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S912XEA128BCAA

NXP Semiconductors

S912XEA128BCAA by NXP Semiconductors

NXP Semiconductors' S912XEA128BCAA microcontroller features 32-bit architecture, 131072 ROM words, and 12288 RAM bytes. Ideal for industrial applications with CAN(2), PWM(8), and WDT peripherals. Operates at up to 40 MHz clock frequency in a compact flatpack package.

Median Price

$12.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 407 parts In-Stock

1+ parts

-

100+ parts

$12.070

1k+ parts

$10.800

10k+ parts

$10.170

407

-

$12.070

$10.800

$10.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,092 parts In-Stock

1+ parts

$9.662

100+ parts

-

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2,092

$9.662

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Vyrian

USA . 10,091 parts In-Stock

1+ parts

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10,091

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Anansix

USA . 524 parts In-Stock

1+ parts

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524

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Flip Electronics

USA . 420 parts In-Stock

1+ parts

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420

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,680 parts In-Stock

1+ parts

$8.160

100+ parts

-

1k+ parts

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1,680

$8.160

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Corphita

USA . 868 parts In-Stock

1+ parts

$9.153

100+ parts

-

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868

$9.153

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Component Stockers USA

USA . 285 parts In-Stock

1+ parts

$10.500

100+ parts

$9.870

1k+ parts

-

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285

$10.500

$9.870

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AZTECH Wire

Italy . 550 parts In-Stock

1+ parts

$17.390

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550

$17.390

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Microchip USA

USA . 2,900 parts In-Stock

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2,900

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UNI Independent Distributors

Spain . 2,498 parts In-Stock

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2,498

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Overview

Elevate your product designs with the high-quality S912XEA128BCAA microcontroller by NXP Semiconductors. This powerful device offers unparalleled performance and reliability, making it ideal for a wide range of applications. With advanced features like multiple peripherals, low power mode, and ROM programmability, this microcontroller provides exceptional value and benefits to customers seeking cutting-edge technology solutions. Upgrade your projects today with the S912XEA128BCAA and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for better portability and longevity.

Surface Mount: YES

Easy to install and reduces PCB space usage.

Maximum Supply Voltage: 5.5 V

Supports higher voltage applications for versatility.

No. of Terminals: 80

Plenty of connectivity options for external devices.

Maximum Operating Temperature: 85 °C

Ability to function in high-temperature environments for industrial use.

ADC Channels: YES

Analog-to-digital conversion capability for sensor interface.

ROM Words: 131072

Large memory capacity for storing program instructions and data.

Data EEPROM Size: 2K

Non-volatile memory for data storage even during power loss.

Peripherals: CAN(2), COMPARATOR(4), PWM(8), WDT

Wide range of peripherals for various applications such as communication, signal comparison, and timing control.

Maximum Clock Frequency: 40 MHz

High-speed processing capability for quick response times.

Analog To Digital Convertors: 2-Ch 12-Bit

High-resolution ADC for accurate analog signal conversion.

Technology: CMOS

Efficient power consumption and reliable performance.

PWM Channels: YES

Pulse-width modulation support for precise control of devices.

Connectivity: I2C, SCI(2), SPI(2)

Various communication interfaces for connecting to external devices.

ROM Programmability: FLASH

Reprogrammable memory for flexibility in updating firmware.

Technical Specifications

Microcontrollers S912XEA128BCAA attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

HCS12X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

59

No. of Serial I/Os:

8

No. of Terminals:

80

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.68SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

50 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, SCI(2), SPI(2)

Peripherals:

CAN(2), COMPARATOR(4), PWM(8), WDT

Analog To Digital Convertors:

2-Ch 12-Bit

Trade Compliance

S912XEA128BCAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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