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LPC4337FET256,551

NXP Semiconductors

LPC4337FET256,551 by NXP Semiconductors

NXP Semiconductors' LPC4337FET256,551 is a 32-bit microcontroller with Cortex-M4 CPU, 24-bit address bus, and 32-bit external data bus. It features DAC and ADC channels, PWM support, and 139264 bytes of RAM. Ideal for industrial applications requiring high-speed processing at up to 25 MHz clock frequency.

Median Price

$21.258

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 450 parts In-Stock

1+ parts

$15.550

100+ parts

$9.800

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450

$15.550

$9.800

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Arrow

USA . 23 parts In-Stock

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$19.330

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$11.032

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$19.330

$11.032

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Chip1Stop

Japan . 23 parts In-Stock

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$21.258

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$21.258

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Mouser Electronics

USA . 95 parts In-Stock

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$23.390

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$15.470

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95

$23.390

$15.470

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Newark

USA . 5 parts In-Stock

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$24.410

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$17.870

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$16.530

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5

$24.410

$17.870

$16.530

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Element14

Singapore . 73 parts In-Stock

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$29.280

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$20.350

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73

$29.280

$20.350

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Verical

USA . 90 parts In-Stock

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$14.747

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$14.586

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$14.747

$14.586

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Distributors (In-Stock)

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Digiode

USA . 1,776 parts In-Stock

1+ parts

$11.694

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$11.694

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Nova Conductors

Japan . 150 parts In-Stock

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$17.150

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$17.150

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NAC Semi

USA . 13,680 parts In-Stock

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$20.180

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$20.180

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Anansix

USA . 1,077 parts In-Stock

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IBS Electronics

USA . 541 parts In-Stock

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$17.461

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$17.251

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541

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$17.251

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Vyrian

USA . 537 parts In-Stock

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Pegasus Components GmbH

Germany . 200 parts In-Stock

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Bristol Electronics

USA . 54 parts In-Stock

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Flip Electronics

USA . 43 parts In-Stock

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Prism Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 388 parts In-Stock

1+ parts

$11.079

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388

$11.079

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Modulus Dynamics

Lithuania . 3,024 parts In-Stock

1+ parts

$17.150

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$17.150

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$17.150

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3,024

$17.150

$17.150

$17.150

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Corohmni

South Africa . 500 parts In-Stock

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$17.150

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$17.150

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Continental Prestige Electronics

USA . 5,196 parts In-Stock

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$17.250

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$16.905

5,196

$17.250

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$16.905

Advanced Electronics

New Zealand . 10,000 parts In-Stock

1+ parts

$17.664

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$16.781

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$16.781

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$17.664

$16.781

$16.781

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Semicontronic

India . 846 parts In-Stock

1+ parts

$22.770

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$22.201

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$22.087

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846

$22.770

$22.201

$22.087

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Aztec Data Supply Inc.

USA . 1,770 parts In-Stock

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$46.510

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1,770

$46.510

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Microchip USA

USA . 2,370 parts In-Stock

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$53.680

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$52.750

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$52.280

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$51.810

2,370

$53.680

$52.750

$52.280

$51.810

QUARKTWIN TECHNOLOGY LTD

USA . 9,740 parts In-Stock

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UNI Independent Distributors

Spain . 7,528 parts In-Stock

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Perfect Parts

USA . 3,977 parts In-Stock

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Argo Parts USA

USA . 3,156 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$17.140

1k+ parts

$16.615

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$16.266

2,000

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$17.140

$16.615

$16.266

Futuretech Components

Singapore . 1,800 parts In-Stock

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1,800

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Lixinc

USA . 338 parts In-Stock

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338

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Lucentia Tech

USA . 40 parts In-Stock

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$0.051

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$0.051

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$0.051

40

-

$0.051

$0.051

$0.051

Robosynatics

Brazil . 20 parts In-Stock

1+ parts

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$0.051

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$0.051

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$0.051

20

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$0.051

$0.051

$0.051

Overview

Discover the LPC4337FET256,551 by NXP Semiconductors, a top-tier microcontroller designed to deliver unparalleled performance and efficiency. With a cutting-edge Cortex-M4 CPU family, this device offers a wide range of applications in various industries. Boasting a robust package body material and advanced technology, this microcontroller ensures reliability and durability. Benefit from its versatile ADC and PWM channels, along with a high RAM capacity, to enhance your projects significantly. Trust NXP's reputation for quality and innovation and unlock endless possibilities with the LPC4337FET256,551.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can support a wide range of applications and power sources.

Address Bus Width: 24

A larger address bus width allows for increased memory addressing capabilities, making this microcontroller suitable for complex programs and data processing.

Bit Size: 32

A 32-bit architecture provides high processing power and performance, making this microcontroller suitable for demanding tasks and real-time applications.

DAC Channels: YES

Digital-to-Analog Converter (DAC) channels allow for analog signal output, enabling this microcontroller to interface with a variety of sensors and actuators.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages gives flexibility in design and compatibility with different power sources.

No. of Terminals: 256

A high number of terminals allow for versatile connectivity and expansion options, making this microcontroller suitable for projects with multiple peripherals and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile package style offer efficient space utilization on the PCB, enabling compact designs and easy integration into small form factor devices.

Minimum Supply Voltage: 2.2 V

With a low minimum supply voltage, this microcontroller can operate efficiently even with limited power sources, making it suitable for battery-powered applications.

CPU Family: CORTEX-M4

The Cortex-M4 architecture provides high performance and low power consumption, making this microcontroller ideal for embedded systems requiring real-time processing capabilities.

Technical Specifications

Microcontrollers LPC4337FET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC4337FET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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