Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MC9S08PA16AVTGR
NXP Semiconductors
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;
YES
0
8
20 MHz
NO
e3
5 mm
3
14
16
TSSOP
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
260
20 rpm
5.5 V
2.7 V
3 V
TIN
GULL WING
.65 mm
DUAL
40
4.4 mm
MICROCONTROLLER
MC9S08PA16AVTJR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of I/O Lines: 18;
6.5 mm
18
20
MC9S08PA16VTJR
MC9S08PA16VTJR by NXP is an 8-bit microcontroller with 20 terminals, operating at a max frequency of 20 MHz. It features ADC and PWM channels, suitable for applications requiring precise analog-to-digital conversion and pulse-width modulation control. With a compact rectangular package style, it's ideal for space-constrained designs in various electronic devices.
MC9S08PA4VWJR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3 V;
12.8 mm
SOP
SMALL OUTLINE
1.27 mm
7.5 mm
MC9S08PA60AVLDR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MC9S08PA60VLFR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
MC9S08PA8AVLDR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE; Nominal Supply Voltage: 3 V;
10 mm
37
44
QFP
SQUARE
FLATPACK
.8 mm
QUAD
MC9S08PA8VTGR
MC9S08PA8VTGR by NXP is an 8-bit microcontroller with a max clock frequency of 20 MHz and 14 I/O lines. It features PWM and ADC channels, suitable for applications requiring precise control and data acquisition in compact designs. The small outline package makes it ideal for space-constrained projects like IoT devices or embedded systems.
MC9S08PA8VTJR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage: 2.7 V;
MC9S08PT16AVTGR
MC9S08PT16AVTGR by NXP Semiconductors is an 8-bit microcontroller with a max clock frequency of 20 MHz. It features 14 I/O lines, PWM channels, and ADC channels, making it suitable for applications requiring precise control and data acquisition. With a small outline package style and dual terminal position, this microcontroller is ideal for compact designs in various electronic devices.
MC9S08PT16VLCR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Bit Size: 8;
7 mm
28
32
LQFP
FLATPACK, LOW PROFILE
MC9S08QE128CFTR
MICROCONTROLLER; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
MC9S12DG128CPVER
MC9S12DG128CPVER by NXP Semiconductors is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 16-Ch 10-Bit ADC channels. It is ideal for industrial applications requiring CAN(2), I2C(2), SCI(2), SPI(2) connectivity and features PWM(8) and TIMER(8) peripherals.
MC9S12D
40 MHz
FIXED POINT
S-PQFP-G112
20 mm
93
112
85 Cel
-40 Cel
PLASTIC/EPOXY
QFP112,.87SQ
8192
131072
FLASH
AEC-Q100
1.6 mm
50 rpm
55 mA
2.75 V
2.35 V
2.5 V
CMOS
INDUSTRIAL
2K
CAN(2), I2C(2), SCI(2), SPI(2)
PWM(8), TIMER(8)
16-Ch 10-Bit
MC9S12DG256CFUER
MC9S12DG256CFUER by NXP is a 16-bit microcontroller with 80 terminals, 16 MHz clock frequency, and ADC channels. Ideal for applications requiring high-speed processing and analog-to-digital conversion capabilities. Suitable for automotive, industrial control, and consumer electronics due to its robust features.
16 MHz
14 mm
59
80
25 rpm
MCF51AC256ACPUER
MICROCONTROLLER, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
MICROCONTROLLER, RISC
MCF51AC256BCFGER
MICROCONTROLLER, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCF5212CAE66R
MICROCONTROLLER, RISC; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCF5213CAF66R
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
MCHSC705C8ACFNER
MICROCONTROLLER; Peak Reflow Temperature (C): 250; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
250
30
MCR908JL3ECDWER
S912XEA128J2CAAR
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
S912XEQ384ACALR
MICROCONTROLLER, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
S912XEQ512BCALR
MICROCONTROLLER, RISC; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
S9S08DZ32F2CLHR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage: 2.7 V;
54
64
40 rpm
.5 mm
S9S12G192F0VLFR
NXP Semiconductors' S9S12G192F0VLFR microcontroller features 16-bit size, 48 terminals, and 5.5V max supply voltage. Ideal for applications requiring a max clock frequency of 16MHz, with PWM channels and ADC support.
48
3.13 V
5 V
S9S12G192F0VLHR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; ADC Channels: YES;
S9S12G240F0MLHR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
S9S12G240F0VLLR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;
86
100
S9S12G48F1CLCR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
26
S9S12G96F0VLHR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Length: 10 mm;
S9S12GNA16F0MLFR
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
S9S12P32J0CFTR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
S9S12P96J0MLHR
MICROCONTROLLER; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
S9S12ZVL32F0MLFR
MICROCONTROLLER; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40;
SP5748CBK0AVKU2R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
E200
FLOATING-POINT
S-PQFP-G176
24 mm
1
176
105 Cel
HLFQFP
HQFP176,1.0SQ,20
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
524288
6291456
ISO 26262
120 rpm
328 mA
1.32 V
1.08 V
1.2 V
DSPI(4), I2C(4), SAI(3), SPI(6)
COMPARATOR(3), DMA(32), RTI, RTC, TIMER(18), WDT(2)
80-Ch 10-Bit, 64-Ch 12-Bit
SP5748CBK0AVMJ6R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER;
S-PBGA-B256
e2
17 mm
256
LBGA
BGA256,16X16,40
GRID ARRAY, LOW PROFILE
1.7 mm
160 rpm
TIN SILVER
BALL
1 mm
BOTTOM
SP5748CSK0ACKU2R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;
292 mA
SP5748CSK0AVMJ2R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; DAC Channels: NO;
SP5748GBK0AMMN6R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE; PWM Channels: YES;
S-PBGA-B324
19 mm
324
19
125 Cel
BGA324,18X18,40
786432
400 mA
COMPARATOR(3), DMA(32), RTI, RTC, TIMER(19), WDT(4)
SP5748GBK0AVMJ6R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
SP5748GGK0AVMJ6R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Format: FLOATING-POINT;
SP5748GSK0AVKU2R
SP5748GSK0AVMJ2R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
SP5748GTK0AMKU6R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE; Format: FLOATING-POINT;
MC9S08QL8CTJ
MC9S08QL8CTJ by NXP is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 18 I/O lines, PWM channels, and ADC channels, making it suitable for applications requiring precise control and data acquisition. With a small outline package style and dual terminal position, it is ideal for compact designs in various electronic devices.
3.6 V
1.8 V
MC56F82646VLF
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
MKW36A512VHT4
NXP Semiconductors' MKW36A512VHT4 is a 32-bit microcontroller with 48 terminals, operating at up to 32 MHz. Ideal for industrial applications, it features ADC and DMA channels, PWM support, and flash ROM programmability. With a wide temperature range (-40 to 105°C) and compact size (7x7mm), it's suitable for various embedded systems requiring high performance in harsh environments.
32 MHz
S-PQCC-N48
e4
25
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.98 mm
48 rpm
1.71 V
NICKEL GOLD
NO LEAD
MKW36Z512VHT4
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL GOLD; Maximum Time At Peak Reflow Temperature (s): 40;
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