Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FS32K148UGT0VLQR
NXP Semiconductors
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; On Chip Program ROM Width: 8;
YES
32
CORTEX-M4F
40 MHz
NO
FLOATING-POINT
S-PQFP-G144
20 mm
16
128
3
144
66
8
105 Cel
-40 Cel
PLASTIC/EPOXY
LFQFP
QFP144,.87SQ,20
SQUARE
FLATPACK, LOW PROFILE, FINE PITCH
262144
2097152
FLASH
ISO 26262
1.6 mm
112 rpm
5.5 V
2.7 V
5 V
CMOS
GULL WING
.5 mm
QUAD
MICROCONTROLLER, RISC
4096
CAN(3), I2C(2), LIN(3), LPUART(3), SAI(2), SPI(3)
BOR, COMPARATOR, POR, RTC, TIMER(66), WDT
32-Ch 12-Bit
1-Ch 8-Bit
FS32K148UJT0VLLT
FS32K148UJT0VLLT by NXP Semiconductors is a 32-bit microcontroller with integrated cache and a max clock frequency of 40 MHz. It is commonly used in applications such as automotive systems, industrial control, and consumer electronics.
S-PQFP-G100
e3
14 mm
89
100
QFP100,.63SQ,20
260
1.7 mm
TIN
40
S912ZVH64F2CLQ
MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
24
20 MHz
FIXED POINT
4
85 Cel
65536
32 rpm
30 mA
4.5 V
INDUSTRIAL
MICROCONTROLLER
2048
CAN, I2C, LIN, SCI(2), SPI
COMPARATOR(4), LCD, POR, PWM, RTC, TIMER(2), WDT
1-Ch 10-Bit
S912XET256BCAAR
MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE;
0
HCS12X
S-PQFP-G80
59
80
QFP
QFP80,.68SQ
FLATPACK
16384
2.45 mm
50 rpm
100 mA
3.13 V
.65 mm
4K
I2C, SCI(2), SPI(3)
CAN(3), COMPARATOR(4), PWM(8), WDT
S912XET256BMAGR
NXP Semiconductors' S912XET256BMAGR microcontroller features 32-bit architecture, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for automotive applications, it offers CAN(3), PWM(8), and WDT peripherals with a max clock frequency of 40 MHz. With low power mode and FLASH ROM programmability, this microcontroller is suitable for various automotive control systems.
22
119
125 Cel
AUTOMOTIVE
I2C, SCI(4), SPI(3)
2-Ch 24-Bit
S912XET256BVAL
MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: LQFP; Package Shape: SQUARE;
S-PQFP-G112
91
112
LQFP
QFP112,.87SQ
FLATPACK, LOW PROFILE
2-Ch 16-Bit
S912XEG128BMAL
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: LQFP; Package Shape: SQUARE;
12288
131072
2K
I2C, SCI(2), SPI(2)
CAN(2), COMPARATOR(4), PWM(8), WDT
1-Ch 16-Bit
S912XEG128BMAA
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE;
S912XEA128BCAA
NXP Semiconductors' S912XEA128BCAA microcontroller features 32-bit architecture, 131072 ROM words, and 12288 RAM bytes. Ideal for industrial applications with CAN(2), PWM(8), and WDT peripherals. Operates at up to 40 MHz clock frequency in a compact flatpack package.
2-Ch 12-Bit
S9S12VR16F0VLC
MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
HCS12
S-PQFP-G32
7 mm
5
QFP32,.35SQ,32
25 rpm
22 mA
18 V
6 V
.8 mm
LIN, SCI
COMPARATOR(3), POR, PWM(12), TIMER(4), WDT
2-Ch 10-Bit
S9S12VR32F0CLCR
32768
512
LIN, SCI(2), SPI
S9S12VR64AF0VLC
S9S12VR48AF0CLC
49152
S9S12VR64AF0MLC
NXP Semiconductors' S9S12VR64AF0MLC microcontroller features 16-bit CPU, 20 MHz clock frequency, and 2048 bytes of RAM. Ideal for automotive applications with LIN, SCI(2), SPI connectivity and low power mode support.
S9S12VR16F0MLC
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
S9S12VR48AF0MLF
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G48
28
48
QFP48,.35SQ,20
6-Ch 10-Bit
S9KEAZN8AVFK
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
24 MHz
S-XQCC-N24
4 mm
1
UNSPECIFIED
HVQCCN
LCC24,.16SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1024
8192
.92 mm
48 rpm
3 V
NO LEAD
I2C, SPI, USART
RTC, TIMER(4), WDT
12-Ch 12-Bit
1-Ch 6-Bit
LS2088AXE711B
MICROCONTROLLER, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
e1
250
TIN SILVER COPPER
30
K32L2A41VLL1A
MICROCONTROLLER, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
K32L2A31VLH1A
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
K32L2A31VLL1A
MICROCONTROLLER, RISC; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
S912ZVC19F0MLFR
S12Z
2
196608
35 mA
40 V
3.5 V
12 V
CAN, I2C, SCI(2), SENT, SPI
COMPARATOR(2), POR, RTI, TIMER(8), WDT
10-Ch 10-Bit
LPC54S018JET180Y
NXP Semiconductors' LPC54S018JET180Y microcontroller features a 32-bit Cortex-M4 CPU, 360K RAM, and 12-Ch 12-Bit ADC. Ideal for industrial applications requiring CAN, ETHERNET, I2C(11), SPI(11), UART(11), US(2) connectivity and low power mode with a max clock frequency of 25 MHz.
21
CORTEX-M4
25 MHz
FLOATING POINT
S-PBGA-B180
12 mm
145
10
180
TFBGA
BGA180,14X14,32
GRID ARRAY, THIN PROFILE, FINE PITCH
368640
360K
1.2 mm
180 rpm
3.6 V
1.71 V
3.3 V
BALL
BOTTOM
CAN(2), ETHERNET, I2C(11), SPI(11), UART(11), US(2)
BOD, DMA(32), POR, RTC, TIMER(8), WDT
MK81FN256VLL15
NXP Semiconductors' MK81FN256VLL15 microcontroller features 262144 ROM and RAM words, with a Cortex-M4F CPU family. It offers 66 I/O lines, 25 timers, and ADC/DAC channels for industrial applications requiring a temperature range of -40 to 105°C.
25
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
150 rpm
LPC11U36FBD64/40EL
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
CORTEX-M0
S-PQFP-G64
10 mm
54
64
QFP64,.47SQ,20
10240
98304
1.8 V
LS2088AXN7V1B
MICROCONTROLLER, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
LS2088AXN7TTB
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; JESD-609 Code: e1;
LS2088AXE7V1B
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
LS2088ASE7QQB
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
LS2088AXE7TTB
MICROCONTROLLER, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
LS2088AXN711B
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 250;
LS2088ASE711B
MICROCONTROLLER, RISC; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
LS2088ASE7V1B
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30;
LS2088ASN7TTB
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER;
LS2088ASN7V1B
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
LS2088ASN711B
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30;
LS2088ASE7TTB
MICROCONTROLLER, RISC; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30;
LS2088ASN7QQB
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; JESD-609 Code: e1;
LPC5526JBD100Y
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLQFP; Package Shape: SQUARE;
CORTEX-M33
32 MHz
33
6
HLQFP
HQFP100,.63SQ,20
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
147456
CRC, I2C, I2S(8), SPI(8), UART(8), USB(2)
AES, BOD, COMPARATOR, DMA(33), MRT, POR, PWM, RTC, TIMER(5), WDT
10-Ch 16-Bit
LPC55S28JBD64Y
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HTQFP; Package Shape: SQUARE;
36
HTQFP
TQFP64,.47SQ
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
524288
8-Ch 16-Bit
LPC55S26JBD100Y
LPC55S69JEV98K
NXP Semiconductors' LPC55S69JEV98K microcontroller features a 32-bit Cortex-M33 CPU, 327680 bytes of RAM, and 655360 ROM words. With 10-Ch 16-Bit ADCs, 33 DMA channels, and connectivity options like I2C(9) and SPI(9), it's ideal for industrial applications requiring low power consumption and high-speed processing.
S-PBGA-B98
9
98
VFBGA
BGA98,13X13,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
327680
655360
.97 mm
I2C(9), I2S(9), SPI(9), USART(9)
BOD, COMPARATOR, DMA(33), POR, RTC, TIMER(9), WDT
SC511660MZP40
MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
IT ALSO OPERATES AT 5 V
MPC500
S-PBGA-B272
27 mm
101
272
BGA
BGA272,20X20,50
GRID ARRAY
235
26624
458752
2.65 mm
40 rpm
250 mA
HCMOS
1.27 mm
CAN(2), SCI(2), QSPI
POR, RTC, TIMER(52), WDT
32-Ch 10-Bit
FS32R294KAK0MJDR
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Peak Reflow Temperature (C): 260;
e2
TIN SILVER
FS32R294KAK0MJDT
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER;
MC68HC11A1MFNE
MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: J BEND; No. of Terminals: 52; Package Shape: SQUARE; Maximum Clock Frequency: 12 MHz;
HC11
12 MHz
S-PQCC-J52
38
52
256
3 rpm
J BEND
SCI, SPI
TIMER, WDT
8-Ch 8-Bit
S912ZVL96F0MLF
NXP Semiconductors S912ZVL96F0MLF microcontroller features 16-bit CPU, 8KB RAM, and 20MHz clock frequency. Ideal for automotive applications with CAN, I2C, and SPI connectivity options. Operating temperature range from -40 to 125°C makes it suitable for harsh environments.
35
27 mA
3.135 V
CAN, I2C, SCI(2), SPI
POR, PWM(8), TIMER(8), WDT
10-Ch 12-Bit
A7005CGHN1/T1AGBEL
MICROCONTROLLER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
A700X
R-XQCC-N32
-25 Cel
RECTANGULAR
EEPROM
62 rpm
1.62 V
OTHER
I2C
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