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MK66FN2M0VLQ18

NXP Semiconductors

MK66FN2M0VLQ18 by NXP Semiconductors

NXP Semiconductors' MK66FN2M0VLQ18 is a 32-bit microcontroller with Cortex-M4F CPU, offering 262144 bytes of RAM and 2097152 ROM words. It operates at up to 50 MHz clock frequency, suitable for industrial applications requiring high-speed processing and ADC/DAC capabilities. With a wide temperature range (-40 to 105°C) and low supply voltage (1.71-3.6V), it's ideal for various embedded systems in demanding environments.

Median Price

$24.160

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1,589 parts In-Stock

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$15.180

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Verical

USA . 1,589 parts In-Stock

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Chip1Stop

Japan . 300 parts In-Stock

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$15.400

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Farnell

UK . 398 parts In-Stock

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$22.360

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$14.130

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Mouser Electronics

USA . 594 parts In-Stock

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$25.960

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$18.530

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$17.880

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DigiKey

USA . 532 parts In-Stock

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$26.620

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$19.139

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$17.540

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Newark

USA . 253 parts In-Stock

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$26.870

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$20.090

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$18.690

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$26.870

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$18.690

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Element14

Singapore . 270 parts In-Stock

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$36.700

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$24.790

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Avnet

USA . 1,080 parts In-Stock

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EBV Elektronik

Germany . 180 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 3,932 parts In-Stock

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$19.000

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Nova Conductors

Japan . 100 parts In-Stock

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$21.390

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100

$21.390

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Maritex

Poland . 295 parts In-Stock

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$29.853

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$21.362

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$20.240

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Chip Stock

USA . 3,600 parts In-Stock

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Anansix

USA . 1,560 parts In-Stock

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NAC Semi

USA . 600 parts In-Stock

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Vyrian

USA . 537 parts In-Stock

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ComSIT Distribution GmbH

Germany . 300 parts In-Stock

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

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300

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IBS Electronics

USA . 300 parts In-Stock

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$18.083

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Flip Electronics

USA . 300 parts In-Stock

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Connect4Technologies Inc.

Canada . 9 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 384 parts In-Stock

1+ parts

$13.670

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384

$13.670

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Semicontronic

India . 319 parts In-Stock

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$13.670

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$13.328

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$13.260

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$13.670

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$13.260

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Corphita

USA . 2,924 parts In-Stock

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$18.000

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Continental Prestige Electronics

USA . 4,616 parts In-Stock

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$20.787

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$20.371

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Netroflash

USA . 500 parts In-Stock

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$21.390

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$61.726

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$58.640

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Microchip USA

USA . 1,152 parts In-Stock

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$65.570

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$64.430

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$63.860

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$63.290

1,152

$65.570

$64.430

$63.860

$63.290

Modulus Dynamics

Lithuania . 1,765 parts In-Stock

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$67.440

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$67.440

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Corohmni

South Africa . 262 parts In-Stock

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$80.411

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Aztec Data Supply Inc.

USA . 223 parts In-Stock

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$81.546

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iodParts Technologies Inc.

India . 26,134 parts In-Stock

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S.R.D Solutions

India . 20,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Robosynatics

Brazil . 3,990 parts In-Stock

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$49.829

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$48.812

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$48.812

3,990

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$49.829

$48.812

$48.812

Lucentia Tech

USA . 3,990 parts In-Stock

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$49.829

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$48.812

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$48.812

3,990

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$49.829

$48.812

$48.812

A-Z Elektronik GmbH

Germany . 3,686 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 2,193 parts In-Stock

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Lixinc

USA . 2,156 parts In-Stock

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UNI Independent Distributors

Spain . 796 parts In-Stock

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Epart123

USA . 600 parts In-Stock

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Infinite Electronics LLP (Excess)

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Argo Parts USA

USA . 153 parts In-Stock

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Overview

Unlock the potential of your projects with the MK66FN2M0VLQ18 by NXP Semiconductors. This high-quality microcontroller offers unparalleled performance and reliability, thanks to the expertise of its manufacturer. Ideal for a wide range of applications, this versatile device provides customers with value, efficiency, and innovation. Take your designs to the next level with the MK66FN2M0VLQ18 and experience the difference it can make in your electronic creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square package shape helps in easy placement and alignment on the circuit board.

Bit Size: 32

32-bit architecture provides high processing power and efficiency for complex tasks.

DAC Channels: YES

DAC channels allow for precise analog signal generation, important for various types of sensor interfacing.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages enables compatibility with different power sources.

No. of Terminals: 144

Having 144 terminals provides ample connection options for peripherals and external devices.

Package Style (Meter): FLATPACK, FINE PITCH

Flatpack, fine pitch package style offers efficient board space utilization and high-density mounting capability.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage allows for operation in low-power applications and extends battery life.

Maximum Operating Temperature: 105 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications with varying environmental conditions.

CPU Family: CORTEX-M4F

The CORTEX-M4F CPU family offers high-performance processing capabilities suitable for real-time embedded systems.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold conditions makes this microcontroller reliable in harsh environments.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and solderability for reliable connections.

ADC Channels: YES

ADC channels enable analog input conversion, essential for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels offer efficient data transfer capabilities, reducing CPU load and enhancing overall system performance.

Terminal Position: QUAD

QUAD terminal position simplifies board layout and facilitates easier routing of connections.

ROM Words: 2097152

Large ROM capacity allows for storing a significant amount of program code and data, catering to complex applications.

Width: 20 mm

Compact width dimension enables space-saving integration in tight layouts or small form factor devices.

Maximum Clock Frequency: 50 MHz

High clock frequency supports fast processing speeds, suitable for applications requiring quick response times.

Maximum Time At Peak Reflow Temperature (s): 40

40-second maximum reflow time at peak temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C guarantees secure solder joints and component bonding.

Length: 20 mm

Compact length dimension complements the overall small form factor design of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design offers efficient instruction execution and high performance for embedded applications.

RAM Bytes: 262144

Large RAM capacity allows for efficient data storage and processing, essential for multitasking and data-intensive applications.

Technology: CMOS

CMOS technology enables low-power operation and high-speed performance for energy-efficient applications.

Terminal Form: GULL WING

GULL WING terminal form provides mechanical strength and reliability in soldered connections.

Maximum Supply Current: 115.08 mA

Support for a maximum supply current of 115.08 mA ensures stable and consistent power delivery to the microcontroller.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures proper operation and compatibility with standard power sources.

PWM Channels: YES

PWM channels enable precise control of pulse-width modulation signals, crucial for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and easy updates of program code and data, enhancing product versatility.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm ensures high-density mounting and efficient board layout in compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, suitable for standard assembly and handling procedures.

Speed: 180 rpm

Speed rating of 180 rpm meets the performance requirements for a wide range of motor control and automation applications.

No. of I/O Lines: 100

Having 100 I/O lines provides extensive connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MK66FN2M0VLQ18 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

100

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

115.08 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MK66FN2M0VLQ18 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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