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LPC4337JET256,551

NXP Semiconductors

LPC4337JET256,551 by NXP Semiconductors

NXP Semiconductors' LPC4337JET256,551 microcontroller features a 32-bit Cortex-M4 CPU with 139264 bytes of RAM. It offers 164 I/O lines, DAC and ADC channels, and PWM channels for industrial applications. With a max clock frequency of 25 MHz and operating temperature range from -40 to 85°C, it is suitable for various embedded systems requiring high performance.

Median Price

$22.550

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$22.550

100+ parts

$15.740

1k+ parts

$14.640

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$22.550

$15.740

$14.640

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DigiKey

USA . 25 parts In-Stock

1+ parts

$22.550

100+ parts

$15.747

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$14.688

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25

$22.550

$15.747

$14.688

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Distributors (In-Stock)

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Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$17.380

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$17.380

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TME

Poland . 35 parts In-Stock

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$20.090

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$15.960

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$20.090

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Digiode

USA . 4,003 parts In-Stock

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$21.480

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Vyrian

USA . 6,939 parts In-Stock

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Anansix

USA . 1,266 parts In-Stock

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Flip Electronics

USA . 1,225 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 383 parts In-Stock

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$10.358

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383

$10.358

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Semicontronic

India . 157 parts In-Stock

1+ parts

$16.040

100+ parts

$15.639

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$15.559

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$16.040

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$15.559

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Aranea Global

USA . 1,000 parts In-Stock

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$17.032

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$16.351

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$17.032

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Continental Prestige Electronics

USA . 1,801 parts In-Stock

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$17.380

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$17.032

1,801

$17.380

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$17.032

Modulus Dynamics

Lithuania . 2,958 parts In-Stock

1+ parts

$17.386

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$17.386

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$17.386

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2,958

$17.386

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Corohmni

South Africa . 326 parts In-Stock

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$17.386

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$17.386

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$17.908

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$17.012

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$17.012

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Ampacity Inc.

Singapore . 157 parts In-Stock

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$19.220

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$19.220

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Corphita

USA . 2,930 parts In-Stock

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$20.349

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Microchip USA

USA . 2,027 parts In-Stock

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$44.448

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$44.448

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Aztec Data Supply Inc.

USA . 1,050 parts In-Stock

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$75.670

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Lixinc

USA . 14,447 parts In-Stock

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Robosynatics

Brazil . 4,758 parts In-Stock

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$17.038

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$16.691

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$16.691

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$17.038

$16.691

$16.691

Lucentia Tech

USA . 4,758 parts In-Stock

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$17.038

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$16.691

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$16.691

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Argo Parts USA

USA . 4,213 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,710 parts In-Stock

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Perfect Parts

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UNI Independent Distributors

Spain . 560 parts In-Stock

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Overview

Discover the LPC4337JET256,551 by NXP Semiconductors, a high-quality microcontroller that offers unparalleled performance and reliability. Ideal for a wide range of applications, this product boasts advanced features such as DAC and ADC channels, DMA support, and PWM channels. With a maximum clock frequency of 25 MHz and industrial temperature grade, this microcontroller is designed to meet the demands of any project. Experience the value and benefits of NXP Semiconductors' cutting-edge technology with the LPC4337JET256,551.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact design, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply selection and compatibility with a variety of systems.

Address Bus Width: 24

A wider address bus allows for access to a larger memory space, which can be beneficial for applications requiring extensive data processing and storage.

Bit Size: 32

A 32-bit architecture enables efficient processing of data and instructions, making the product suitable for high-performance applications.

DAC Channels: YES

Digital-to-analog converter (DAC) channels provide the capability to convert digital signals to analog signals, enabling the product to interface with analog components and devices.

Power Supplies (V): 2.5/3.3

Multiple power supply options offer flexibility in voltage selection, ensuring compatibility with a range of electronic systems and components.

No. of Terminals: 256

A high number of terminals allow for versatile connectivity options and integration with external devices, expanding the product's capabilities.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style enhances thermal performance and enables a compact footprint, making the product ideal for space-constrained applications.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a variety of environmental conditions, making the product suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family offers high performance and computational capabilities, making the product suitable for demanding tasks and real-time processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in harsh environments and cold conditions, enhancing the product's versatility.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good solderability and electrical conductivity, ensuring reliable connections and performance in various applications.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the product to convert analog signals to digital data, allowing for accurate data acquisition and processing.

DMA Channels: YES

Direct memory access (DMA) channels improve data transfer efficiency and reduce CPU workload, enhancing the product's overall performance and responsiveness.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy integration and soldering onto PCBs, simplifying the assembly process and ensuring reliable connections.

ROM Words: 1048576

Large ROM capacity allows for storing a significant amount of program instructions and data, enabling the product to support complex applications and algorithms.

Maximum Seated Height: 1.55 mm

The low maximum seated height enables a compact and slim design, making the product suitable for applications with space constraints and height limitations.

Width: 17 mm

The compact width of the product allows for easy integration into electronic systems with limited space, ensuring efficient use of PCB real estate.

External Data Bus Width: 32

A wide external data bus width enhances data transfer rates and processing speed, making the product suitable for high-throughput applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast processing and execution of instructions, enhancing the product's performance for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reflow process during assembly, ensuring robust and reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering and assembly processes, ensuring durable and stable connections in various operating conditions.

Length: 17 mm

The compact length of the product enables easy integration and placement on PCBs, optimizing space utilization in electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions and demanding applications, making the product suitable for industrial use.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and microcontroller peripheral IC type provide efficient processing capabilities and versatile connectivity options, making the product suitable for a wide range of applications.

RAM Bytes: 139264

Large RAM capacity allows for efficient data storage and processing, enabling the product to handle complex tasks and multitasking operations effectively.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the product's energy efficiency and overall reliability.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and facilitates easy soldering onto PCBs, ensuring stable and secure connections in various applications.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage provides standard voltage compatibility and ensures stable operation in most electronic systems, simplifying power supply design and integration.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable the precise control of analog components and devices, enhancing the product's versatility for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of firmware and software, ensuring flexibility and scalability in application development and maintenance.

Terminal Pitch: 1 mm

The 1 mm terminal pitch facilitates easy assembly and soldering onto standard PCBs, ensuring compatibility and ease of integration with existing electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 level indicates moderate moisture sensitivity, ensuring proper handling and storage requirements to maintain product integrity and reliability during assembly and operation.

Speed: 204 rpm

The high speed rating enables fast data processing and execution, making the product suitable for real-time applications and processing-intensive tasks.

No. of I/O Lines: 164

A high number of I/O lines provide versatile connectivity options and allow for interfacing with a wide range of external devices and peripherals, expanding the product's functionality and application compatibility.

Technical Specifications

Microcontrollers LPC4337JET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC4337JET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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