Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FS32K116LIT0VFMT
NXP Semiconductors
NXP Semiconductors' FS32K116LIT0VFMT is a 32-bit microcontroller with Cortex-M0+ CPU, 131072 ROM words, and 2048 data EEPROM size. It features 18 timers, CAN, I2C, LIN(2), LPUART(2), SPI connectivity for automotive applications. Operating at up to 40 MHz with low power mode and ISO 26262 screening level.
YES
32
Cortex-M0+
40 MHz
NO
FLOATING-POINT
S-PQCC-N32
5 mm
3
16
28
2
18
8
105 Cel
-40 Cel
PLASTIC/EPOXY
HVQCCN
LCC32,.2SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
17408
131072
FLASH
ISO 26262
.85 mm
48 rpm
5.5 V
2.7 V
5 V
CMOS
NO LEAD
.5 mm
QUAD
40
MICROCONTROLLER, RISC
2048
CAN, I2C, LIN(2), LPUART(2), SPI
BOR, COMPARATOR, POR, RTC, TIMER(18), WDT
13-Ch 12-Bit
1-Ch 8-Bit
FS32K116LIT0VLFT
FS32K116LIT0VLFT by NXP Semiconductors is a 32-bit microcontroller with Cortex-M0+ CPU, 131072 ROM words, and 2048 data EEPROM size. It features 13-Ch 12-Bit ADCs, CAN/I2C/SPI connectivity, and operates at up to 40 MHz. Ideal for applications requiring low power consumption and high-speed processing in automotive systems adhering to ISO 26262 standards.
S-PQFP-G48
e3
7 mm
43
48
LFQFP
QFP48,.35SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
1.6 mm
TIN
GULL WING
FS32K118LIT0VLFT
NXP Semiconductors' FS32K118LIT0VLFT microcontroller features 32-bit architecture, 40 MHz clock frequency, and 25600 bytes of RAM. Ideal for applications requiring CAN, I2C, LIN, LPUART, and SPI connectivity with low power mode support. Suitable for automotive systems adhering to ISO 26262 standards.
25600
262144
CAN, I2C, LIN(2), LPUART(2), SPI(2)
16-Ch 12-Bit
FS32K142UIT0VLHT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: TIN;
CORTEX-M4F
S-PQFP-G64
10 mm
58
64
34
QFP64,.47SQ,20
32768
112 rpm
4096
CAN(2), I2C, LIN(2), LPUART(2), SPI(2)
BOR, COMPARATOR, POR, RTC, TIMER(34), WDT
FS32K144ULT0VLHT
NXP Semiconductors' FS32K144ULT0VLHT microcontroller features a 32-bit CPU, 40 MHz clock frequency, and 65536 bytes of RAM. Ideal for applications requiring low power mode, it offers connectivity options like CAN, I2C, LIN, LPUART, and SPI for versatile usage in automotive and industrial settings.
65536
524288
CAN(3), I2C, LIN(3), LPUART(3), SPI(3)
FS32K144ULT0VLLR
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; DMA Channels: YES;
S-PQFP-G100
14 mm
89
100
QFP100,.63SQ,20
1.7 mm
FS32K146UIT0VLLT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;
50
1048576
BOR, COMPARATOR, POR, RTC, TIMER(50), WDT
24-Ch 12-Bit
FS32K146ULT0VLLT
NXP Semiconductors' FS32K146ULT0VLLT microcontroller features a 32-bit CPU, 131072 bytes of RAM, and 1048576 ROM words. With peripherals like BOR, POR, and RTC, it's ideal for automotive applications requiring ISO 26262 screening. The Cortex-M4F family chip operates at up to 40 MHz with low power mode support.
FS32K148UGT0VLQT
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
S-PQFP-G144
20 mm
128
144
66
QFP144,.87SQ,20
2097152
CAN(3), I2C(2), LIN(3), LPUART(3), SAI(2), SPI(3)
BOR, COMPARATOR, POR, RTC, TIMER(66), WDT
32-Ch 12-Bit
FS32K148UIT0VLQT
NXP Semiconductors' FS32K148UIT0VLQT microcontroller features a 32-bit CPU, 144 terminals, and 262144 bytes of RAM. It is ideal for applications requiring CAN, I2C, LIN connectivity and offers low power mode with a max clock frequency of 40 MHz.
LPC43S20FBD144E
LPC43S20FBD144E by NXP Semiconductors is a 32-bit microcontroller with a max supply voltage of 3.6V and an address bus width of 16. It is commonly used in applications such as CAN, I2C, I2S, SSP, UART, and USART connectivity.
CORTEX-M4
25 MHz
83
85 Cel
204800
n/s
204 rpm
3.6 V
2.2 V
3.3 V
30
0
CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)
BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT
8-Ch 10-Bit (2)
1-Ch 10-Bit
LPC43S20FET180E
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 180; Package Code: TFBGA; Package Shape: SQUARE; Digital To Analog Convertors: 1-Ch 10-Bit;
e1
12 mm
118
180
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
LPC43S30FET100E
NXP Semiconductors' LPC43S30FET100E microcontroller features a 32-bit CORTEX-M4 CPU, 16-bit address bus width, and max clock frequency of 25 MHz. With DAC and ADC channels, it's ideal for applications requiring CAN, I2C, I2S, SSP connectivity such as industrial automation and IoT devices.
49
2700336
4-Ch 10-Bit (2)
LPC43S30FET256E
NXP Semiconductors' LPC43S30FET256E is a 32-bit microcontroller with Cortex-M4 CPU, offering 16-bit address and external data bus width. It features 8-Ch 10-Bit ADCs, CAN connectivity, and operates at up to 25 MHz. Ideal for applications requiring high-speed processing, analog-to-digital conversion, and versatile communication interfaces like I2C and UART.
17 mm
164
256
LBGA
GRID ARRAY, LOW PROFILE
1 mm
LPC43S37JBD144E
MICROCONTROLLER, RISC; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
LPC43S50FET180E
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 180; Package Code: TFBGA; Package Shape: SQUARE; Bit Size: 32;
LPC43S50FET256,551
NXP Semiconductors' LPC43S50FET256,551 is a 32-bit microcontroller with Cortex-M4 CPU family. It features 16-bit address and external data bus width, 3.6V max supply voltage, and 2700336 bytes of RAM. Ideal for applications requiring CAN, I2C, I2S connectivity and up to 25MHz clock frequency.
LPC43S57JBD208E
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;
LPC43S70FET256E
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
MC56F8023VLCR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3;
MICROCONTROLLER
MKV56F512VLQ24R
MICROCONTROLLER, RISC; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SPC5605BK0CLL6R
MICROCONTROLLER, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
SPC5605BK0MLU6R
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
SPC5644BF0MLU1R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH;
E200Z4D
FLOATING POINT
S-PQFP-G176
24 mm
147
176
9
125 Cel
QFP176,1.0SQ,20
1572864
120 rpm
300 mA
3 V
I2C, CAN(6), SCI(10), SPI(8)
DMA(32), RTC, RTI, PWM, TIMER(9), WDT
5-Ch 12-Bit, 27-Ch 10-Bit
SPC5644BF0MLU8
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; No. of External Interrupts: 32;
80 rpm
SPC5644CF0MLT1R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
S-PQFP-G208
28 mm
177
208
QFP208,1.2SQ,20
196608
I2C, CAN(6), ETHERNET, SCI(10), SPI(8)
10-Ch 12-Bit, 33-Ch 10-Bit
SPC5646CCF0MLT1R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
3145728
SPC5646CCF0MLU1R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; On Chip Data RAM Width: 8;
SPC5646CF0VLT1R
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; Data EEPROM Size: 65536;
Tin (Sn)
SPC5668EK0MMGR
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40;
e2
TIN SILVER
SPC5668EK0MMG
MICROCONTROLLER; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3;
SPC5668EK0VMG
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Terminal Finish: TIN SILVER;
SPC5668GAVMGR
MICROCONTROLLER; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SPC5668GAVMG
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER;
SPC5668GK0MMGR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SPC5668GK0MMG
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40;
SPC5668GK0VMGR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e2;
SPC5668GK0VMG
MICROCONTROLLER; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
SPC5742PK1MLQ5R
MICROCONTROLLER, RISC; Terminal Finish: Tin (Sn); Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
SPC5744PK1AMLQ5
MICROCONTROLLER, RISC; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
S912ZVMC12F2WKHR
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
CPU12
20 MHz
FIXED POINT
7
1
4
150 Cel
8192
50 rpm
66 mA
18 V
12 V
AUTOMOTIVE
S912ZVC64F0MKH
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE;
S12Z
46
HLFQFP
HQFP64,.47SQ,20
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
32 rpm
35 mA
40 V
3.5 V
1K
CAN, I2C, SCI(2), SENT, SPI(2)
COMPARATOR(2), POR, RTI, TIMER(12), WDT
16-Ch 10-Bit
S912ZVC96F0MKHR
98304
2K
S912ZVCA64F0CLF
MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
INDUSTRIAL
CAN, I2C, SCI(2), SENT, SPI
COMPARATOR(2), POR, RTI, TIMER(8), WDT
10-Ch 12-Bit
S912ZVCA64F0WKH
AEC-Q100
MC9S08DZ16ACLF
HCS08
16 MHz
40 rpm
24 mA
MC9S08DZ32AMLFR
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MC9S08DZ48ACLF
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