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S912ZVC12F0MLFR

NXP Semiconductors

S912ZVC12F0MLFR by NXP Semiconductors

NXP Semiconductors S912ZVC12F0MLFR microcontroller features 20 MHz clock frequency, 10-Ch 10-Bit ADC, and 131072 ROM words. Ideal for applications requiring low power mode, it supports CAN, I2C, SCI(2), SENT, SPI connectivity with a max supply voltage of 40V.

Median Price

$4.971

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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$4.971

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$4.971

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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$6.130

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750

$6.130

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Chip Stock

USA . 8,700 parts In-Stock

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8,700

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Vyrian

USA . 5,291 parts In-Stock

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Digiode

USA . 4,579 parts In-Stock

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Anansix

USA . 389 parts In-Stock

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389

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Distributors (Availability)

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Ampacity Inc.

Singapore . 811 parts In-Stock

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$2.000

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811

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AZTECH Wire

Italy . 426 parts In-Stock

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$5.969

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Continental Prestige Electronics

USA . 1,055 parts In-Stock

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$6.130

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$6.007

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$6.130

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$6.007

Advanced Electronics

New Zealand . 15 parts In-Stock

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$6.253

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$6.253

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$6.253

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$6.253

$6.253

$6.253

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Modulus Dynamics

Lithuania . 81 parts In-Stock

1+ parts

$6.804

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$6.736

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$6.532

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81

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Microchip USA

USA . 215 parts In-Stock

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$15.113

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Semicontronic

India . 888 parts In-Stock

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$27.000

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$26.325

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$26.190

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One Stop Electronics

USA . 600 parts In-Stock

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$32.000

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Lixinc

USA . 11,388 parts In-Stock

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Futuretech Components

Singapore . 1,794 parts In-Stock

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Argo Parts USA

USA . 1,285 parts In-Stock

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Corphita

USA . 1,097 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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UNI Independent Distributors

Spain . 408 parts In-Stock

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Overview

Discover the unmatched quality and reliability of the S912ZVC12F0MLFR microcontroller by NXP Semiconductors, a leader in innovative semiconductor solutions. With a wide range of applications in various industries, this high-performance device offers customers value, benefits, and advantages like no other. From its advanced technology to its low power mode, this microcontroller delivers exceptional performance and efficiency, making it the perfect choice for your next project. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes the product easier to integrate onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 40 V

The high maximum supply voltage allows for flexibility in power options and compatibility with a wide range of external components.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides sufficient memory capacity for processing and storing data efficiently.

Package Shape: SQUARE

The square package shape offers a compact design, making it easier to arrange multiple microcontrollers on a circuit board and optimize space usage.

Bit Size: 16

The 16-bit architecture enables higher computational performance and precision compared to lower bit sizes, making it suitable for demanding applications.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and integration with a variety of external devices and sensors.

Minimum Supply Voltage: 3.5 V

The low minimum supply voltage ensures energy efficiency and compatibility with different power sources, reducing overall power consumption.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial and automotive applications where temperature fluctuations are common.

CPU Family: S12Z

The S12Z CPU family provides a robust and efficient processing platform for executing complex tasks and algorithms required in modern embedded systems.

Technical Specifications

Microcontrollers S912ZVC12F0MLFR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

S12Z

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C, SCI(2), SENT, SPI

Peripherals:

COMPARATOR(2), POR, RTI, TIMER(8), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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