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SPC5644CF0MLT1R

NXP Semiconductors

SPC5644CF0MLT1R by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$39.470

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 5,606 parts In-Stock

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Rochester

USA . 5,580 parts In-Stock

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$39.470

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$35.320

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$33.240

5,580

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$39.470

$35.320

$33.240

DigiKey

USA . 26 parts In-Stock

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$35.100

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26

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$35.100

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Verical

USA . 26 parts In-Stock

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$40.530

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26

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$40.530

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Distributors (In-Stock)

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Digiode

USA . 4,594 parts In-Stock

1+ parts

$34.732

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Flip Electronics

USA . 5,606 parts In-Stock

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5,606

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Vyrian

USA . 4,024 parts In-Stock

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Anansix

USA . 2,852 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,440 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,543 parts In-Stock

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$29.840

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$29.840

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Corphita

USA . 4,153 parts In-Stock

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$32.904

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$32.904

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Vigor

Singapore . 9,000 parts In-Stock

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$56.540

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$56.540

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Microchip USA

USA . 1,812 parts In-Stock

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$86.943

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$86.943

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QUARKTWIN TECHNOLOGY LTD

USA . 17,610 parts In-Stock

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UNI Independent Distributors

Spain . 1,951 parts In-Stock

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1,951

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Technical Specifications

Microcontrollers SPC5644CF0MLT1R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4D

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

32

No. of I/O Lines:

177

No. of Terminals:

208

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

196608

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

I2C, CAN(6), ETHERNET, SCI(10), SPI(8)

Peripherals:

DMA(32), RTC, RTI, PWM, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 12-Bit, 33-Ch 10-Bit

Trade Compliance

SPC5644CF0MLT1R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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