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STM32F756IGT6

STMicroelectronics

STM32F756IGT6 by STMicroelectronics

STM32F756IGT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, 140 I/O lines, and 26 MHz clock frequency. It features ADC and DMA channels, suitable for applications requiring high-speed data processing and control systems. With a low profile flatpack package style, it is ideal for compact electronic designs.

Median Price

$18.395

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 61 parts In-Stock

1+ parts

$13.190

100+ parts

$11.978

1k+ parts

-

10k+ parts

-

61

$13.190

$11.978

-

-

Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$23.600

100+ parts

$16.100

1k+ parts

$15.310

10k+ parts

-

11

$23.600

$16.100

$15.310

-

Avnet

USA . 200 parts In-Stock

1+ parts

-

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-

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200

-

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$16.425

100+ parts

-

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-

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650

$16.425

-

-

-

Digiode

USA . 2,423 parts In-Stock

1+ parts

$17.085

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-

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-

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2,423

$17.085

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Vyrian

USA . 8,454 parts In-Stock

1+ parts

-

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8,454

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Chip Stock

USA . 4,000 parts In-Stock

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-

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4,000

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Anansix

USA . 2,195 parts In-Stock

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-

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2,195

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,196 parts In-Stock

1+ parts

$15.230

100+ parts

$14.849

1k+ parts

$14.773

10k+ parts

-

1,196

$15.230

$14.849

$14.773

-

Ampacity Inc.

Singapore . 941 parts In-Stock

1+ parts

$15.230

100+ parts

-

1k+ parts

-

10k+ parts

-

941

$15.230

-

-

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Corphita

USA . 1,950 parts In-Stock

1+ parts

$16.186

100+ parts

-

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-

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1,950

$16.186

-

-

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Continental Prestige Electronics

USA . 4,748 parts In-Stock

1+ parts

$16.365

100+ parts

-

1k+ parts

-

10k+ parts

$16.037

4,748

$16.365

-

-

$16.037

Corohmni

South Africa . 106 parts In-Stock

1+ parts

$27.176

100+ parts

-

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-

10k+ parts

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106

$27.176

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Microchip USA

USA . 2,143 parts In-Stock

1+ parts

$49.520

100+ parts

$48.660

1k+ parts

$48.230

10k+ parts

$47.800

2,143

$49.520

$48.660

$48.230

$47.800

IDEA Electronic Components Group

UK . 2,067 parts In-Stock

1+ parts

$63.510

100+ parts

-

1k+ parts

$57.159

10k+ parts

-

2,067

$63.510

-

$57.159

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Modulus Dynamics

Lithuania . 2,092 parts In-Stock

1+ parts

$66.421

100+ parts

$66.421

1k+ parts

$66.421

10k+ parts

-

2,092

$66.421

$66.421

$66.421

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Aztec Data Supply Inc.

USA . 31,330 parts In-Stock

1+ parts

$71.330

100+ parts

-

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-

10k+ parts

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31,330

$71.330

-

-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$76.954

100+ parts

$73.107

1k+ parts

$73.107

10k+ parts

-

500

$76.954

$73.107

$73.107

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Vigor

Singapore . 52 parts In-Stock

1+ parts

$110.000

100+ parts

-

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-

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52

$110.000

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MKK Technologies

India . 2,041 parts In-Stock

1+ parts

$119.427

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-

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2,041

$119.427

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DigiPath Technology Company

USA . 2,041 parts In-Stock

1+ parts

$119.427

100+ parts

-

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2,041

$119.427

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QUARKTWIN TECHNOLOGY LTD

USA . 11,675 parts In-Stock

1+ parts

-

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11,675

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Lixinc

USA . 1,915 parts In-Stock

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1,915

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Robosynatics

Brazil . 1,561 parts In-Stock

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1,561

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Lucentia Tech

USA . 1,561 parts In-Stock

1+ parts

-

100+ parts

$60.927

1k+ parts

$59.683

10k+ parts

$59.683

1,561

-

$60.927

$59.683

$59.683

Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

-

100+ parts

$75.936

1k+ parts

-

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1,203

-

$75.936

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$16.096

1k+ parts

$15.604

10k+ parts

$15.275

1,000

-

$16.096

$15.604

$15.275

Perfect Parts

USA . 627 parts In-Stock

1+ parts

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627

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Argo Parts USA

USA . 75 parts In-Stock

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75

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GreenTree Electronics

Israel . 40 parts In-Stock

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40

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Overview

Discover the STM32F756IGT6 by STMicroelectronics, a top-of-the-line microcontroller that offers unparalleled quality and reliability. With a wide range of applications in various industries, this innovative product delivers exceptional value and benefits to customers. From its advanced technology to its high-speed performance, the STM32F756IGT6 is designed to meet the demands of today's dynamic market. Trust STMicroelectronics for cutting-edge solutions that drive success.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy integration onto PCBs, saving valuable space and enabling efficient assembly processes.

Maximum Supply Voltage: 3.6 V

Provides a wide operating range for flexibility in various applications.

Address Bus Width: 26

Supports complex memory addressing capabilities, allowing for large amounts of data processing.

Package Shape: SQUARE

Facilitates easy handling and precise placement during manufacturing.

Bit Size: 32

Offers high computational power and efficiency for executing complex algorithms and tasks.

No. of Terminals: 176

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ensures a compact and streamlined design suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power scenarios, extending battery life and reducing energy consumption.

Terminal Finish: MATTE TIN

Enhances solderability and reliability of connections for robust performance.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with analog sensors and signals.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, optimizing system performance.

Terminal Position: QUAD

Allows for convenient pinout configuration and compatibility with standard socket layouts.

External Data Bus Width: 32

Supports high-speed data transfer between external memory and the microcontroller core for improved overall performance.

Maximum Clock Frequency: 26 MHz

Offers fast processing speed, suitable for real-time applications and demanding computational tasks.

Peak Reflow Temperature °C: 260

Enables robust solder joint formation during assembly processes, ensuring reliable operation under varying conditions.

Length: 24 mm

Compact form factor for integration into space-constrained designs without compromising functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a streamlined RISC architecture for efficient execution of instructions and optimized performance.

Technology: CMOS

Features low power consumption and high noise immunity for reliable operation in diverse environments.

Terminal Form: GULL WING

Enables secure and reliable solder connections for durability and long-term performance.

Nominal Supply Voltage: 3 V

Provides a stable operating voltage for consistent and reliable performance across different operating conditions.

PWM Channels: YES

Supports pulse-width modulation for precise control of outputs such as motor speed and LED brightness.

Terminal Pitch: 0.5 mm

Offers fine pitch spacing for high-density board layouts, suitable for compact designs and miniaturized products.

Moisture Sensitivity Level (MSL): 3

Indicates compatibility with standard moisture sensitivity levels, ensuring reliability during storage and assembly.

Speed: 216 rpm

Provides high processing speed for rapid data manipulation and response times in critical applications.

No. of I/O Lines: 140

Offers ample input/output options for versatile interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F756IGT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

140

No. of Terminals:

176

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

216 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

STM32F756IGT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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