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LPC4370FET100E

NXP Semiconductors

LPC4370FET100E by NXP Semiconductors

NXP Semiconductors' LPC4370FET100E is a 32-bit microcontroller with 288768 bytes of RAM, operating at up to 25 MHz. It features DAC and ADC channels, PWM support, and Cortex-M4F CPU family for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

$8.140

Lifecycle Status

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8

In-Stock Inventory

1k+

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Farnell

UK . 167 parts In-Stock

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$8.140

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$5.670

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$4.290

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Element14

Singapore . 167 parts In-Stock

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$15.110

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$11.300

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$8.570

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Verical

USA . 9,880 parts In-Stock

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$7.890

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Nova Conductors

Japan . 34 parts In-Stock

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Vyrian

USA . 10,351 parts In-Stock

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Digiode

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Anansix

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Prism Electronics

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Continental Prestige Electronics

USA . 4,501 parts In-Stock

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$6.837

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$6.700

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Netroflash

USA . 1,000 parts In-Stock

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$6.837

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Semicontronic

India . 756 parts In-Stock

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$7.800

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$7.760

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AZTECH Wire

Italy . 722 parts In-Stock

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$10.301

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Ampacity Inc.

Singapore . 171 parts In-Stock

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$16.000

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One Stop Electronics

USA . 1,017 parts In-Stock

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Advanced Electronics

New Zealand . 89 parts In-Stock

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$25.706

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$23.392

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$21.079

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Aztec Data Supply Inc.

USA . 1,078 parts In-Stock

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$57.810

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Corohmni

South Africa . 352 parts In-Stock

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Modulus Dynamics

Lithuania . 1,053 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,259 parts In-Stock

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Microchip USA

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Lixinc

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UNI Independent Distributors

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Corphita

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Robosynatics

Brazil . 2,132 parts In-Stock

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Lucentia Tech

USA . 2,132 parts In-Stock

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Argo Parts USA

USA . 483 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your next project with the LPC4370FET100E microcontroller by NXP Semiconductors. Crafted with precision and reliability, this powerhouse offers a seamless experience for a wide range of applications. With advanced features like DAC and ADC channels, DMA capabilities, and a fast clock frequency, this Cortex-M4F CPU family member delivers unparalleled performance. Say goodbye to limitations and hello to endless possibilities with the LPC4370FET100E - the ultimate choice for those who demand nothing but the best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square shape makes it easier to handle and place on circuit boards efficiently.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance.

DAC Channels: YES

DAC channels enable the microcontroller to output analog signals, expanding its range of applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with various systems.

No. of Terminals: 100

Having a high number of terminals allows for connectivity to numerous external components and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enhances the overall compactness and performance of the microcontroller.

Minimum Supply Voltage: 2.2 V

Low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in various environmental conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high computational power and efficiency for demanding applications.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures reliable operation even in harsh environments.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital, expanding its versatility.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and performance by allowing peripherals to access memory directly.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enhances thermal performance.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact and slim designs in space-constrained applications.

Width: 9 mm

Compact width makes it suitable for applications with limited space constraints.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency allows for fast processing and real-time operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability during assembly processes.

Length: 9 mm

Compact length makes it suitable for space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and power efficiency for embedded applications.

RAM Bytes: 288768

Large RAM capacity provides ample space for data storage and processing, enhancing the microcontroller's capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for energy-efficient designs.

Terminal Form: BALL

Ball terminal form facilitates easy mounting and rework during assembly processes.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

PWM channels enable precise control of analog signals, essential for applications like motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient firmware updates and customization.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density mounting on PCBs, saving space and improving overall design efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to maintain reliability.

Speed: 204 rpm

High-speed performance of 204 revolutions per minute ensures efficient data processing and operation.

No. of I/O Lines: 49

Having a sufficient number of I/O lines allows for versatile connectivity and interaction with external devices and peripherals.

Technical Specifications

Microcontrollers LPC4370FET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

288768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC4370FET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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