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SAC57D54HCVMO

NXP Semiconductors

SAC57D54HCVMO by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;

Median Price

$34.312

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$30.500

1k+ parts

$27.290

10k+ parts

$25.680

100

-

$30.500

$27.290

$25.680

Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$38.125

1k+ parts

$34.112

10k+ parts

$32.100

100

-

$38.125

$34.112

$32.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,547 parts In-Stock

1+ parts

$32.196

100+ parts

-

1k+ parts

-

10k+ parts

-

2,547

$32.196

-

-

-

Vyrian

USA . 8,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8,975

-

-

-

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Anansix

USA . 1,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,624

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 880 parts In-Stock

1+ parts

$9.890

100+ parts

-

1k+ parts

-

10k+ parts

-

880

$9.890

-

-

-

Corphita

USA . 1,032 parts In-Stock

1+ parts

$30.501

100+ parts

-

1k+ parts

-

10k+ parts

-

1,032

$30.501

-

-

-

Microchip USA

USA . 2,022 parts In-Stock

1+ parts

$82.956

100+ parts

-

1k+ parts

-

10k+ parts

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2,022

$82.956

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 25,882 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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25,882

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UNI Independent Distributors

Spain . 7,369 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,369

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Perfect Parts

USA . 801 parts In-Stock

1+ parts

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801

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Technical Specifications

Microcontrollers SAC57D54HCVMO attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-A5/M4/M0

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of Serial I/Os:

0

No. of Terminals:

516

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

2411724

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

2.02 mm

Speed:

320 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), ETHERNET, I2C(2), SPI(5)

Peripherals:

COMPARATOR(2), RTC, TIMER(48), WDT(3)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

SAC57D54HCVMO Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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