30.208

-

-

Robosynatics

Brazil . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Lucentia Tech

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.528

1k+ parts

$2.528

10k+ parts

$2.528

1,000

-

$2.528

$2.528

$2.528

Kepictronics

USA . 932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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932

-

-

-

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Eastek

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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780

-

-

-

-

Overview

Discover the STM32F410CBU6 microcontroller by STMicroelectronics, a high-quality and reliable solution for various applications. With its advanced technology and impressive peripherals, this microcontroller offers numerous benefits and advantages to customers. From its wide range of connectivity options to its efficient power management, the STM32F410CBU6 ensures seamless performance and flexibility. Whether you're designing industrial equipment or building consumer electronics, this versatile microcontroller is your go-to choice. Trust STMicroelectronics for superior products that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

The microcontroller is designed for surface mounting, allowing for easier integration into electronic devices without the need for through-hole soldering. This makes it a convenient choice for compact and space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile and suitable for various power supply configurations.

Package Shape: SQUARE

The square package shape ensures a compact footprint, enabling efficient use of board space in electronic designs. This makes it an ideal choice for small-sized applications where space optimization is essential.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers enhanced computational power and performance compared to lower bit variants. It is well-suited for complex tasks and applications that require high-speed processing.

DAC Channels: YES

The presence of digital-to-analog converter (DAC) channels allows the microcontroller to convert digital signals into analog outputs accurately. This makes it suitable for applications involving audio, voltage control, or sensor interfacing.

No. of Terminals: 48

With 48 terminals, this microcontroller offers a sufficient number of connection points for interfacing with various external components and peripherals, enabling flexible and expanded functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides a combination of chip carrier, heat sink/slug, and a very thin profile. It offers efficient thermal dissipation, compact form factor, and durability, making it ideal for applications with thermal constraints.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage requirement allows the microcontroller to operate with lower power sources, making it energy-efficient and suitable for battery-powered or low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand elevated temperatures without compromising its performance and reliability. It is suitable for harsh environments or applications subjected to heat stress.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate reliably at extremely low temperatures makes it suitable for applications in cold environments or where temperature variations are significant.

Terminal Finish: MATTE TIN

The use of matte tin as the terminal finish provides corrosion resistance and solderability, ensuring a reliable electrical connection. This makes it a durable choice for applications exposed to environmental factors.

ADC Channels: YES

The microcontroller includes analog-to-digital converter (ADC) channels, allowing it to convert analog signals into digital form accurately. This makes it suitable for applications involving sensor interfaces, data acquisition, and analog signal processing.

DMA Channels: YES

The presence of direct memory access (DMA) channels enables efficient and high-speed data transfer between memory and peripherals without CPU intervention. This enhances overall system performance in tasks requiring rapid data handling.

Terminal Position: QUAD

The quad terminal position allows for even distribution of connections around the periphery of the microcontroller, simplifying PCB layout and improving signal integrity. It enhances ease of use and flexibility during system integration.

ROM Words: 131072

With a large ROM capacity of 131,072 words, this microcontroller can store substantial program code, making it suitable for applications that require extensive firmware or software functionalities.

Maximum Seated Height: 0.65 mm

The microcontroller's compact seated height of 0.65 mm ensures low-profile integration, making it suitable for thin and space-restricted applications, such as wearables or miniature electronic devices.

Digital To Analog Convertors: 1-Ch 12-Bit

With a single 12-bit digital-to-analog converter (DAC) channel, the microcontroller can generate accurate analog output signals in various applications, including audio playback and real-time control systems.

Width: 7 mm

The microcontroller's narrow width of 7 mm allows for efficient use of board space, particularly in applications with size constraints. It enables designers to optimize the overall product form factor.

Peripherals: BOR, CRC, DMA(16), PDR, POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

This microcontroller offers a wide range of peripherals, including brown-out reset (BOR), cyclic redundancy check (CRC), direct memory access (DMA), power-down reset (PDR), power-on reset (POR), power voltage detection (PVD), pulse width modulation (PWM), real-time clock (RTC), temperature sensor, timers, and watchdog timers. This extensive peripheral set enhances the microcontroller's versatility and enables support for diverse application requirements.

Maximum Clock Frequency: 26 MHz

With a high maximum clock frequency of 26 MHz, the microcontroller can execute instructions and process data at a faster rate, ensuring efficient performance in demanding real-time applications.

Peak Reflow Temperature °C: 260

The microcontroller's high peak reflow temperature of 260°C allows for reliable and robust solder joint formation during surface mount assembly processes. It ensures secure connections and longevity of the product.

Length: 7 mm

The microcontroller's compact length of 7 mm enables space-saving integration, making it suitable for compact electronic devices or applications with size restrictions.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller operates reliably within specified temperature ranges and is resistant to environmental factors encountered in harsh industrial environments, making it a reliable choice for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller belongs to the microcontroller family and utilizes reduced instruction set computing (RISC) architecture. RISC-based microcontrollers offer efficient instruction execution, simplicity, and code-size optimization compared to complex instruction set computing (CISC) architectures.

RAM Bytes: 32768

With a generous RAM capacity of 32,768 bytes, the microcontroller can store and quickly access data during runtime operations. It enables efficient data manipulation and supports applications requiring substantial temporary storage.

Technology: CMOS

The complementary metal-oxide-semiconductor (CMOS) technology used in this microcontroller ensures low power consumption, enabling longer battery life and energy-efficient operation.

Terminal Form: NO LEAD

The microcontroller utilizes a no-lead terminal form, such as solder balls or pads, enabling reliable soldering and connectivity during manufacturing processes. It offers efficient assembly and facilitates automated soldering techniques.

Analog To Digital Convertors: 10-Ch 12-Bit

Featuring ten 12-bit analog-to-digital converter (ADC) channels, the microcontroller accurately converts analog signals into digital data, making it suitable for applications involving multiple analog sensors or diverse input measurements.

Nominal Supply Voltage: 3.3 V

The microcontroller operates at a stable nominal supply voltage of 3.3 V, providing compatibility with common power supply standards and simplifying integration into various electronic systems.

PWM Channels: YES

With the presence of pulse width modulation (PWM) channels, the microcontroller can generate variable-width digital signals required for tasks such as motor speed control, LED dimming, and audio tone generation.

Connectivity: I2C(3), I2S(3), IRDA, LIN, SPI(3), USART(3)

This microcontroller offers a wide range of connectivity options, including I2C, I2S, infrared data association (IRDA), local interconnect network (LIN), serial peripheral interface (SPI), and universal synchronous/asynchronous receiver-transmitter (USART). The diverse connectivity support enhances compatibility and facilitates communication with external devices or systems.

ROM Programmability: FLASH

The microcontroller's programmable read-only memory (ROM) uses flash technology, allowing easy and flexible firmware or software updates. Flash ROM provides non-volatile storage, ensuring retained data during power cycles or system resets.

Terminal Pitch: 0.5 mm

The microcontroller's narrow terminal pitch of 0.5 mm enables high-density connections on the PCB, accommodating intricate circuit layouts and miniaturized designs.

Moisture Sensitivity Level (MSL): 3

Rated with a moisture sensitivity level (MSL) of 3, this microcontroller has moderate sensitivity to moisture during storage or assembly. Suitable precautions should be taken to prevent moisture-related damage during handling.

Speed: 100 rpm

The microcontroller's speed specification of 100 rpm indicates its capability to handle high-speed processing and real-time operations, making it suitable for applications where rapid data manipulation or response is required.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8 bits, this microcontroller can fetch instructions efficiently, providing fast access to the program code and enhancing overall system performance.

No. of I/O Lines: 36

The microcontroller offers 36 input/output (I/O) lines, facilitating the connection of various external devices or components for data exchange and control operations, expanding the product's functionality and versatility.

Technical Specifications

Microcontrollers STM32F410CBU6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), I2S(3), IRDA, LIN, SPI(3), USART(3)

Peripherals:

BOR, CRC, DMA(16), PDR, POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F410CBU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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