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LPC5526JBD100Y

NXP Semiconductors

LPC5526JBD100Y by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLQFP; Package Shape: SQUARE;

Median Price

$6.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 993 parts In-Stock

1+ parts

$7.250

100+ parts

$4.714

1k+ parts

$4.256

10k+ parts

$4.167

993

$7.250

$4.714

$4.256

$4.167

Mouser Electronics

USA . 990 parts In-Stock

1+ parts

$7.250

100+ parts

$4.720

1k+ parts

$4.250

10k+ parts

-

990

$7.250

$4.720

$4.250

-

Arrow

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.010

10k+ parts

$4.754

13,000

-

-

$6.010

$4.754

Verical

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.010

10k+ parts

$4.754

13,000

-

-

$6.010

$4.754

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,970 parts In-Stock

1+ parts

$5.871

100+ parts

-

1k+ parts

-

10k+ parts

-

3,970

$5.871

-

-

-

Vyrian

USA . 6,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,040

-

-

-

-

Anansix

USA . 374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

374

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 690 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

-

690

$5.562

-

-

-

Microchip USA

USA . 2,975 parts In-Stock

1+ parts

$26.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,975

$26.920

-

-

-

UNI Independent Distributors

Spain . 6,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,620

-

-

-

-

Technical Specifications

Microcontrollers LPC5526JBD100Y attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

33

No. of External Interrupts:

8

No. of I/O Lines:

64

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CRC, I2C, I2S(8), SPI(8), UART(8), USB(2)

Peripherals:

AES, BOD, COMPARATOR, DMA(33), MRT, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC5526JBD100Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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