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LPC4330FET100

NXP Semiconductors

LPC4330FET100 by NXP Semiconductors

LPC4330FET100 by NXP Semiconductors is a 32-bit microcontroller with 24-bit address bus width, operating at up to 25 MHz. It features DAC and ADC channels, along with DMA support, making it ideal for industrial applications requiring high-speed data processing and control capabilities. With a compact square package style and low profile design, this microcontroller offers versatile integration options in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,703 parts In-Stock

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3,703

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ComSIT Distribution GmbH

Germany . 3,036 parts In-Stock

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Flip Electronics

USA . 1,820 parts In-Stock

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Anansix

USA . 578 parts In-Stock

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Zilex Electronics Inc.

Canada . 260 parts In-Stock

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260

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Vyrian

USA . 159 parts In-Stock

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159

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 1,353 parts In-Stock

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$2.000

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$1.950

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$1.940

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$2.000

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$1.940

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AZTECH Wire

Italy . 641 parts In-Stock

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$5.192

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One Stop Electronics

USA . 765 parts In-Stock

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$15.000

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$15.000

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Ampacity Inc.

Singapore . 1,003 parts In-Stock

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$16.000

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Aztec Data Supply Inc.

USA . 338 parts In-Stock

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$37.940

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Corohmni

South Africa . 315 parts In-Stock

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$83.950

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$86.839

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$82.497

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Lixinc

USA . 16,924 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,849 parts In-Stock

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Continental Prestige Electronics

USA . 6,846 parts In-Stock

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Corphita

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Futuretech Components

Singapore . 2,080 parts In-Stock

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Perfect Parts

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Argo Parts USA

USA . 529 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Elevate your electronics projects with the LPC4330FET100 by NXP Semiconductors, a top-tier microcontroller that delivers unparalleled performance and reliability. With cutting-edge technology and precision engineering, NXP Semiconductors sets the standard for quality in the industry. This versatile microcontroller is ideal for a wide range of applications, offering seamless integration and high-speed processing capabilities. Experience the value and benefits of the LPC4330FET100, providing customers with a competitive edge in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with a wide range of power sources.

Address Bus Width: 24

Allows for efficient memory addressing within the system.

Package Shape: SQUARE

Provides a compact form factor for space-constrained applications.

Bit Size: 32

Enables high-speed processing and data handling capabilities.

DAC Channels: YES

Allows for accurate analog signal generation.

No. of Terminals: 100

Provides ample connectivity options for peripherals.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

Offers high density and reliability in a compact package.

Minimum Supply Voltage: 2.2 V

Allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Enables operation in extreme temperature conditions.

ADC Channels: YES

Enables analog input signal conversion for sensor interfacing.

DMA Channels: YES

Enhances data transfer efficiency within the system.

Terminal Position: BOTTOM

Simplifies PCB routing and layout design.

Maximum Seated Height: 1.2 mm

Allows for integration in slim and compact devices.

Width: 9 mm

Provides a balance of size and functionality.

External Data Bus Width: 32

Facilitates high-speed data transfer between components.

Maximum Clock Frequency: 25 MHz

Supports fast and efficient processing capabilities.

Length: 9 mm

Offers a square form factor for versatile mounting options.

Temperature Grade: INDUSTRIAL

Suitable for use in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Offers a powerful and efficient processing architecture.

Technology: CMOS

Provides low power consumption and high noise immunity.

Terminal Form: BALL

Enables reliable solder connections for robust performance.

Nominal Supply Voltage: 3.3 V

Ideal for compatibility with standard power supplies.

ROM Programmability: FLASH

Facilitates easy and flexible program updates.

Terminal Pitch: 0.5 mm

Allows for high-density pin configurations on the PCB.

Moisture Sensitivity Level (MSL): 3

Ensures compatibility with standard PCB assembly processes.

Speed: 204 rpm

Provides efficient processing capabilities for various applications.

No. of I/O Lines: 49

Offers versatile input and output options for interfacing with external devices.

Technical Specifications

Microcontrollers LPC4330FET100 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

204 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC4330FET100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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