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LPC4357JBD208E

NXP Semiconductors

LPC4357JBD208E by NXP Semiconductors

LPC4357JBD208E by NXP Semiconductors is a 32-bit microcontroller with a Cortex-M4 CPU, 24-bit address bus width, and 3.6V max supply voltage. It is ideal for industrial applications requiring high-speed processing, featuring DAC and ADC channels, along with PWM support for precise control in various systems.

Median Price

$10.640

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$10.640

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Vyrian

USA . 3,928 parts In-Stock

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Digiode

USA . 2,248 parts In-Stock

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Anansix

USA . 1,140 parts In-Stock

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One Stop Electronics

USA . 183 parts In-Stock

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$4.000

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Semicontronic

India . 1,648 parts In-Stock

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$7.000

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$6.825

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$6.790

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1,648

$7.000

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$6.790

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AZTECH Wire

Italy . 280 parts In-Stock

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$7.948

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280

$7.948

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Modulus Dynamics

Lithuania . 3,199 parts In-Stock

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$10.640

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$10.640

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Corohmni

South Africa . 297 parts In-Stock

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Continental Prestige Electronics

USA . 6,622 parts In-Stock

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$10.640

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$10.427

6,622

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$10.427

Advanced Electronics

New Zealand . 100 parts In-Stock

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$10.959

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$10.411

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$10.411

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$10.411

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Ampacity Inc.

Singapore . 1,432 parts In-Stock

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$12.000

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Aztec Data Supply Inc.

USA . 4,593 parts In-Stock

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$32.720

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Microchip USA

USA . 2,475 parts In-Stock

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$83.149

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Lixinc

USA . 17,845 parts In-Stock

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Perfect Parts

USA . 16,370 parts In-Stock

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UNI Independent Distributors

Spain . 8,318 parts In-Stock

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Infinite Electronics LLP (Excess)

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Argo Parts USA

USA . 4,229 parts In-Stock

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Vigor

Singapore . 4,203 parts In-Stock

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Corphita

USA . 4,098 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Robosynatics

Brazil . 446 parts In-Stock

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$10.427

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$10.214

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$10.214

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$10.214

$10.214

Lucentia Tech

USA . 446 parts In-Stock

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$10.427

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$10.214

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$10.214

446

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$10.214

iodParts Technologies Inc.

India . 150 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$10.427

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$10.108

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$9.895

100

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$10.427

$10.108

$9.895

Overview

Experience the cutting-edge technology of the LPC4357JBD208E by NXP Semiconductors, a top-tier manufacturer in the field of microcontrollers. This versatile device is designed to revolutionize various applications, offering unparalleled performance and reliability. With its advanced features and high-quality materials, this microcontroller ensures seamless operation and enhanced efficiency. Discover the value and benefits it brings to your projects, providing you with a competitive edge in the market. Upgrade your systems with the LPC4357JBD208E and unlock endless possibilities for innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal conductivity and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto printed circuit boards, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with various power sources.

Address Bus Width: 24

A wider address bus allows for larger memory addressing capabilities, enabling the product to handle complex data processing tasks efficiently.

Package Shape: SQUARE

Square package shape offers a compact design, saving space on the PCB and improving overall system layout.

Bit Size: 32

32-bit architecture provides enhanced processing power and speed, allowing the product to execute tasks quickly and efficiently.

DAC Channels: YES

Digital-to-analog converter channels enable the product to convert digital signals to analog outputs, expanding its functionality in various applications.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, providing flexibility in power management and ensuring compatibility with different voltage requirements.

No. of Terminals: 208

A high number of terminals allow for versatile connectivity options, enabling the product to interface with a wide range of external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers good thermal performance, space-saving design, and easy mounting on the PCB for efficient integration.

Minimum Supply Voltage: 2.2 V

Supports a low minimum supply voltage, enabling power-efficient operation and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and performance in extreme environmental conditions.

CPU Family: CORTEX-M4

Belonging to the Cortex-M4 CPU family provides high-performance processing capabilities, making the product suitable for demanding applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in cold environments without compromising performance and reliability.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, ensuring long-term reliability and stability of the product.

ADC Channels: YES

Analog-to-digital converter channels enable the product to acquire and process analog signals, enhancing its capability in data acquisition and conversion.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce CPU workload, enhancing the product's overall performance.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, ensuring reliable operation and reducing the risk of signal interference.

ROM Words: 1048576

Large ROM capacity allows for storing a vast amount of program data, enabling the product to run complex applications smoothly.

Maximum Seated Height: 1.6 mm

Low maximum seated height facilitates slim and compact product design, contributing to space-saving and efficient system integration.

Width: 28 mm

Compact width dimensions make the product suitable for applications with space constraints, ensuring easy installation and compatibility.

External Data Bus Width: 32

Wide external data bus width enhances data transfer speed and efficiency, enabling rapid communication between the product and external devices.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency supports fast data processing and execution speed, enhancing the product's performance in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and bonding during the manufacturing process, leading to reliable and durable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering and component bonding, improving the product's durability and reliability.

Length: 28 mm

Compact length dimensions contribute to space-saving design and easy integration, making the product suitable for various compact applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh operating environments, making the product reliable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high-speed processing and low power consumption, enhancing the product's efficiency and performance.

RAM Bytes: 139264

Large RAM capacity allows for efficient data storage and processing, enabling the product to handle multiple tasks simultaneously without performance degradation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving the product's energy efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable electrical connections, ensuring stable data transmission and minimizing signal loss.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the product, enhancing overall system performance and longevity.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals, making the product suitable for applications requiring accurate signal modulation and control.

ROM Programmability: FLASH

Flash ROM programmability allows for efficient data storage and reprogramming, enabling users to update and modify the product's firmware easily.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density mounting capability, allowing for more terminals in a limited space and enabling compact PCB design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture during storage and handling, requiring proper precautions to prevent component damage and ensure reliability.

Speed: 204 rpm

High speed capability enables rapid data processing and execution, making the product suitable for time-sensitive applications requiring quick response times.

No. of I/O Lines: 142

A high number of I/O lines provide versatile input/output options, allowing the product to interface with a wide range of external devices and peripherals for enhanced functionality.

Technical Specifications

Microcontrollers LPC4357JBD208E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

142

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC4357JBD208E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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