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SPC5605BK0CLL6R

NXP Semiconductors

SPC5605BK0CLL6R by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

Median Price

$13.403

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 3,967 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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$13.403

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900

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Vyrian

USA . 6,431 parts In-Stock

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Flip Electronics

USA . 3,967 parts In-Stock

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Anansix

USA . 1,876 parts In-Stock

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Digiode

USA . 1,370 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,697 parts In-Stock

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$13.403

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$13.135

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Netroflash

USA . 2,000 parts In-Stock

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$13.403

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AZTECH Wire

Italy . 657 parts In-Stock

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$15.510

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Vigor

Singapore . 2,511 parts In-Stock

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$21.340

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Aztec Data Supply Inc.

USA . 2,359 parts In-Stock

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$25.776

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Ampacity Inc.

Singapore . 3,939 parts In-Stock

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Corohmni

South Africa . 777 parts In-Stock

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$35.505

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Microchip USA

USA . 2,930 parts In-Stock

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$42.146

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Corphita

USA . 4,073 parts In-Stock

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UNI Independent Distributors

Spain . 3,378 parts In-Stock

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Argo Parts USA

USA . 405 parts In-Stock

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Technical Specifications

Microcontrollers SPC5605BK0CLL6R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

SPC5605BK0CLL6R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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