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SPC5668GK0MMGR

NXP Semiconductors

SPC5668GK0MMGR by NXP Semiconductors

MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

Median Price

$47.629

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 10,000 parts In-Stock

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$47.629

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Vyrian

USA . 7,041 parts In-Stock

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Chip Stock

USA . 5,120 parts In-Stock

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Digiode

USA . 2,112 parts In-Stock

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Anansix

USA . 188 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 948 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 465 parts In-Stock

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$19.630

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Vigor

Singapore . 4,757 parts In-Stock

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$71.637

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Microchip USA

USA . 2,911 parts In-Stock

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$106.341

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Lixinc

USA . 14,267 parts In-Stock

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Kepictronics

USA . 12,888 parts In-Stock

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UNI Independent Distributors

Spain . 5,825 parts In-Stock

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Corphita

USA . 3,942 parts In-Stock

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Technical Specifications

Microcontrollers SPC5668GK0MMGR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN SILVER

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

SPC5668GK0MMGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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