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LPC43S50FET256,551

NXP Semiconductors

LPC43S50FET256,551 by NXP Semiconductors

NXP Semiconductors' LPC43S50FET256,551 is a 32-bit microcontroller with Cortex-M4 CPU family. It features 16-bit address and external data bus width, 3.6V max supply voltage, and 2700336 bytes of RAM. Ideal for applications requiring CAN, I2C, I2S connectivity and up to 25MHz clock frequency.

Median Price

$18.860

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 72 parts In-Stock

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$18.860

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$12.870

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$11.920

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Flip Electronics (Authorized)

USA . 180 parts In-Stock

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Digiode

USA . 766 parts In-Stock

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$9.709

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Nova Conductors

Japan . 50 parts In-Stock

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$13.340

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Vyrian

USA . 8,211 parts In-Stock

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Anansix

USA . 1,468 parts In-Stock

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Flip Electronics

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Cogito LLC

Ukraine . 5 parts In-Stock

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AZTECH Wire

Italy . 753 parts In-Stock

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$7.330

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Vigor

Singapore . 235 parts In-Stock

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$7.930

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Ampacity Inc.

Singapore . 135 parts In-Stock

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$8.480

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Semicontronic

India . 135 parts In-Stock

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$8.480

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$8.268

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$8.226

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Corphita

USA . 4,472 parts In-Stock

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$9.198

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Continental Prestige Electronics

USA . 4,934 parts In-Stock

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Microchip USA

USA . 4,542 parts In-Stock

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$33.865

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Aztec Data Supply Inc.

USA . 1,793 parts In-Stock

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$44.150

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Corohmni

South Africa . 386 parts In-Stock

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Advanced Electronics

New Zealand . 63 parts In-Stock

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$75.924

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Argo Parts USA

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UNI Independent Distributors

Spain . 1,653 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$13.073

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$12.673

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$12.406

500

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$13.073

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$12.406

Overview

Discover unparalleled performance and reliability with the LPC43S50FET256,551 microcontroller by NXP Semiconductors. Designed with cutting-edge technology, this device offers seamless connectivity and advanced features for a wide range of applications. Whether you're in the automotive, industrial, or consumer electronics industry, this microcontroller guarantees exceptional value, efficiency, and versatility. Elevate your projects to new heights with the LPC43S50FET256,551 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Provides the flexibility to operate with a wide range of power sources without the risk of damage.

Address Bus Width: 16

Enables the microcontroller to access a larger memory space efficiently, allowing for more complex applications.

Package Shape: SQUARE

Square shape makes it easier to design compact and space-efficient electronic devices.

Bit Size: 32

Higher bit size allows for faster processing and handling of data, improving overall performance.

DAC Channels: YES

Digital-to-Analog Converters provide the ability to generate analog signals, essential for a wide range of applications from audio processing to motor control.

No. of Terminals: 256

Offers a high level of connectivity and interface options for various external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array package style ensures reliable connections and low profile design saves space, ideal for compact devices.

Minimum Supply Voltage: 2.2 V

Allows the microcontroller to operate efficiently at lower power levels, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial and automotive applications where temperature fluctuations are common.

CPU Family: CORTEX-M4

Part of the efficient and high-performance ARM Cortex-M4 family, providing advanced computational capabilities for demanding applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it suitable for a wide range of environments including outdoor and harsh conditions.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish ensures reliable connections and prevents oxidation, contributing to the overall durability of the product.

ADC Channels: YES

Analog-to-Digital Converters enable the microcontroller to read and process analog signals from sensors and other devices.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer without the CPU's intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position aids in heat dissipation and enhances thermal management within the device.

ROM Words: n/s

ROM size information not specified, but typically integral for storing program code and data, essential for the microcontroller's operation.

Digital To Analog Convertors: 1-Ch 10-Bit

Provides a single-channel 10-bit DAC for generating precise analog output signals in various applications.

Width: 17 mm

Compact width allows for easy integration into small form factor designs, especially useful in portable devices.

External Data Bus Width: 16

Ensures efficient data transfer between the microcontroller and external devices, enhancing overall system performance.

Peripherals: BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT

Wide range of built-in peripherals provide additional functionalities and capabilities for developing complex applications with ease.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast data processing and execution of instructions, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a significant duration during manufacturing processes, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and reliability during the assembly process.

Length: 17 mm

Compact length allows for space-saving designs and integration into various electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller with integrated peripherals offer efficient processing and reduced power consumption for optimized performance.

RAM Bytes: 2700336

Ample RAM size allows for storing and processing large amounts of data, enabling the microcontroller to handle complex tasks efficiently.

Terminal Form: BALL

Ball terminal form provides reliable connections and facilitates easier soldering during the assembly process.

Analog To Digital Convertors: 8-Ch 10-Bit (2)

Multiple Analog-to-Digital Converters offer the ability to read multiple analog signals simultaneously, essential for multi-sensor applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller under normal operating conditions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog outputs, essential for applications like motor control and LED dimming.

Connectivity: CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)

Multiple connectivity options make it easier to interface with a variety of external devices and communicate effectively in different network configurations.

ROM Programmability: FLASH

Programmable ROM with flash memory allows for easy updating and reprogramming of the microcontroller, essential for software development and debugging.

Terminal Pitch: 1 mm

Compact terminal pitch allows for efficient routing of connections on the PCB, leading to a more organized and space-efficient design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller is capable of withstanding moderate humidity levels during storage and assembly processes.

Speed: 204 rpm

High processing speed allows for quick execution of instructions and tasks, ideal for applications requiring real-time responsiveness.

No. of I/O Lines: 164

Large number of I/O lines provide ample interface options for connecting external devices and sensors, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LPC43S50FET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2700336

ROM Words:

n/s

ROM Programmability:

FLASH

Speed:

204 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)

Peripherals:

BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 10-Bit (2)

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC43S50FET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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