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LPC43S30FET100E

NXP Semiconductors

LPC43S30FET100E by NXP Semiconductors

NXP Semiconductors' LPC43S30FET100E microcontroller features a 32-bit CORTEX-M4 CPU, 16-bit address bus width, and max clock frequency of 25 MHz. With DAC and ADC channels, it's ideal for applications requiring CAN, I2C, I2S, SSP connectivity such as industrial automation and IoT devices.

Median Price

$6.623

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$6.623

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Vyrian

USA . 3,667 parts In-Stock

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Anansix

USA . 2,355 parts In-Stock

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Digiode

USA . 1,738 parts In-Stock

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Continental Prestige Electronics

USA . 299 parts In-Stock

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$6.623

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$6.490

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$6.490

Vigor

Singapore . 5,590 parts In-Stock

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$9.250

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AZTECH Wire

Italy . 886 parts In-Stock

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$9.707

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Microchip USA

USA . 1,371 parts In-Stock

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$21.196

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One Stop Electronics

USA . 1,315 parts In-Stock

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$23.000

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Ampacity Inc.

Singapore . 759 parts In-Stock

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$26.000

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Aztec Data Supply Inc.

USA . 815 parts In-Stock

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$43.270

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Corohmni

South Africa . 266 parts In-Stock

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$70.568

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UNI Independent Distributors

Spain . 6,991 parts In-Stock

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Corphita

USA . 1,372 parts In-Stock

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Argo Parts USA

USA . 1,106 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$6.490

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$6.292

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$6.159

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$6.490

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$6.159

Overview

Unlock endless possibilities with the LPC43S30FET100E by NXP Semiconductors. As a leading manufacturer, NXP delivers top-notch quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this product offers unparalleled value with its advanced features and benefits. Whether you're looking to enhance your IoT devices or power up your industrial automation systems, the LPC43S30FET100E provides the performance and efficiency you need. Trust NXP Semiconductors to elevate your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power input options for different applications.

Address Bus Width: 16

Allows for efficient memory addressing capabilities.

Package Shape: SQUARE

Facilitates easy placement and alignment during assembly.

Bit Size: 32

Offers high processing power and capability for complex tasks.

DAC Channels: YES

Enables the generation of analog signals for various applications.

No. of Terminals: 100

Provides ample connectivity options for peripherals and external components.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

Ensures high reliability and durability in various environmental conditions.

Minimum Supply Voltage: 2.2 V

Allows for low-power operation and energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of temperature environments.

CPU Family: CORTEX-M4

Provides a powerful and efficient processing platform for embedded applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Ensures reliable electrical connections and resistance to corrosion.

ADC Channels: YES

Enables conversion of analog signals to digital data for processing.

DMA Channels: YES

Facilitates efficient data transfer between memory and peripherals.

Terminal Position: BOTTOM

Allows for easy access and connection to external devices.

RAM Bytes: 2700336

Offers ample memory space for data storage and processing needs.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for optimized performance.

No. of I/O Lines: 49

Provides multiple input/output options for connecting to external devices and sensors.

Technical Specifications

Microcontrollers LPC43S30FET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2700336

ROM Words:

n/s

ROM Programmability:

FLASH

Speed:

204 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)

Peripherals:

BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT

Analog To Digital Convertors:

4-Ch 10-Bit (2)

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC43S30FET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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