Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SAC57D53MCVMO
NXP Semiconductors
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; ADC Channels: YES;
YES
0
32
CORTEX-A5/M4/M0
40 MHz
NO
FLOATING-POINT
S-PBGA-B516
e2
27 mm
3
1
516
7
8
105 Cel
-40 Cel
PLASTIC/EPOXY
BGA
BGA516,26X26,40
SQUARE
GRID ARRAY
260
2411724
3145728
FLASH
ISO 26262
2.02 mm
320 rpm
1.32 V
1.2 V
1.25 V
CMOS
TIN SILVER
BALL
1 mm
BOTTOM
40
MICROCONTROLLER, RISC
CAN(3), ETHERNET, I2C(2), SPI(5)
COMPARATOR(2), RTC, TIMER(48), WDT(3)
24-Ch 12-Bit
SAC57D54HCVLTR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; DAC Channels: NO;
S-PQFP-G208
e3
28 mm
208
HLFQFP
HQFP208,1.18SQ,20
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
4194304
1.6 mm
TIN
GULL WING
.5 mm
QUAD
SAC57D54HCVLT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.32 V;
SAC57D54HCVMOR
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;
SAC57D54HCVMO
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;
SPC5777CDK3MME4R
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;
416
264 rpm
SPC5777CDK3MME4
NXP Semiconductors' SPC5777CDK3MME4 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 416 terminals in a square package. Ideal for applications requiring ADC and DMA channels, with a peak reflow temperature of 260°C.
SPC5777CDK3MMO4R
NXP Semiconductors' SPC5777CDK3MMO4R is a 32-bit microcontroller with 516 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, PWM support, and a RISC architecture. This square-shaped microcontroller with grid array packaging is suitable for applications requiring high-speed processing and precise control in automotive electronics.
SPC5777CDK3MMO4
NXP Semiconductors' SPC5777CDK3MMO4 is a 32-bit microcontroller with 516 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and PWM control. Ideal for use in automotive electronics due to its robust design and advanced capabilities.
K32L3A60VPJ1AT
NXP Semiconductors K32L3A60VPJ1AT microcontroller features 32-bit CPU CORTEX-M4, 12-Ch 12-Bit DAC and ADC channels. With a max clock frequency of 72 MHz, it is suitable for applications requiring high-speed data processing and precision analog-to-digital conversion. The microcontroller's extensive peripheral support includes DMA, RTC, TIMER, WDT, I2C(4), SPI(4), UART(4), USB connectivity options.
CORTEX-M4
72 MHz
9 mm
104
176
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
393216
1310720
72 rpm
3.6 V
1.71 V
3.3 V
I2C(4), I2S, SPI(4), UART(4), USB
DMA(16), POR, RTC, TIMER(27), WDT
12-Ch 12-Bit
LPC1115FET48/303,151
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 3.6 V;
25 MHz
S-PBGA-B48
4.5 mm
42
48
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
50 rpm
1.8 V
LPC12D27FBD100/301,551
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
S-PQFP-G100
14 mm
100
LFQFP
FLATPACK, LOW PROFILE, FINE PITCH
45 rpm
3 V
LPC2220FET144/G,518
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;
ALSO REQUIRES 3.3 V SUPPLY
24
50 MHz
S-PBGA-B144
12 mm
76
144
1.2 mm
60 rpm
1.95 V
1.65 V
.8 mm
LPC4315JBD144,551
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
S-PQFP-G144
20 mm
83
204 rpm
2.2 V
LPC810M021FN8,129
MICROCONTROLLER, RISC; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage: 3.6 V;
R-PDIP-T8
9.5 mm
6
DIP
RECTANGULAR
IN-LINE
4.2 mm
30 rpm
THROUGH-HOLE
2.54 mm
DUAL
7.62 mm
MC9S08SH4MTJR,534
MC9S08SH4MTJR,534 by NXP Semiconductors is an 8-bit microcontroller with a max clock frequency of 38.4 MHz and 18 I/O lines. It operates at a supply voltage range of 2.7V to 5.5V, making it suitable for applications requiring high-speed processing and multiple input/output functionalities such as industrial automation systems or consumer electronics devices.
38.4 MHz
R-PDSO-G20
12.8 mm
18
20
TSSOP
SMALL OUTLINE
40 rpm
5.5 V
2.7 V
1.27 mm
7.5 mm
MICROCONTROLLER
MCF51QE96CLH,557
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3 V;
16 MHz
S-PQFP-G64
10 mm
72
64
50.33 rpm
P87C51MC2BA/02Y
MICROCONTROLLER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
23
24 MHz
S-PQCC-J44
16.585 mm
34
44
70 Cel
0 Cel
QCCJ
CHIP CARRIER
OTPROM
4.57 mm
24 rpm
4.5 V
5 V
COMMERCIAL
J BEND
S912ZVMBA4F0VLH
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;
S912ZVMBA6F0MLFR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
S912ZVMBA6F0VLFR
S912ZVMBA6F0WLFR
MICROCONTROLLER; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
S912ZVMBA6F0WLF
MICROCONTROLLER; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
S912ZVMC12F3MKHR
MICROCONTROLLER; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
S912ZVMC12F3MKH
MICROCONTROLLER; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
S912ZVMC12F3WKHR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
S912ZVML12F3WKHR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
S912ZVML31F1MKFR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN;
S912ZVML31F1MKF
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
S912ZVML31F1MKHR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
S912ZVML31F1MKH
S912ZVML31F1WKHR
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3;
S912ZVML31F1WKH
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
S912ZVML32F3WKHR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
S912ZVML32F3WKH
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MIMXRT1021CAG4AR
MICROCONTROLLER, RISC; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
S9S12GN32AMFT
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
16
S-XQCC-N48
7 mm
125 Cel
UNSPECIFIED
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1.05 mm
25 rpm
3.13 V
AUTOMOTIVE
NO LEAD
SPC565MZP56DR2
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e0; Terminal Finish: TIN LEAD;
e0
240
TIN LEAD
30
LPC1227FBD48/301J
LPC1227FBD48/301J by NXP is a 32-bit CORTEX-M0 microcontroller with 131072 ROM words, 8192 RAM bytes, and 8-Ch 10-Bit ADC channels. It operates at up to 25 MHz, suitable for applications requiring I2C, SPI, SSP, UART(2) connectivity and peripherals like BOD, DMA(21), RTC.
CORTEX-M0
85 Cel
8192
131072
I2C, SPI, SSP, UART(2)
BOD, COMPARATOR(2), DMA(21), RTC, TIMER(5), WDT
8-Ch 10-Bit
LPC1517JBD64Y
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; Peripherals: BOD, COMPARATOR(4), DMA(18), PWM, RTC, TIMER(12), WDT;
CORTEX-M3
46
QFP
FLATPACK
12288
65536
2.4 V
4K
CAN, I2C, SPI(2), USART(3)
BOD, COMPARATOR(4), DMA(18), PWM, RTC, TIMER(12), WDT
1-Ch 12-Bit
LPC1776FBD208K
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 2; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
2
LPC1778FBD208K
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3;
LPC18S10FBD144E
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
LPC18S30FBD144E
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
LPC18S50FET180E
MICROCONTROLLER, RISC; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
e1
TIN SILVER COPPER
LPC18S50FET256,551
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
LPC2210FBD144/01K
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; DAC Channels: NO;
ARM7
16384
75 rpm
PWM, RTC, TIMER(2), WDT
LPC2478FBD208K
NXP Semiconductors' LPC2478FBD208K microcontroller features 32-bit architecture, 24-bit address bus, and 3.6V max supply voltage. Ideal for industrial applications, it offers CAN, I2C, SPI connectivity and low power mode with 100mA max supply current.
FIXED POINT
4
160
QFP208,1.2SQ,20
100352
524288
100 mA
INDUSTRIAL
CAN(2), I2C(3), I2S, SPI, SSP(2), UART(4)
BOD, POR, RTC, TIMER(4), WDT
1-Ch 10-Bit
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