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STM32F745IGK6TR

STMicroelectronics

STM32F745IGK6TR by STMicroelectronics

STM32F745IGK6TR by STMicroelectronics is a 32-bit microcontroller with 176 terminals, 1048576 ROM words, and 327680 RAM bytes. It features 24-Ch 12-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like PWM, RTC, and UART. Ideal for industrial applications requiring high-speed processing and extensive connectivity options such as CAN, ETHERNET, I2C, SPI.

Median Price

$19.392

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$19.392

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$19.392

-

-

-

Vyrian

USA . 8,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,345

-

-

-

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Anansix

USA . 1,210 parts In-Stock

1+ parts

-

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-

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1,210

-

-

-

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Digiode

USA . 890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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890

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 207 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

207

$9.000

$8.775

$8.730

-

Vigor

Singapore . 1,293 parts In-Stock

1+ parts

$11.090

100+ parts

-

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-

10k+ parts

-

1,293

$11.090

-

-

-

AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$16.730

100+ parts

-

1k+ parts

-

10k+ parts

-

668

$16.730

-

-

-

Continental Prestige Electronics

USA . 2,625 parts In-Stock

1+ parts

$18.671

100+ parts

-

1k+ parts

-

10k+ parts

$18.298

2,625

$18.671

-

-

$18.298

Netroflash

USA . 500 parts In-Stock

1+ parts

$19.392

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$19.392

-

-

-

Modulus Dynamics

Lithuania . 94 parts In-Stock

1+ parts

$21.525

100+ parts

$21.309

1k+ parts

$20.664

10k+ parts

-

94

$21.525

$21.309

$20.664

-

IDEA Electronic Components Group

UK . 751 parts In-Stock

1+ parts

$21.710

100+ parts

-

1k+ parts

$19.539

10k+ parts

-

751

$21.710

-

$19.539

-

Ampacity Inc.

Singapore . 1,309 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,309

$27.000

-

-

-

Microchip USA

USA . 2,646 parts In-Stock

1+ parts

$37.210

100+ parts

$36.680

1k+ parts

$36.410

10k+ parts

$36.150

2,646

$37.210

$36.680

$36.410

$36.150

MKK Technologies

India . 229 parts In-Stock

1+ parts

$40.825

100+ parts

-

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-

10k+ parts

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229

$40.825

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DigiPath Technology Company

USA . 229 parts In-Stock

1+ parts

$40.825

100+ parts

-

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-

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229

$40.825

-

-

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Corohmni

South Africa . 97 parts In-Stock

1+ parts

$55.015

100+ parts

-

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97

$55.015

-

-

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Aztec Data Supply Inc.

USA . 2,607 parts In-Stock

1+ parts

$60.670

100+ parts

-

1k+ parts

-

10k+ parts

-

2,607

$60.670

-

-

-

Advanced Electronics

New Zealand . 32 parts In-Stock

1+ parts

$78.618

100+ parts

$74.687

1k+ parts

$74.687

10k+ parts

-

32

$78.618

$74.687

$74.687

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Corphita

USA . 3,648 parts In-Stock

1+ parts

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3,648

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Argo Parts USA

USA . 650 parts In-Stock

1+ parts

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650

-

-

-

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Parana Technologies

USA . 528 parts In-Stock

1+ parts

-

100+ parts

$25.958

1k+ parts

-

10k+ parts

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528

-

$25.958

-

-

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.242

1k+ parts

$0.242

10k+ parts

$0.242

500

-

$0.242

$0.242

$0.242

Overview

Unleash the power of innovation with the STM32F745IGK6TR microcontroller from STMicroelectronics. Designed with cutting-edge technology and top-notch manufacturing standards, this device offers unparalleled performance and reliability. Perfect for a wide range of applications, this microcontroller provides customers with seamless connectivity and advanced features that will elevate their projects to new heights. Experience the value and benefits of this exceptional product and bring your ideas to life like never before. Elevate your designs with the STM32F745IGK6TR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging which helps in protecting the microcontroller from external damage.

Surface Mount: YES

Ease of installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Support for a wide range of voltage inputs for versatility in applications.

Package Shape: SQUARE

Compact design for efficient use of space on the PCB.

Bit Size: 32

Higher bit size allows for processing larger data sets and more complex operations.

DAC Channels: YES

Ability to output analog signals for interfacing with external devices.

No. of Terminals: 176

Sufficient number of terminals for connecting various peripherals and external components.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enhanced electrical performance with a thin profile and fine pitch for high-density mounting.

Minimum Supply Voltage: 1.7 V

Support for low voltage operation for power efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operational in extreme low temperature conditions.

ADC Channels: YES

Ability to convert analog signals to digital for processing.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing.

Terminal Position: BOTTOM

Convenient terminal placement for easy connection to PCB.

ROM Words: 1048576

Large memory capacity for storing program instructions and data.

Maximum Seated Height: 0.6 mm

Low-profile design for compact devices.

Digital To Analog Convertors: 2-Ch 12-Bit

Capability to convert digital signals to analog for output.

Width: 10 mm

Compact size for space-constrained applications.

Peripherals: BOR, DMA(2), POR, PWM, RTC, TIMER(16), WDT(2)

Rich set of peripherals for versatile functionality and interfacing options.

Maximum Clock Frequency: 50 MHz

High clock frequency for fast processing and real-time applications.

Length: 10 mm

Compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for high performance and low power consumption.

RAM Bytes: 327680

Large RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable solder connections.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels for precise analog signal conversion.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Ability to generate pulse-width modulated signals for various applications.

Connectivity: CAN(2), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SPI(6), UART(4), USART(4)

Versatile connectivity options for communication with a wide range of devices.

ROM Programmability: FLASH

Flash memory for reprogrammable instructions and data storage.

Terminal Pitch: 0.65 mm

Fine pitch terminals for high-density mounting.

Speed: 216 rpm

High processing speed for real-time applications.

On Chip Program ROM Width: 8

On-chip program ROM for storing critical instructions.

No. of I/O Lines: 140

Sufficient I/O lines for interfacing with external peripherals and devices.

Technical Specifications

Microcontrollers STM32F745IGK6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

UFBGA (176+25) PACKAGE; IT IS ALSO HAVING DCMI, SDMMC, SPDIFRX(4) CONNECTIVITY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B176

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

327680

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

216 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SPI(6), UART(4), USART(4)

Peripherals:

BOR, DMA(2), POR, PWM, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F745IGK6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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