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S912XDG128F2MAL

NXP Semiconductors

S912XDG128F2MAL by NXP Semiconductors

NXP Semiconductors' S912XDG128F2MAL microcontroller features 16-bit CPU12, 23-bit address bus, and 16 MHz clock frequency. Ideal for automotive applications with 112 terminals, FLASH ROM, and ADC/DMA channels for efficient data processing in a compact square package.

Median Price

$18.315

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

S912XDG128F2MAL by NXP Semiconductors
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Rochester

USA . 533 parts In-Stock

1+ parts

-

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$16.280

1k+ parts

$14.570

10k+ parts

$13.710

533

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$16.280

$14.570

$13.710

Verical

USA . 533 parts In-Stock

1+ parts

-

100+ parts

$20.350

1k+ parts

$18.212

10k+ parts

$17.137

533

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$20.350

$18.212

$17.137

Distributors (In-Stock)

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Digiode

USA . 4,960 parts In-Stock

1+ parts

$15.618

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4,960

$15.618

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Nova Conductors

Japan . 48 parts In-Stock

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$18.810

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48

$18.810

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Vyrian

USA . 4,417 parts In-Stock

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Anansix

USA . 1,809 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 279 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 266 parts In-Stock

1+ parts

$10.290

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$10.290

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Vigor

Singapore . 8,300 parts In-Stock

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$13.200

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$13.200

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One Stop Electronics

USA . 295 parts In-Stock

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$13.970

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Ampacity Inc.

Singapore . 157 parts In-Stock

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$13.970

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Corphita

USA . 739 parts In-Stock

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$14.796

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739

$14.796

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Aranea Global

USA . 100 parts In-Stock

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$18.434

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$17.696

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100

$18.434

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$17.696

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Continental Prestige Electronics

USA . 3,233 parts In-Stock

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$18.810

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$18.434

3,233

$18.810

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$18.434

Semicontronic

India . 68 parts In-Stock

1+ parts

$30.410

100+ parts

$29.650

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$29.498

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68

$30.410

$29.650

$29.498

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Microchip USA

USA . 2,590 parts In-Stock

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$48.102

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2,590

$48.102

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Corohmni

South Africa . 47 parts In-Stock

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$75.091

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UNI Independent Distributors

Spain . 7,575 parts In-Stock

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Argo Parts USA

USA . 4,672 parts In-Stock

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Perfect Parts

USA . 941 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Unleash the power of innovation with the S912XDG128F2MAL by NXP Semiconductors. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the industry-leading expertise of NXP Semiconductors. Ideal for a wide range of applications, this versatile device provides customers with unmatched value and performance. Experience seamless integration, enhanced functionality, and endless possibilities with the S912XDG128F2MAL. Elevate your projects to new heights with NXP Semiconductors at the forefront of technological advancement.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable for a microcontroller package, providing protection and ensuring longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 2.75 V

A moderate maximum supply voltage ensures compatibility with various power sources while protecting the microcontroller from overvoltage damage.

Address Bus Width: 23

A wider address bus allows for larger memory addressing capability, accommodating more complex programs and data storage.

Package Shape: SQUARE

A square package shape provides better utilization of board space and allows for easy placement on the PCB.

Bit Size: 16

A 16-bit bit size offers a good balance between processing power and complexity, suitable for various applications.

Power Supplies (V): 2.5,5

Support for multiple power supply voltages enables flexibility in system design and integration with different components.

No. of Terminals: 112

Having a higher number of terminals allows for greater connectivity with external devices, peripherals, and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

A flatpack and low profile package style reduces the overall height of the component, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.35 V

A low minimum supply voltage ensures efficient operation even in low-power scenarios, extending the product's usefulness.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and maintain reliable performance.

CPU Family: CPU12

Being part of the CPU12 family indicates compatibility with a well-established and widely used microcontroller architecture, offering proven reliability and support.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature allows the microcontroller to operate in extreme cold environments, enhancing its versatility.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring stable connections during assembly and operation.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, expanding its potential applications.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer with minimal CPU intervention, optimizing performance and throughput.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, enhancing ease of assembly and reducing the risk of signal interference.

ROM Words: 131072

With a large ROM capacity of 131072 words, the microcontroller can store and execute complex programs, supporting advanced functionalities.

Width: 20 mm

A compact width of 20mm facilitates space-efficient PCB design and enables integration in small form factor devices.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer between the microcontroller and external memory components, enhancing performance.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz offers a balance between processing speed and power consumption, suitable for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller can withstand peak reflow temperature for up to 40 seconds, ensuring reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can undergo high-temperature soldering processes without damage.

Length: 20 mm

A compact length of 20mm contributes to a space-saving design and facilitates integration in constrained environments.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the microcontroller meets stringent temperature and reliability requirements for automotive electronics.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller peripheral IC, it offers integrated processing, memory, and I/O capabilities in a single package, simplifying system design.

RAM Bytes: 12288

With a RAM capacity of 12288 bytes, the microcontroller can efficiently store and manipulate data during program execution, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and inspection, improving manufacturing efficiency and reliability of the connection.

Nominal Supply Voltage: 2.5 V

A stable nominal supply voltage of 2.5V ensures consistent and reliable operation of the microcontroller in different operating conditions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels provide precise control over output signals, making the microcontroller suitable for applications requiring accurate voltage or frequency modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the microcontroller's memory, enabling firmware updates and customization.

Terminal Pitch: 0.65 mm

A small terminal pitch of 0.65mm supports high-density mounting, enabling compact PCB design and reducing overall system size.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microcontroller can withstand standard reflow soldering processes without risk of moisture-induced damage.

Speed: 40 rpm

With a speed rating of 40 rpm, the microcontroller can process instructions and data efficiently, supporting real-time applications and time-sensitive processes.

No. of I/O Lines: 91

Having a high number of I/O lines allows for versatile interfacing with external devices and peripherals, enabling rich connectivity and functionality.

Technical Specifications

Microcontrollers S912XDG128F2MAL attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G112

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

91

No. of Terminals:

112

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP112,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

S912XDG128F2MAL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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