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LPC4337JET256Y

NXP Semiconductors

LPC4337JET256Y by NXP Semiconductors

NXP Semiconductors' LPC4337JET256Y is a 32-bit microcontroller with 256 terminals, operating at up to 25 MHz. It features 8 ADC channels, CAN, Ethernet, and USB connectivity. Ideal for applications requiring high-speed data processing and multiple I/O interfaces in a compact square package.

Median Price

$13.263

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

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$13.263

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870

$13.263

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Vyrian

USA . 7,411 parts In-Stock

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Digiode

USA . 3,168 parts In-Stock

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Anansix

USA . 1,532 parts In-Stock

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1,532

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Distributors (Availability)

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One Stop Electronics

USA . 163 parts In-Stock

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$7.000

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163

$7.000

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Ampacity Inc.

Singapore . 1,425 parts In-Stock

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$9.000

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Continental Prestige Electronics

USA . 1,859 parts In-Stock

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$13.263

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$12.998

1,859

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$12.998

Netroflash

USA . 100 parts In-Stock

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$13.263

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100

$13.263

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AZTECH Wire

Italy . 822 parts In-Stock

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$14.424

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822

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Vigor

Singapore . 1,825 parts In-Stock

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$19.200

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Semicontronic

India . 1,305 parts In-Stock

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$30.000

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$29.250

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$29.100

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Microchip USA

USA . 2,643 parts In-Stock

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$41.707

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Aztec Data Supply Inc.

USA . 4,487 parts In-Stock

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$63.460

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Corohmni

South Africa . 509 parts In-Stock

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$66.478

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509

$66.478

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Advanced Electronics

New Zealand . 84 parts In-Stock

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$68.109

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$64.703

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$64.703

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84

$68.109

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$64.703

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Corphita

USA . 3,795 parts In-Stock

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UNI Independent Distributors

Spain . 2,843 parts In-Stock

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Argo Parts USA

USA . 2,492 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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350

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Overview

Unlock endless possibilities with the LPC4337JET256Y microcontroller by NXP Semiconductors, offering top-notch quality and reliability. Ideal for a wide range of applications, this powerful device boasts cutting-edge features such as multiple ADC and DAC channels, extensive connectivity options, and a robust CPU core. Experience seamless performance and unparalleled efficiency with this innovative product, designed to bring value and convenience to your projects. Elevate your designs with the LPC4337JET256Y and revolutionize the way you work.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for high-volume manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

The square package shape helps in space-efficient PCB design and layout, especially in applications where board space is limited.

Bit Size: 32

The 32-bit architecture provides high processing power and performance, suitable for complex computing tasks and applications.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog sensors and devices, expanding its application capabilities.

No. of Terminals: 256

The large number of terminals allows for versatile connectivity options, making this microcontroller suitable for applications requiring extensive interfacing.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array low profile package style offers high connectivity density in a compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage ensures power efficiency and compatibility with a wide range of power sources, making this microcontroller versatile in different applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance in harsh environments, suitable for industrial and automotive applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family offers high performance and low power consumption, making this microcontroller suitable for energy-efficient embedded applications.

Technical Specifications

Microcontrollers LPC4337JET256Y attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

204 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2), ETHERNET, I2C(2), I2S(2), SDMMC, SPI, SPIFI, SSP(2), UART, USART(3), USB(2)

Peripherals:

BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 10-Bit (2)

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC4337JET256Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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