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LPC43S30FET256E

NXP Semiconductors

LPC43S30FET256E by NXP Semiconductors

NXP Semiconductors' LPC43S30FET256E is a 32-bit microcontroller with Cortex-M4 CPU, offering 16-bit address and external data bus width. It features 8-Ch 10-Bit ADCs, CAN connectivity, and operates at up to 25 MHz. Ideal for applications requiring high-speed processing, analog-to-digital conversion, and versatile communication interfaces like I2C and UART.

Median Price

$9.235

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Verical

USA . 9,990 parts In-Stock

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Vyrian

USA . 8,690 parts In-Stock

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Digiode

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Anansix

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Flip Electronics

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Nova Conductors

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AZTECH Wire

Italy . 377 parts In-Stock

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Vigor

Singapore . 2,589 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 589 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 165 parts In-Stock

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Aztec Data Supply Inc.

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QUARKTWIN TECHNOLOGY LTD

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Futuretech Components

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Aranea Global

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Unlock the power of innovation with the LPC43S30FET256E by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microcontrollers that are designed to drive superior performance across a wide range of applications. With advanced features like DAC and ADC channels, this product offers unparalleled value and benefits to customers seeking cutting-edge solutions. Trust NXP to provide you with a reliable and efficient microcontroller that will take your projects to the next level. Experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making the product suitable for mass production.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage input, providing flexibility in power supply options.

Address Bus Width: 16

Allows for efficient memory addressing and data transfer capabilities, enhancing overall performance.

Package Shape: SQUARE

Square package shape provides efficient use of PCB space and easier integration into electronic systems.

Bit Size: 32

32-bit architecture offers higher processing power and performance compared to lower bit sizes.

DAC Channels: YES

Digital to analog converters enable the microcontroller to interface with analog devices, expanding its capabilities.

No. of Terminals: 256

A higher number of terminals allow for more connectivity options and peripherals to be connected to the microcontroller.

ROM Words: n/s

ROM (Read-Only Memory) capacity not specified, but likely sufficient for storing firmware and program data.

Digital To Analog Convertors: 1-Ch 10-Bit

The 10-bit DAC provides good resolution for converting digital signals to analog outputs accurately.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the microcontroller and external devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and efficiency, making the microcontroller suitable for real-time applications.

RAM Bytes: 2700336

Large RAM capacity enables the microcontroller to handle multiple tasks and store temporary data efficiently.

Analog To Digital Convertors: 8-Ch 10-Bit (2)

Multiple ADC channels with 10-bit resolution allow for accurate conversion of analog signals to digital data from multiple sources.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

Connectivity: CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)

Wide range of connectivity options for interfacing with various devices and communication protocols, enhancing versatility.

Technical Specifications

Microcontrollers LPC43S30FET256E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2700336

ROM Words:

n/s

ROM Programmability:

FLASH

Speed:

204 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)

Peripherals:

BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 10-Bit (2)

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC43S30FET256E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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